JPS63158840A - 半導体基板の薄膜分解方法及び装置 - Google Patents

半導体基板の薄膜分解方法及び装置

Info

Publication number
JPS63158840A
JPS63158840A JP30536086A JP30536086A JPS63158840A JP S63158840 A JPS63158840 A JP S63158840A JP 30536086 A JP30536086 A JP 30536086A JP 30536086 A JP30536086 A JP 30536086A JP S63158840 A JPS63158840 A JP S63158840A
Authority
JP
Japan
Prior art keywords
thin film
wafer
hydrofluoric acid
semiconductor substrate
decomposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30536086A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543289B2 (cs
Inventor
Ayako Maeda
綾子 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP30536086A priority Critical patent/JPS63158840A/ja
Publication of JPS63158840A publication Critical patent/JPS63158840A/ja
Publication of JPH0543289B2 publication Critical patent/JPH0543289B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sampling And Sample Adjustment (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Weting (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
JP30536086A 1986-12-23 1986-12-23 半導体基板の薄膜分解方法及び装置 Granted JPS63158840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30536086A JPS63158840A (ja) 1986-12-23 1986-12-23 半導体基板の薄膜分解方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30536086A JPS63158840A (ja) 1986-12-23 1986-12-23 半導体基板の薄膜分解方法及び装置

Publications (2)

Publication Number Publication Date
JPS63158840A true JPS63158840A (ja) 1988-07-01
JPH0543289B2 JPH0543289B2 (cs) 1993-07-01

Family

ID=17944177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30536086A Granted JPS63158840A (ja) 1986-12-23 1986-12-23 半導体基板の薄膜分解方法及び装置

Country Status (1)

Country Link
JP (1) JPS63158840A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991012631A1 (fr) * 1990-02-19 1991-08-22 Purex Co., Ltd. Recipient pour echantillons de tranches semiconductrices et procede de preparation de tranches
WO2015182670A1 (ja) * 2014-05-30 2015-12-03 株式会社住化分析センター 分析用サンプルの回収方法およびその利用

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991012631A1 (fr) * 1990-02-19 1991-08-22 Purex Co., Ltd. Recipient pour echantillons de tranches semiconductrices et procede de preparation de tranches
WO2015182670A1 (ja) * 2014-05-30 2015-12-03 株式会社住化分析センター 分析用サンプルの回収方法およびその利用
JPWO2015182670A1 (ja) * 2014-05-30 2017-04-20 株式会社住化分析センター 分析用サンプルの回収方法およびその利用

Also Published As

Publication number Publication date
JPH0543289B2 (cs) 1993-07-01

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