JPS63184357A - インサート成形部品の端子保持方法 - Google Patents

インサート成形部品の端子保持方法

Info

Publication number
JPS63184357A
JPS63184357A JP1709187A JP1709187A JPS63184357A JP S63184357 A JPS63184357 A JP S63184357A JP 1709187 A JP1709187 A JP 1709187A JP 1709187 A JP1709187 A JP 1709187A JP S63184357 A JPS63184357 A JP S63184357A
Authority
JP
Japan
Prior art keywords
terminal
thermal adhesive
molding
resin material
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1709187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468781B2 (show.php
Inventor
Wataru Goto
渡 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP1709187A priority Critical patent/JPS63184357A/ja
Publication of JPS63184357A publication Critical patent/JPS63184357A/ja
Publication of JPH0468781B2 publication Critical patent/JPH0468781B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1709187A 1987-01-26 1987-01-26 インサート成形部品の端子保持方法 Granted JPS63184357A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1709187A JPS63184357A (ja) 1987-01-26 1987-01-26 インサート成形部品の端子保持方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1709187A JPS63184357A (ja) 1987-01-26 1987-01-26 インサート成形部品の端子保持方法

Publications (2)

Publication Number Publication Date
JPS63184357A true JPS63184357A (ja) 1988-07-29
JPH0468781B2 JPH0468781B2 (show.php) 1992-11-04

Family

ID=11934318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1709187A Granted JPS63184357A (ja) 1987-01-26 1987-01-26 インサート成形部品の端子保持方法

Country Status (1)

Country Link
JP (1) JPS63184357A (show.php)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106785A (en) * 1989-01-16 1992-04-21 Siemens Aktiengesellschaft Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant
WO2000057466A1 (en) * 1999-03-22 2000-09-28 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
WO2015152364A1 (ja) * 2014-04-04 2015-10-08 アルプス電気株式会社 電子部品の製造方法
WO2025142695A1 (ja) * 2023-12-25 2025-07-03 株式会社レゾナック 接合体の製造方法、接合体、及び電気電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53143988A (en) * 1977-05-19 1978-12-14 Matsushita Electric Works Ltd Water-proofing terminal base

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53143988A (en) * 1977-05-19 1978-12-14 Matsushita Electric Works Ltd Water-proofing terminal base

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106785A (en) * 1989-01-16 1992-04-21 Siemens Aktiengesellschaft Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant
US5376824A (en) * 1989-01-16 1994-12-27 Siemens Aktiengesellschaft Method and an encapsulation for encapsulating electrical or electronic components or assemblies
WO2000057466A1 (en) * 1999-03-22 2000-09-28 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
NO20082268L (no) * 1999-03-22 2001-09-18 Rjr Polymers Inc Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av støpt plast
WO2015152364A1 (ja) * 2014-04-04 2015-10-08 アルプス電気株式会社 電子部品の製造方法
JPWO2015152364A1 (ja) * 2014-04-04 2017-04-13 アルプス電気株式会社 電子部品の製造方法
WO2025142695A1 (ja) * 2023-12-25 2025-07-03 株式会社レゾナック 接合体の製造方法、接合体、及び電気電子部品

Also Published As

Publication number Publication date
JPH0468781B2 (show.php) 1992-11-04

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