JPS63155691A - 多層配線回路基板 - Google Patents

多層配線回路基板

Info

Publication number
JPS63155691A
JPS63155691A JP30352786A JP30352786A JPS63155691A JP S63155691 A JPS63155691 A JP S63155691A JP 30352786 A JP30352786 A JP 30352786A JP 30352786 A JP30352786 A JP 30352786A JP S63155691 A JPS63155691 A JP S63155691A
Authority
JP
Japan
Prior art keywords
layer
circuit board
insulating layer
multilayer wiring
wiring circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30352786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455556B2 (enrdf_load_stackoverflow
Inventor
坂野　達哉
賢司 笹岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP30352786A priority Critical patent/JPS63155691A/ja
Publication of JPS63155691A publication Critical patent/JPS63155691A/ja
Publication of JPH0455556B2 publication Critical patent/JPH0455556B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP30352786A 1986-12-18 1986-12-18 多層配線回路基板 Granted JPS63155691A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30352786A JPS63155691A (ja) 1986-12-18 1986-12-18 多層配線回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30352786A JPS63155691A (ja) 1986-12-18 1986-12-18 多層配線回路基板

Publications (2)

Publication Number Publication Date
JPS63155691A true JPS63155691A (ja) 1988-06-28
JPH0455556B2 JPH0455556B2 (enrdf_load_stackoverflow) 1992-09-03

Family

ID=17922060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30352786A Granted JPS63155691A (ja) 1986-12-18 1986-12-18 多層配線回路基板

Country Status (1)

Country Link
JP (1) JPS63155691A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0746755B2 (ja) * 1990-11-15 1995-05-17 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層薄膜構造の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196796A (ja) * 1984-10-17 1986-05-15 株式会社日立製作所 多層配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196796A (ja) * 1984-10-17 1986-05-15 株式会社日立製作所 多層配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0746755B2 (ja) * 1990-11-15 1995-05-17 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層薄膜構造の製造方法

Also Published As

Publication number Publication date
JPH0455556B2 (enrdf_load_stackoverflow) 1992-09-03

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term