JPS6318335B2 - - Google Patents
Info
- Publication number
- JPS6318335B2 JPS6318335B2 JP54111894A JP11189479A JPS6318335B2 JP S6318335 B2 JPS6318335 B2 JP S6318335B2 JP 54111894 A JP54111894 A JP 54111894A JP 11189479 A JP11189479 A JP 11189479A JP S6318335 B2 JPS6318335 B2 JP S6318335B2
- Authority
- JP
- Japan
- Prior art keywords
- lead electrode
- semiconductor element
- opening
- film carrier
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 229910015363 Au—Sn Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11189479A JPS5636147A (en) | 1979-08-31 | 1979-08-31 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11189479A JPS5636147A (en) | 1979-08-31 | 1979-08-31 | Semiconductor device and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5636147A JPS5636147A (en) | 1981-04-09 |
| JPS6318335B2 true JPS6318335B2 (sv) | 1988-04-18 |
Family
ID=14572797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11189479A Granted JPS5636147A (en) | 1979-08-31 | 1979-08-31 | Semiconductor device and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5636147A (sv) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6331565U (sv) * | 1986-08-14 | 1988-03-01 | ||
| US4903113A (en) * | 1988-01-15 | 1990-02-20 | International Business Machines Corporation | Enhanced tab package |
| JP2682072B2 (ja) * | 1988-10-28 | 1997-11-26 | 日本電気株式会社 | 混成集積回路装置 |
| GB2292004A (en) * | 1994-07-29 | 1996-02-07 | Ibm Uk | Electronic circuit package |
| JP4529216B2 (ja) * | 2000-01-25 | 2010-08-25 | 凸版印刷株式会社 | Ｉｃカード及びその製造方法 |
-
1979
- 1979-08-31 JP JP11189479A patent/JPS5636147A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5636147A (en) | 1981-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2966300B2 (ja) | 半導体装置及びその製造方法 | |
| JP2817717B2 (ja) | 半導体装置およびその製造方法 | |
| JPH11219420A (ja) | Ｉｃカードモジュール、ｉｃカード及びそれらの製造方法 | |
| JPH11163501A (ja) | 電子部品の実装方法、およびその方法によって製造された電子回路装置 | |
| JPS6318335B2 (sv) | ||
| JP3297959B2 (ja) | 半導体装置 | |
| JPH11176849A (ja) | 半導体装置の製造方法 | |
| JPH0258257A (ja) | リード付き半導体パッケージ | |
| JP3441194B2 (ja) | 半導体装置及びその製造方法 | |
| JP3279846B2 (ja) | 半導体装置の製造方法 | |
| JP2782374B2 (ja) | 電子部品搭載装置及びその製造方法 | |
| JPS63185035A (ja) | 半導体装置 | |
| JPH0122260Y2 (sv) | ||
| JP3457748B2 (ja) | 配線基板 | |
| JP4240699B2 (ja) | リード部材 | |
| JPH0214558A (ja) | 半導体集積回路装置 | |
| JPH0878473A (ja) | 半導体装置 | |
| JPS5831420Y2 (ja) | 半導体装置 | |
| JP2828578B2 (ja) | 半導体装置 | |
| JPH02121360A (ja) | 電子部品搭載用基板 | |
| JPH05218280A (ja) | リードフレームおよびその製造方法 | |
| JPH1191272A (ja) | Ｉｃカード用モジュール | |
| JPS63107101A (ja) | 角チツプ形電子部品 | |
| JPH04144145A (ja) | 半導体装置の実装方法 | |
| JPH05235108A (ja) | フィルムキャリアテープの製造方法 |