JPS63118067A - スパツタリングタ−ゲツト - Google Patents
スパツタリングタ−ゲツトInfo
- Publication number
- JPS63118067A JPS63118067A JP61262045A JP26204586A JPS63118067A JP S63118067 A JPS63118067 A JP S63118067A JP 61262045 A JP61262045 A JP 61262045A JP 26204586 A JP26204586 A JP 26204586A JP S63118067 A JPS63118067 A JP S63118067A
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnetic
- phase
- sputtering
- magnetron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title abstract description 9
- 230000005291 magnetic effect Effects 0.000 claims abstract description 54
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 12
- 229910052742 iron Inorganic materials 0.000 claims abstract description 10
- 239000000470 constituent Substances 0.000 claims abstract description 6
- 238000005477 sputtering target Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 238000001755 magnetron sputter deposition Methods 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000010409 thin film Substances 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000003302 ferromagnetic material Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910020598 Co Fe Inorganic materials 0.000 description 1
- 229910002519 Co-Fe Inorganic materials 0.000 description 1
- 229910020676 Co—N Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262045A JPS63118067A (ja) | 1986-11-05 | 1986-11-05 | スパツタリングタ−ゲツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262045A JPS63118067A (ja) | 1986-11-05 | 1986-11-05 | スパツタリングタ−ゲツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63118067A true JPS63118067A (ja) | 1988-05-23 |
| JPH0551662B2 JPH0551662B2 (cg-RX-API-DMAC7.html) | 1993-08-03 |
Family
ID=17370263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61262045A Granted JPS63118067A (ja) | 1986-11-05 | 1986-11-05 | スパツタリングタ−ゲツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118067A (cg-RX-API-DMAC7.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4941920A (en) * | 1987-11-25 | 1990-07-17 | Hitachi Metals, Ltd. | Sintered target member and method of producing same |
| WO1997035043A1 (de) * | 1996-03-19 | 1997-09-25 | Balzers Aktiengesellschaft | Target, magnetronquelle mit einem solchen und verfahren zur herstellung eines solchen targets |
| JP2007059424A (ja) * | 2005-08-22 | 2007-03-08 | Showa Denko Kk | 磁性薄膜作成用ターゲット、磁気記録媒体およびその製造方法、磁気記録再生装置 |
| JP2009221608A (ja) * | 2009-07-07 | 2009-10-01 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット |
| US9653270B2 (en) | 2001-12-19 | 2017-05-16 | Jx Nippon Mining & Metals Corporation | Method for connecting magnetic substance target to backing plate, and magnetic substance target |
| CN112941473A (zh) * | 2021-01-28 | 2021-06-11 | 宁波江丰电子材料股份有限公司 | 一种MoTiNi合金靶材及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5424231A (en) * | 1977-07-25 | 1979-02-23 | Motorola Inc | Method and apparatus for magnetronnsputtering ferro magnetic materials |
-
1986
- 1986-11-05 JP JP61262045A patent/JPS63118067A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5424231A (en) * | 1977-07-25 | 1979-02-23 | Motorola Inc | Method and apparatus for magnetronnsputtering ferro magnetic materials |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4941920A (en) * | 1987-11-25 | 1990-07-17 | Hitachi Metals, Ltd. | Sintered target member and method of producing same |
| WO1997035043A1 (de) * | 1996-03-19 | 1997-09-25 | Balzers Aktiengesellschaft | Target, magnetronquelle mit einem solchen und verfahren zur herstellung eines solchen targets |
| US9653270B2 (en) | 2001-12-19 | 2017-05-16 | Jx Nippon Mining & Metals Corporation | Method for connecting magnetic substance target to backing plate, and magnetic substance target |
| JP2007059424A (ja) * | 2005-08-22 | 2007-03-08 | Showa Denko Kk | 磁性薄膜作成用ターゲット、磁気記録媒体およびその製造方法、磁気記録再生装置 |
| JP2009221608A (ja) * | 2009-07-07 | 2009-10-01 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット |
| CN112941473A (zh) * | 2021-01-28 | 2021-06-11 | 宁波江丰电子材料股份有限公司 | 一种MoTiNi合金靶材及其制备方法 |
| CN112941473B (zh) * | 2021-01-28 | 2022-06-17 | 宁波江丰电子材料股份有限公司 | 一种MoTiNi合金靶材及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0551662B2 (cg-RX-API-DMAC7.html) | 1993-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |