JPS6311776B2 - - Google Patents

Info

Publication number
JPS6311776B2
JPS6311776B2 JP8430983A JP8430983A JPS6311776B2 JP S6311776 B2 JPS6311776 B2 JP S6311776B2 JP 8430983 A JP8430983 A JP 8430983A JP 8430983 A JP8430983 A JP 8430983A JP S6311776 B2 JPS6311776 B2 JP S6311776B2
Authority
JP
Japan
Prior art keywords
suction
semiconductor wafer
light beam
angle
enclosure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8430983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59208741A (ja
Inventor
Sunao Nishioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8430983A priority Critical patent/JPS59208741A/ja
Publication of JPS59208741A publication Critical patent/JPS59208741A/ja
Publication of JPS6311776B2 publication Critical patent/JPS6311776B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP8430983A 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置 Granted JPS59208741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8430983A JPS59208741A (ja) 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8430983A JPS59208741A (ja) 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置

Publications (2)

Publication Number Publication Date
JPS59208741A JPS59208741A (ja) 1984-11-27
JPS6311776B2 true JPS6311776B2 (enrdf_load_stackoverflow) 1988-03-16

Family

ID=13826890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8430983A Granted JPS59208741A (ja) 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置

Country Status (1)

Country Link
JP (1) JPS59208741A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2554341B2 (ja) * 1987-09-28 1996-11-13 東京エレクトロン株式会社 プローブ装置
JPH0989997A (ja) * 1995-09-20 1997-04-04 Hioki Ee Corp 基板検査装置用吸引式基板固定具
US5872694A (en) * 1997-12-23 1999-02-16 Siemens Aktiengesellschaft Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
JP4795893B2 (ja) * 2006-08-22 2011-10-19 東京エレクトロン株式会社 基板検知機構および基板収容容器
JP5243139B2 (ja) * 2008-07-31 2013-07-24 株式会社ディスコ レーザ加工装置及びレーザ加工方法
JP2014033057A (ja) * 2012-08-02 2014-02-20 Murata Mfg Co Ltd 基板吸着装置
JP6789187B2 (ja) * 2017-07-07 2020-11-25 東京エレクトロン株式会社 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JPS59208741A (ja) 1984-11-27

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