JPS63234589A - 多層配線板 - Google Patents

多層配線板

Info

Publication number
JPS63234589A
JPS63234589A JP6808687A JP6808687A JPS63234589A JP S63234589 A JPS63234589 A JP S63234589A JP 6808687 A JP6808687 A JP 6808687A JP 6808687 A JP6808687 A JP 6808687A JP S63234589 A JPS63234589 A JP S63234589A
Authority
JP
Japan
Prior art keywords
multilayer wiring
wiring board
polyamide
formula
formulas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6808687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0370399B2 (enrdf_load_stackoverflow
Inventor
尚 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP6808687A priority Critical patent/JPS63234589A/ja
Publication of JPS63234589A publication Critical patent/JPS63234589A/ja
Publication of JPH0370399B2 publication Critical patent/JPH0370399B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP6808687A 1987-03-24 1987-03-24 多層配線板 Granted JPS63234589A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6808687A JPS63234589A (ja) 1987-03-24 1987-03-24 多層配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6808687A JPS63234589A (ja) 1987-03-24 1987-03-24 多層配線板

Publications (2)

Publication Number Publication Date
JPS63234589A true JPS63234589A (ja) 1988-09-29
JPH0370399B2 JPH0370399B2 (enrdf_load_stackoverflow) 1991-11-07

Family

ID=13363576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6808687A Granted JPS63234589A (ja) 1987-03-24 1987-03-24 多層配線板

Country Status (1)

Country Link
JP (1) JPS63234589A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06271674A (ja) * 1993-03-22 1994-09-27 Tomoegawa Paper Co Ltd シロキサン変性ポリアミドイミド樹脂および樹脂組成物
JPH06271673A (ja) * 1993-03-22 1994-09-27 Tomoegawa Paper Co Ltd シロキサン変性ポリアミドイミド樹脂および樹脂組成物
JP2003017857A (ja) * 2001-04-27 2003-01-17 Kyocera Corp 多層配線基板の製造方法
JP2003017850A (ja) * 2001-04-27 2003-01-17 Kyocera Corp 多層配線基板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06271674A (ja) * 1993-03-22 1994-09-27 Tomoegawa Paper Co Ltd シロキサン変性ポリアミドイミド樹脂および樹脂組成物
JPH06271673A (ja) * 1993-03-22 1994-09-27 Tomoegawa Paper Co Ltd シロキサン変性ポリアミドイミド樹脂および樹脂組成物
JP2003017857A (ja) * 2001-04-27 2003-01-17 Kyocera Corp 多層配線基板の製造方法
JP2003017850A (ja) * 2001-04-27 2003-01-17 Kyocera Corp 多層配線基板の製造方法

Also Published As

Publication number Publication date
JPH0370399B2 (enrdf_load_stackoverflow) 1991-11-07

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