JPS6320017B2 - - Google Patents
Info
- Publication number
- JPS6320017B2 JPS6320017B2 JP57180352A JP18035282A JPS6320017B2 JP S6320017 B2 JPS6320017 B2 JP S6320017B2 JP 57180352 A JP57180352 A JP 57180352A JP 18035282 A JP18035282 A JP 18035282A JP S6320017 B2 JPS6320017 B2 JP S6320017B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- wafer
- isolation region
- recess
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W10/021—
-
- H10P90/1906—
-
- H10W10/011—
-
- H10W10/061—
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- H10W10/10—
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- H10W10/181—
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- H10W10/20—
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- H10W10/041—
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- H10W10/40—
Landscapes
- Bipolar Transistors (AREA)
- Element Separation (AREA)
- Bipolar Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57180352A JPS5969944A (ja) | 1982-10-14 | 1982-10-14 | 底面絶縁体分離集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57180352A JPS5969944A (ja) | 1982-10-14 | 1982-10-14 | 底面絶縁体分離集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5969944A JPS5969944A (ja) | 1984-04-20 |
| JPS6320017B2 true JPS6320017B2 (enExample) | 1988-04-26 |
Family
ID=16081730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57180352A Granted JPS5969944A (ja) | 1982-10-14 | 1982-10-14 | 底面絶縁体分離集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5969944A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6080243A (ja) * | 1983-10-08 | 1985-05-08 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
| JPH077797B2 (ja) * | 1984-11-14 | 1995-01-30 | 株式会社日立製作所 | 誘電体分離基体 |
| JPS61296735A (ja) * | 1985-06-25 | 1986-12-27 | Nec Corp | 半導体装置とその製造方法 |
| JPS63120437A (ja) * | 1986-11-10 | 1988-05-24 | Agency Of Ind Science & Technol | 半導体集積回路構造 |
| JPS6450555A (en) * | 1987-08-21 | 1989-02-27 | Nec Corp | Complementary mos transistor |
| JP2819582B2 (ja) * | 1989-02-06 | 1998-10-30 | 日本電気株式会社 | 半導体装置の製造方法 |
| GB9305448D0 (en) * | 1993-03-17 | 1993-05-05 | British Tech Group | Semiconductor structure and method of manufacturing same |
| JP2001226586A (ja) * | 2000-02-16 | 2001-08-21 | Hitachi Chem Co Ltd | 補強ウェハの製造方法及び電子部品 |
| JP4973328B2 (ja) * | 2007-06-14 | 2012-07-11 | 株式会社デンソー | 半導体装置 |
| US8710568B2 (en) | 2007-10-24 | 2014-04-29 | Denso Corporation | Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same |
| JP4600563B2 (ja) * | 2007-10-24 | 2010-12-15 | 株式会社デンソー | 半導体装置及びその製造方法 |
-
1982
- 1982-10-14 JP JP57180352A patent/JPS5969944A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5969944A (ja) | 1984-04-20 |
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