JPH0149597B2 - - Google Patents
Info
- Publication number
- JPH0149597B2 JPH0149597B2 JP30235386A JP30235386A JPH0149597B2 JP H0149597 B2 JPH0149597 B2 JP H0149597B2 JP 30235386 A JP30235386 A JP 30235386A JP 30235386 A JP30235386 A JP 30235386A JP H0149597 B2 JPH0149597 B2 JP H0149597B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- temperature
- low
- base material
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30235386A JPS63154289A (ja) | 1986-12-17 | 1986-12-17 | 低温はんだ |
| US07/061,220 US4816219A (en) | 1986-07-18 | 1987-06-12 | Low-temperature solder composition |
| DE19873720594 DE3720594A1 (de) | 1986-07-18 | 1987-06-22 | Bei tiefer temperatur einsetzbare loetmetall-zusammensetzung |
| GB8716917A GB2192898B (en) | 1986-07-18 | 1987-07-17 | Low-temperature solder composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30235386A JPS63154289A (ja) | 1986-12-17 | 1986-12-17 | 低温はんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63154289A JPS63154289A (ja) | 1988-06-27 |
| JPH0149597B2 true JPH0149597B2 (enExample) | 1989-10-25 |
Family
ID=17907891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30235386A Granted JPS63154289A (ja) | 1986-07-18 | 1986-12-17 | 低温はんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63154289A (enExample) |
-
1986
- 1986-12-17 JP JP30235386A patent/JPS63154289A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63154289A (ja) | 1988-06-27 |
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