JPS63111698A - 金属箔張積層板の製造法 - Google Patents

金属箔張積層板の製造法

Info

Publication number
JPS63111698A
JPS63111698A JP25923886A JP25923886A JPS63111698A JP S63111698 A JPS63111698 A JP S63111698A JP 25923886 A JP25923886 A JP 25923886A JP 25923886 A JP25923886 A JP 25923886A JP S63111698 A JPS63111698 A JP S63111698A
Authority
JP
Japan
Prior art keywords
prepreg
metal foil
shield layer
laminate
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25923886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
堯男 倉橋
喜義 大坂
剛 波田野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP25923886A priority Critical patent/JPS63111698A/ja
Publication of JPS63111698A publication Critical patent/JPS63111698A/ja
Publication of JPH0482198B2 publication Critical patent/JPH0482198B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
JP25923886A 1986-10-30 1986-10-30 金属箔張積層板の製造法 Granted JPS63111698A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25923886A JPS63111698A (ja) 1986-10-30 1986-10-30 金属箔張積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25923886A JPS63111698A (ja) 1986-10-30 1986-10-30 金属箔張積層板の製造法

Publications (2)

Publication Number Publication Date
JPS63111698A true JPS63111698A (ja) 1988-05-16
JPH0482198B2 JPH0482198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-25

Family

ID=17331324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25923886A Granted JPS63111698A (ja) 1986-10-30 1986-10-30 金属箔張積層板の製造法

Country Status (1)

Country Link
JP (1) JPS63111698A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021150609A (ja) * 2020-03-23 2021-09-27 パナソニックＩｐマネジメント株式会社 積層板の製造方法、及びプリント配線板の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50118254A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-03-04 1975-09-16
JPS5374058U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-11-24 1978-06-21
JPS56144957A (en) * 1980-04-15 1981-11-11 Matsushita Electric Works Ltd Manufacture of laminated board for multilayer printed wiring
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
JPS596861U (ja) * 1982-07-07 1984-01-17 松下電器産業株式会社 配線基板
JPS5948997A (ja) * 1982-09-14 1984-03-21 松下電工株式会社 多層板の製法
JPS59112992U (ja) * 1983-01-19 1984-07-30 パイオニア株式会社 プリント基板
JPS612393A (ja) * 1984-06-15 1986-01-08 株式会社東芝 電子回路のシ−ルド方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50118254A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-03-04 1975-09-16
JPS5374058U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-11-24 1978-06-21
JPS56144957A (en) * 1980-04-15 1981-11-11 Matsushita Electric Works Ltd Manufacture of laminated board for multilayer printed wiring
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
JPS596861U (ja) * 1982-07-07 1984-01-17 松下電器産業株式会社 配線基板
JPS5948997A (ja) * 1982-09-14 1984-03-21 松下電工株式会社 多層板の製法
JPS59112992U (ja) * 1983-01-19 1984-07-30 パイオニア株式会社 プリント基板
JPS612393A (ja) * 1984-06-15 1986-01-08 株式会社東芝 電子回路のシ−ルド方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021150609A (ja) * 2020-03-23 2021-09-27 パナソニックＩｐマネジメント株式会社 積層板の製造方法、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JPH0482198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-25

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