JPS63117439A - 半導体記憶装置 - Google Patents

半導体記憶装置

Info

Publication number
JPS63117439A
JPS63117439A JP61264282A JP26428286A JPS63117439A JP S63117439 A JPS63117439 A JP S63117439A JP 61264282 A JP61264282 A JP 61264282A JP 26428286 A JP26428286 A JP 26428286A JP S63117439 A JPS63117439 A JP S63117439A
Authority
JP
Japan
Prior art keywords
cell array
bonding
memory device
semiconductor memory
dip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61264282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519981B2 (enrdf_load_stackoverflow
Inventor
Hitonori Hayano
早野　仁紀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61264282A priority Critical patent/JPS63117439A/ja
Publication of JPS63117439A publication Critical patent/JPS63117439A/ja
Publication of JPH0519981B2 publication Critical patent/JPH0519981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Memories (AREA)
JP61264282A 1986-11-05 1986-11-05 半導体記憶装置 Granted JPS63117439A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61264282A JPS63117439A (ja) 1986-11-05 1986-11-05 半導体記憶装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61264282A JPS63117439A (ja) 1986-11-05 1986-11-05 半導体記憶装置

Publications (2)

Publication Number Publication Date
JPS63117439A true JPS63117439A (ja) 1988-05-21
JPH0519981B2 JPH0519981B2 (enrdf_load_stackoverflow) 1993-03-18

Family

ID=17401001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61264282A Granted JPS63117439A (ja) 1986-11-05 1986-11-05 半導体記憶装置

Country Status (1)

Country Link
JP (1) JPS63117439A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250438A (ja) * 1988-08-12 1990-02-20 Hitachi Ltd 半導体記憶装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250438A (ja) * 1988-08-12 1990-02-20 Hitachi Ltd 半導体記憶装置

Also Published As

Publication number Publication date
JPH0519981B2 (enrdf_load_stackoverflow) 1993-03-18

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