JPS63217653A - 集積回路パツケージ - Google Patents

集積回路パツケージ

Info

Publication number
JPS63217653A
JPS63217653A JP62315457A JP31545787A JPS63217653A JP S63217653 A JPS63217653 A JP S63217653A JP 62315457 A JP62315457 A JP 62315457A JP 31545787 A JP31545787 A JP 31545787A JP S63217653 A JPS63217653 A JP S63217653A
Authority
JP
Japan
Prior art keywords
module
integrated circuit
multilayer ceramic
connector
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62315457A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0542140B2 (en, 2012
Inventor
ジヨージ・グレゴリイー・ヴアビズキイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63217653A publication Critical patent/JPS63217653A/ja
Publication of JPH0542140B2 publication Critical patent/JPH0542140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP62315457A 1987-02-25 1987-12-15 集積回路パツケージ Granted JPS63217653A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/018,633 US4814857A (en) 1987-02-25 1987-02-25 Circuit module with separate signal and power connectors
US18633 1987-02-25

Publications (2)

Publication Number Publication Date
JPS63217653A true JPS63217653A (ja) 1988-09-09
JPH0542140B2 JPH0542140B2 (en, 2012) 1993-06-25

Family

ID=21788968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62315457A Granted JPS63217653A (ja) 1987-02-25 1987-12-15 集積回路パツケージ

Country Status (4)

Country Link
US (1) US4814857A (en, 2012)
EP (1) EP0282693B1 (en, 2012)
JP (1) JPS63217653A (en, 2012)
DE (1) DE3879737T2 (en, 2012)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010038A (en) * 1989-06-29 1991-04-23 Digital Equipment Corp. Method of cooling and powering an integrated circuit chip using a compliant interposing pad
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5068715A (en) * 1990-06-29 1991-11-26 Digital Equipment Corporation High-power, high-performance integrated circuit chip package
US5487673A (en) * 1993-12-13 1996-01-30 Rockwell International Corporation Package, socket, and connector for integrated circuit
US6390475B1 (en) * 1999-08-31 2002-05-21 Intel Corporation Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die
US6570250B1 (en) * 2000-02-24 2003-05-27 Honeywell International Inc. Power conditioning substrate stiffener
US6992378B2 (en) * 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US6558169B2 (en) * 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package
US6627822B2 (en) * 2001-06-27 2003-09-30 Intel Corporation Electronic assembly with separate power and signal connections
US6575766B1 (en) * 2002-02-26 2003-06-10 Intel Corporation Laminated socket contacts
US6979208B2 (en) 2002-12-19 2005-12-27 Intel Corporation Laminated socket contacts
GB2396976A (en) * 2002-12-31 2004-07-07 Motorola Inc Assembly and method for interconnecting printed circuit boards using a PLCC socket and frame
US6969270B2 (en) * 2003-06-26 2005-11-29 Intel Corporation Integrated socket and cable connector
US6971887B1 (en) * 2004-06-24 2005-12-06 Intel Corporation Multi-portion socket and related apparatuses
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
US8708729B2 (en) * 2012-06-19 2014-04-29 Hon Hai Precision Industry Co., Ltd. Electrical connector assembly having independent loading mechanism facilitating interconnections for both CPU and cable
KR102595463B1 (ko) * 2018-02-22 2023-10-30 삼성전기주식회사 전자 부품
US11791319B2 (en) 2021-02-01 2023-10-17 Nvidia Corporation Edge-connected semiconductor systems

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5046071U (en, 2012) * 1973-08-27 1975-05-08
JPS57104247A (en) * 1980-12-22 1982-06-29 Nec Corp Terminal block with resistor
JPS6020948U (ja) * 1983-07-22 1985-02-13 株式会社東海理化電機製作所 ステアリングホイ−ルのパツド用接続線の位置決め機構
JPS6065554A (ja) * 1983-09-20 1985-04-15 Seiko Epson Corp 半導体パッケ−ジ
JPS60194345U (ja) * 1984-06-01 1985-12-24 三菱電機株式会社 半導体装置
JPS6192064U (en, 2012) * 1984-11-21 1986-06-14

Family Cites Families (30)

