JPS63177957A - プリント基板の搬送装置 - Google Patents

プリント基板の搬送装置

Info

Publication number
JPS63177957A
JPS63177957A JP896387A JP896387A JPS63177957A JP S63177957 A JPS63177957 A JP S63177957A JP 896387 A JP896387 A JP 896387A JP 896387 A JP896387 A JP 896387A JP S63177957 A JPS63177957 A JP S63177957A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
heat transfer
liquid
guide rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP896387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH059189B2 (enrdf_load_stackoverflow
Inventor
Kenji Kondo
近藤 権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP896387A priority Critical patent/JPS63177957A/ja
Publication of JPS63177957A publication Critical patent/JPS63177957A/ja
Publication of JPH059189B2 publication Critical patent/JPH059189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0676Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Reciprocating Conveyors (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP896387A 1987-01-20 1987-01-20 プリント基板の搬送装置 Granted JPS63177957A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP896387A JPS63177957A (ja) 1987-01-20 1987-01-20 プリント基板の搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP896387A JPS63177957A (ja) 1987-01-20 1987-01-20 プリント基板の搬送装置

Publications (2)

Publication Number Publication Date
JPS63177957A true JPS63177957A (ja) 1988-07-22
JPH059189B2 JPH059189B2 (enrdf_load_stackoverflow) 1993-02-04

Family

ID=11707328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP896387A Granted JPS63177957A (ja) 1987-01-20 1987-01-20 プリント基板の搬送装置

Country Status (1)

Country Link
JP (1) JPS63177957A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH059189B2 (enrdf_load_stackoverflow) 1993-02-04

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