JPS6318854B2 - - Google Patents
Info
- Publication number
- JPS6318854B2 JPS6318854B2 JP7174481A JP7174481A JPS6318854B2 JP S6318854 B2 JPS6318854 B2 JP S6318854B2 JP 7174481 A JP7174481 A JP 7174481A JP 7174481 A JP7174481 A JP 7174481A JP S6318854 B2 JPS6318854 B2 JP S6318854B2
- Authority
- JP
- Japan
- Prior art keywords
- multilayer chip
- parts
- dielectric
- weight
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 19
- 230000035939 shock Effects 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Inorganic Insulating Materials (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7174481A JPS57187923A (en) | 1981-05-13 | 1981-05-13 | Heat resistant impact type temperature compensating laminated chip condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7174481A JPS57187923A (en) | 1981-05-13 | 1981-05-13 | Heat resistant impact type temperature compensating laminated chip condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57187923A JPS57187923A (en) | 1982-11-18 |
| JPS6318854B2 true JPS6318854B2 (enrdf_load_html_response) | 1988-04-20 |
Family
ID=13469333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7174481A Granted JPS57187923A (en) | 1981-05-13 | 1981-05-13 | Heat resistant impact type temperature compensating laminated chip condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57187923A (enrdf_load_html_response) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6179565B2 (ja) * | 2013-11-05 | 2017-08-16 | 株式会社村田製作所 | コンデンサ、コンデンサの実装構造体及びテーピング電子部品連 |
| JP5790817B2 (ja) | 2013-11-05 | 2015-10-07 | 株式会社村田製作所 | コンデンサ、コンデンサの実装構造体及びテーピング電子部品連 |
-
1981
- 1981-05-13 JP JP7174481A patent/JPS57187923A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57187923A (en) | 1982-11-18 |
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