JPS63191429U - - Google Patents
Info
- Publication number
- JPS63191429U JPS63191429U JP8063187U JP8063187U JPS63191429U JP S63191429 U JPS63191429 U JP S63191429U JP 8063187 U JP8063187 U JP 8063187U JP 8063187 U JP8063187 U JP 8063187U JP S63191429 U JPS63191429 U JP S63191429U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic component
- soldered
- mounting mechanism
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案による電子部品の取付け機構の
実施例を示す斜視図、第２図はその側面図、第３
図はその平面図、第４図は従来例に係る電子部品
の取付け機構を示す側面図である。
１１……基板、１１ａ，１１ｃ……ランド部、
１１ｂ……穴、１２……電子部品、１２ａ……電
子部品の本体、１２ｂ，１２ｃ……端子、１３…
…被検出部、１７……リール台。
FIG. 1 is a perspective view showing an embodiment of the electronic component mounting mechanism according to the present invention, FIG. 2 is a side view thereof, and FIG.
The figure is a plan view thereof, and FIG. 4 is a side view showing a conventional electronic component mounting mechanism. 11...Substrate, 11a, 11c...Land part,
11b...hole, 12...electronic component, 12a...main body of electronic component, 12b, 12c...terminal, 13...
...Detected part, 17...Reel stand.
Claims (1)
まれた状態にて、電子部品が基板の縁部に取付け
られている電子部品の取付け機構において、電子
部品から基板表面方向に延びている端子が基板の
表面に形成された導体パターンに半田付けされ且
つ、基板裏面方向に延びている端子が基板を貫通
して基板表面側へ抜け出され、基板の表面に形成
された導体パターンに半田付けされていることを
特徴とする電子部品の取付け機構。 In an electronic component mounting mechanism in which an electronic component is attached to the edge of a board with the board sandwiched between a plurality of terminals extending from the electronic component, the terminals extending from the electronic component toward the surface of the board are A terminal that is soldered to a conductive pattern formed on the surface of the board and that extends toward the back surface of the board passes through the board and comes out to the front side of the board, and is soldered to the conductive pattern formed on the surface of the board. An electronic component mounting mechanism characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8063187U JPS63191429U (en) | 1987-05-26 | 1987-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8063187U JPS63191429U (en) | 1987-05-26 | 1987-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63191429U true JPS63191429U (en) | 1988-12-09 |
Family
ID=30931612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8063187U Pending JPS63191429U (en) | 1987-05-26 | 1987-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63191429U (en) |
-
1987
- 1987-05-26 JP JP8063187U patent/JPS63191429U/ja active Pending