JPS63154289A - 低温はんだ - Google Patents
低温はんだInfo
- Publication number
- JPS63154289A JPS63154289A JP30235386A JP30235386A JPS63154289A JP S63154289 A JPS63154289 A JP S63154289A JP 30235386 A JP30235386 A JP 30235386A JP 30235386 A JP30235386 A JP 30235386A JP S63154289 A JPS63154289 A JP S63154289A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- low
- soldering
- temperature
- temperature solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30235386A JPS63154289A (ja) | 1986-12-17 | 1986-12-17 | 低温はんだ |
| US07/061,220 US4816219A (en) | 1986-07-18 | 1987-06-12 | Low-temperature solder composition |
| DE19873720594 DE3720594A1 (de) | 1986-07-18 | 1987-06-22 | Bei tiefer temperatur einsetzbare loetmetall-zusammensetzung |
| GB8716917A GB2192898B (en) | 1986-07-18 | 1987-07-17 | Low-temperature solder composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30235386A JPS63154289A (ja) | 1986-12-17 | 1986-12-17 | 低温はんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63154289A true JPS63154289A (ja) | 1988-06-27 |
| JPH0149597B2 JPH0149597B2 (enExample) | 1989-10-25 |
Family
ID=17907891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30235386A Granted JPS63154289A (ja) | 1986-07-18 | 1986-12-17 | 低温はんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63154289A (enExample) |
-
1986
- 1986-12-17 JP JP30235386A patent/JPS63154289A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0149597B2 (enExample) | 1989-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6689488B2 (en) | Lead-free solder and solder joint | |
| JP3199674B2 (ja) | ソルダ合金 | |
| JPS5976453A (ja) | 半導体装置のリ−ド材用Cu合金クラツド材 | |
| JP3353640B2 (ja) | はんだ合金 | |
| JP3353662B2 (ja) | はんだ合金 | |
| JP3736819B2 (ja) | 無鉛はんだ合金 | |
| JPWO2015129840A1 (ja) | はんだ付け方法及び自動車用ガラス | |
| CN102500948A (zh) | 无铅高温软钎料及其制备方法 | |
| JP5408589B2 (ja) | ハンダ合金並びにその製造方法 | |
| JP2000079494A (ja) | はんだ合金 | |
| US20190118310A1 (en) | Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component | |
| US4816219A (en) | Low-temperature solder composition | |
| WO2005119755A1 (ja) | はんだ付け方法、ダイボンディング用はんだペレット、ダイボンディングはんだペレットの製造方法および電子部品 | |
| JPS6239218B2 (enExample) | ||
| JPS63154289A (ja) | 低温はんだ | |
| CN100413633C (zh) | 一种抗氧化的锡铅系合金焊料 | |
| JP4359983B2 (ja) | 電子部品の実装構造体およびその製造方法 | |
| JP2001225188A (ja) | ハンダ合金 | |
| JP2910527B2 (ja) | 高温はんだ | |
| JP3597607B2 (ja) | はんだ合金及びペ−スト状はんだ | |
| RU2041783C1 (ru) | Припой для пайки преимущественно меди и сплавов на основе меди | |
| JPH0220358B2 (enExample) | ||
| JP4673860B2 (ja) | Pb・Sbフリーはんだ合金、プリント配線基板および電子機器製品 | |
| JPH07299585A (ja) | はんだ合金 | |
| JPS60166191A (ja) | 耐疲労特性にすぐれたはんだ合金 |