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Publication number Priority date Publication date Assignee Title
US2995686A (en) * 1959-03-02 1961-08-08 Sylvania Electric Prod Microelectronic circuit module
US3029495A (en) * 1959-04-06 1962-04-17 Norman J Doctor Electrical interconnection of miniaturized modules
US3107414A (en) * 1959-12-24 1963-10-22 Ibm Method of forming circuit cards
US3105868A (en) * 1960-12-29 1963-10-01 Sylvania Electric Prod Circuit packaging module
US3209208A (en) * 1961-08-14 1965-09-28 Sippican Corp Mounting assembly for modular electronic units
US3184649A (en) * 1961-08-18 1965-05-18 Texas Instruments Inc Miniature circuit assembly
US3278806A (en) * 1964-07-08 1966-10-11 Control Data Corp Pluggable memory module
US3368115A (en) * 1965-10-19 1968-02-06 Amp Inc Modular housing for integrated circuit structure with improved interconnection means
US3496283A (en) * 1968-06-25 1970-02-17 Beckman Instruments Inc Terminal construction for electrical circuit device
US3614541A (en) * 1969-04-08 1971-10-19 North American Rockwell Package for an electronic assembly
DE1919421C3 (de) * 1969-04-17 1975-03-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtleiterplatte
DE2119567C2 (de) * 1970-05-05 1983-07-14 International Computers Ltd., London Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung
US3643135A (en) * 1970-06-29 1972-02-15 Ibm Triaxially expandable circuit arrays
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US3808506A (en) * 1973-03-26 1974-04-30 J Lang Connector assembly for integrated circuit stack
NL152716B (nl) * 1973-08-08 1977-03-15 Amp Inc Elektrisch verbindingsorgaan voor het losneembaar verbinden van twee ter weerszijden daarvan te plaatsen vaste contactdragers en werkwijze voor het vervaardigen van een dergelijk elektrisch verbindingsorgaan.
US3949276A (en) * 1974-02-15 1976-04-06 Elmeg Elektro-Mechanik Gmbh Plug-in type relay
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
DE2629358C3 (de) * 1976-06-30 1980-01-24 Elmeg-Elektro-Mechanik Gmbh, 3150 Peine Anordnung mit einer Fassung zur Aufnahme elektrischer Schaltungselemente
US4076357A (en) * 1976-12-06 1978-02-28 International Business Machines Corporation Laminated programmable microstrip interconnector
US4082394A (en) * 1977-01-03 1978-04-04 International Business Machines Corporation Metallized ceramic and printed circuit module
US4103318A (en) * 1977-05-06 1978-07-25 Ford Motor Company Electronic multichip module
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
US4381131A (en) * 1981-05-04 1983-04-26 Burroughs Corporation Levered system connector for an integrated circuit package
EP0124593A4 (en) * 1982-11-05 1987-01-29 Western Electric Co MODULE MOUNTING ASSEMBLY.
US4649417A (en) * 1983-09-22 1987-03-10 International Business Machines Corporation Multiple voltage integrated circuit packaging substrate
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
US4628411A (en) * 1984-03-12 1986-12-09 International Business Machines Corporation Apparatus for directly powering a multi-chip module from a power distribution bus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5046071U (en, 2012) * 1973-08-27 1975-05-08
JPS57104247A (en) * 1980-12-22 1982-06-29 Nec Corp Terminal block with resistor
JPS6020948U (ja) * 1983-07-22 1985-02-13 株式会社東海理化電機製作所 ステアリングホイ−ルのパツド用接続線の位置決め機構
JPS6065554A (ja) * 1983-09-20 1985-04-15 Seiko Epson Corp 半導体パッケ−ジ
JPS60194345U (ja) * 1984-06-01 1985-12-24 三菱電機株式会社 半導体装置
JPS6192064U (en, 2012) * 1984-11-21 1986-06-14

Also Published As

Publication number Publication date
EP0282693A1 (en) 1988-09-21
US4814857A (en) 1989-03-21
DE3879737D1 (de) 1993-05-06
JPH0542140B2 (en, 2012) 1993-06-25
DE3879737T2 (de) 1993-10-07
EP0282693B1 (en) 1993-03-31

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