JPS63142838U - - Google Patents

Info

Publication number
JPS63142838U
JPS63142838U JP1987036127U JP3612787U JPS63142838U JP S63142838 U JPS63142838 U JP S63142838U JP 1987036127 U JP1987036127 U JP 1987036127U JP 3612787 U JP3612787 U JP 3612787U JP S63142838 U JPS63142838 U JP S63142838U
Authority
JP
Japan
Prior art keywords
wire bonding
capillary
piezo element
closing
detects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987036127U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987036127U priority Critical patent/JPS63142838U/ja
Publication of JPS63142838U publication Critical patent/JPS63142838U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は考案の実施例を示す構成図、第２図は
従来装置の構成図である。 図において、１はＵＳ電源、２はキヤピラリ、
３は下面、４はＵＳホーン、５はピエゾ素子、６
は積分器、７はコンパレータ、８はコントローラ
である。なお、各図中同一符号は同一、又は相当
部分を示す。 FIG. 1 is a block diagram showing an embodiment of the invention, and FIG. 2 is a block diagram of a conventional device. In the figure, 1 is the US power supply, 2 is the capillary,
3 is the bottom surface, 4 is the US horn, 5 is the piezo element, 6
is an integrator, 7 is a comparator, and 8 is a controller. Note that the same reference numerals in each figure indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤボンデイングの下面検知を、キヤピラリ
と半導体チツプ及びリードとの接触により機械的
なスイツチの開閉によつて下面検知をするワイヤ
ボンデイング装置において、下面検知をピエゾ素
子を用いることを特徴とするワイヤボンデイング
装置。 A wire bonding device that detects the bottom surface of wire bonding by opening and closing a mechanical switch through contact between a capillary, a semiconductor chip, and a lead, characterized in that a piezo element is used to detect the bottom surface. .
JP1987036127U 1987-03-11 1987-03-11 Pending JPS63142838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987036127U JPS63142838U (en) 1987-03-11 1987-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987036127U JPS63142838U (en) 1987-03-11 1987-03-11

Publications (1)

Publication Number Publication Date
JPS63142838U true JPS63142838U (en) 1988-09-20

Family

ID=30846243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987036127U Pending JPS63142838U (en) 1987-03-11 1987-03-11

Country Status (1)

Country Link
JP (1) JPS63142838U (en)

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