JPS63129635A - バンプ付基板 - Google Patents

バンプ付基板

Info

Publication number
JPS63129635A
JPS63129635A JP61277488A JP27748886A JPS63129635A JP S63129635 A JPS63129635 A JP S63129635A JP 61277488 A JP61277488 A JP 61277488A JP 27748886 A JP27748886 A JP 27748886A JP S63129635 A JPS63129635 A JP S63129635A
Authority
JP
Japan
Prior art keywords
bump
plating
roughness
bonding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61277488A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0478175B2 (enrdf_load_stackoverflow
Inventor
Sadayoshi Uchiyama
内山　貞佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP61277488A priority Critical patent/JPS63129635A/ja
Priority to US07/017,419 priority patent/US4786545A/en
Priority to GB8704425A priority patent/GB2187331B/en
Publication of JPS63129635A publication Critical patent/JPS63129635A/ja
Priority to GB8901825A priority patent/GB2211351B/en
Priority to SG1392A priority patent/SG1392G/en
Priority to SG1492A priority patent/SG1492G/en
Publication of JPH0478175B2 publication Critical patent/JPH0478175B2/ja
Priority to HK359/93A priority patent/HK35993A/xx
Priority to HK360/93A priority patent/HK36093A/xx
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61277488A 1986-02-28 1986-11-20 バンプ付基板 Granted JPS63129635A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP61277488A JPS63129635A (ja) 1986-11-20 1986-11-20 バンプ付基板
US07/017,419 US4786545A (en) 1986-02-28 1987-02-24 Circuit substrate and method for forming bumps on the circuit substrate
GB8704425A GB2187331B (en) 1986-02-28 1987-02-25 Method of forming an integrated circuit assembly or part thereof
GB8901825A GB2211351B (en) 1986-02-28 1989-01-27 Method of forming an integrated circuit assembly or part thereof
SG1392A SG1392G (en) 1986-02-28 1992-01-08 Method of forming an integrated circuit assembly or part thereof
SG1492A SG1492G (en) 1986-02-28 1992-01-08 Method of forming an integrated circuit assembly or part thereof
HK359/93A HK35993A (en) 1986-02-28 1993-04-15 Method of forming an integrated circuit assembly or part thereof
HK360/93A HK36093A (en) 1986-02-28 1993-04-15 Method of forming an integrated circuit assembly or part thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61277488A JPS63129635A (ja) 1986-11-20 1986-11-20 バンプ付基板

Publications (2)

Publication Number Publication Date
JPS63129635A true JPS63129635A (ja) 1988-06-02
JPH0478175B2 JPH0478175B2 (enrdf_load_stackoverflow) 1992-12-10

Family

ID=17584292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61277488A Granted JPS63129635A (ja) 1986-02-28 1986-11-20 バンプ付基板

Country Status (1)

Country Link
JP (1) JPS63129635A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997016848A1 (fr) * 1995-10-31 1997-05-09 Ibiden Co., Ltd. Module de composant electronique et son procede de fabrication
WO1999012197A1 (fr) * 1997-08-29 1999-03-11 Hitachi, Ltd. Dispositif a semi-conducteurs colle par compression et convertisseur de courant faisant appel a ce dispositif
EP1014445A1 (en) * 1998-12-24 2000-06-28 Shinko Electric Industries Co. Ltd. Carrier substrate for producing semiconductor device
JP2010087229A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
JPS55138864A (en) * 1979-04-16 1980-10-30 Sharp Corp Method of fabricating semiconductor assembling substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
JPS55138864A (en) * 1979-04-16 1980-10-30 Sharp Corp Method of fabricating semiconductor assembling substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997016848A1 (fr) * 1995-10-31 1997-05-09 Ibiden Co., Ltd. Module de composant electronique et son procede de fabrication
WO1999012197A1 (fr) * 1997-08-29 1999-03-11 Hitachi, Ltd. Dispositif a semi-conducteurs colle par compression et convertisseur de courant faisant appel a ce dispositif
EP1014445A1 (en) * 1998-12-24 2000-06-28 Shinko Electric Industries Co. Ltd. Carrier substrate for producing semiconductor device
JP2010087229A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器

Also Published As

Publication number Publication date
JPH0478175B2 (enrdf_load_stackoverflow) 1992-12-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term