JPH059189B2 - - Google Patents
Info
- Publication number
- JPH059189B2 JPH059189B2 JP896387A JP896387A JPH059189B2 JP H059189 B2 JPH059189 B2 JP H059189B2 JP 896387 A JP896387 A JP 896387A JP 896387 A JP896387 A JP 896387A JP H059189 B2 JPH059189 B2 JP H059189B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- guide rail
- heat transfer
- shaft body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 29
- 238000005476 soldering Methods 0.000 claims description 11
- 239000012808 vapor phase Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Reciprocating Conveyors (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP896387A JPS63177957A (ja) | 1987-01-20 | 1987-01-20 | プリント基板の搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP896387A JPS63177957A (ja) | 1987-01-20 | 1987-01-20 | プリント基板の搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63177957A JPS63177957A (ja) | 1988-07-22 |
JPH059189B2 true JPH059189B2 (enrdf_load_stackoverflow) | 1993-02-04 |
Family
ID=11707328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP896387A Granted JPS63177957A (ja) | 1987-01-20 | 1987-01-20 | プリント基板の搬送装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63177957A (enrdf_load_stackoverflow) |
-
1987
- 1987-01-20 JP JP896387A patent/JPS63177957A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63177957A (ja) | 1988-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10076041B2 (en) | Soldering device | |
JP5533650B2 (ja) | 自動はんだ付け装置 | |
JPH059189B2 (enrdf_load_stackoverflow) | ||
JPH059190B2 (enrdf_load_stackoverflow) | ||
US6481099B1 (en) | Circuit board manufacturing method | |
JPS62130770A (ja) | リフロ−型はんだ付け装置 | |
KR100776262B1 (ko) | 자동납땜장치 | |
CN112676828A (zh) | 一种双导热块散热模组自动组装流水线 | |
JPS62151268A (ja) | 気相式はんだ付け装置 | |
JPH0214855Y2 (enrdf_load_stackoverflow) | ||
JPH09132309A (ja) | 基板搬送装置 | |
JP2867674B2 (ja) | リフロー装置 | |
JPH1140941A (ja) | リフロー基板搬送方法とその装置 | |
JPH06244546A (ja) | リフロー装置 | |
JPH064609Y2 (ja) | 実装基板の端面洗浄装置 | |
JP2003083684A (ja) | 被加熱物搬送機構 | |
JPH024783Y2 (enrdf_load_stackoverflow) | ||
JP2004337878A (ja) | リフロ−装置およびその方法 | |
JPH083996Y2 (ja) | 自動ハンダ付け機用プリント基板搬送爪 | |
JPS61282213A (ja) | 回路基板搬送用断熱チエ−ン | |
JP2025097093A (ja) | 搬送爪及びはんだ付け装置 | |
JP2006327723A (ja) | 電気メッキ処理システム | |
JPH01172169A (ja) | 加熱炉用搬送装置 | |
JP2506416B2 (ja) | プリント板半田付け装置 | |
JPH0329006Y2 (enrdf_load_stackoverflow) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term |