JPS631084A - Thermoelectric effect element - Google Patents
Thermoelectric effect elementInfo
- Publication number
- JPS631084A JPS631084A JP61145359A JP14535986A JPS631084A JP S631084 A JPS631084 A JP S631084A JP 61145359 A JP61145359 A JP 61145359A JP 14535986 A JP14535986 A JP 14535986A JP S631084 A JPS631084 A JP S631084A
- Authority
- JP
- Japan
- Prior art keywords
- effect element
- thermoelectric effect
- insulating film
- semiconductors
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005676 thermoelectric effect Effects 0.000 title claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、冷蔵庫等に用いられる熱電効果素子に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermoelectric effect element used in refrigerators and the like.
従来の技術
近年、ペルチュ効果を利用した熱電効果素子は、２枚の
絶縁板の間に、半導体をはさみ固定するという方式が採
られている。BACKGROUND OF THE INVENTION In recent years, thermoelectric effect elements utilizing the Pertsch effect have adopted a method in which a semiconductor is sandwiched and fixed between two insulating plates.
以下、図面を参照しながら、上述した従来の熱電効果素
子の一例について説明する。Hereinafter, an example of the conventional thermoelectric effect element mentioned above will be described with reference to the drawings.
第３図から第４図は、従来の熱電効果素子を示すもので
ある。第３図において、１は熱電効果素子であり電気絶
縁性のある２枚の１−程度のセラミック板２と、その間
にはさみ込まれ、はんだ３で、セラミック板２に固定さ
れたＮ型半導体４とＰ型半導体５より成り立つ。3 to 4 show conventional thermoelectric effect elements. In FIG. 3, reference numeral 1 denotes a thermoelectric effect element, which includes two electrically insulating ceramic plates 2 of about 1-20 mm, and an N-type semiconductor 4 sandwiched between them and fixed to the ceramic plates 2 with solder 3. and P-type semiconductor 5.
Ｎ型半導体４とＰ型半導体５は、交互に並べられ、ばん
だ３により、電気的に直列につながれており、また、そ
の両端には、直流電流を通すコード６が取りつけられて
いる。さらに、前記セラミック板２の上には、両面テー
プ７で取りつけられたフィン付きのヒートコンダクタ−
８があり、熱電効果素子１に直流電流が流れた場合、片
面で吸熱作用が生じ、片面で放熱作用が生ずるが、ヒー
トコンダクタ−８の作用により、吸熱と放熱の性能が、
高められる。N-type semiconductors 4 and P-type semiconductors 5 are arranged alternately and electrically connected in series by a bander 3, and a cord 6 for passing a direct current is attached to both ends thereof. Further, on the ceramic plate 2, there is a heat conductor with fins attached with double-sided tape 7.
8, and when a direct current flows through the thermoelectric effect element 1, heat absorption occurs on one side and heat radiation occurs on the other side, but due to the action of the heat conductor 8, the performance of heat absorption and heat radiation is
be enhanced.
発明が解決しようとする問題点 しかしながら、上記のような構成では、吸熱。The problem that the invention aims to solve However, in the above configuration, heat absorption occurs.
放熱性能を高めるために、ヒートコンダクタ−８を両面
テープ７等で、セラミック板２に取りつける必要があり
、強固に取りつけるためには、ネジ止めまでする必要が
あって、熱電効果素子１の生産性が極めて悪いという問
題や、セラミック板自体が高価な為、コストが高いとい
う問題を有していた。In order to improve the heat dissipation performance, it is necessary to attach the heat conductor 8 to the ceramic plate 2 with double-sided tape 7 or the like, and in order to securely attach it, it is necessary to secure it with screws, which reduces the productivity of the thermoelectric effect element 1. This has had problems such as extremely poor quality and high cost because the ceramic plate itself is expensive.
本発明は、上記問題点に鑑み、ヒートコンダクタ−８−
体型の熱電効果素子１を提供し、生産性を著しく向上す
ると同時にコストを低減するものである。In view of the above problems, the present invention provides a heat conductor-8-
The present invention provides a thermoelectric effect element 1 with a thermoelectric effect element 1 that significantly improves productivity and reduces costs at the same time.
問題点を解決するための手段
上記問題点を解決する為に本発明の熱電効果素子は、Ｎ
型半導体とＰ型半導体を、交互に電気的直列につながる
様に導電性接着剤を電気絶縁フィルム上に、パターン塗
布し、かつその電気絶縁フィルムを貼りつけた２個のフ
ィン付きヒートコンダクタ−で、はさみ込み固定したも
のである。Means for Solving the Problems In order to solve the above problems, the thermoelectric effect element of the present invention has N
A conductive adhesive is applied in a pattern onto an electrically insulating film so that type semiconductors and P-type semiconductors are alternately connected in electrical series, and the electrically insulating film is attached to two finned heat conductors. , which is fixed with scissors.
作 用
本発明は、上記した構成によって、熱電効果素子からセ
ラミック板を省き、Ｎ型半導体とＰ型半導体を電気絶縁
フィルムを貼付したフィン付ヒートコンダクタ−ではさ
み込み固定するため、簡単に作れ、極めて生産性が良い
ものであり、高価なセラミック板コストの低減もできる
。Effects of the present invention With the above-described configuration, the ceramic plate is omitted from the thermoelectric effect element, and the N-type semiconductor and the P-type semiconductor are sandwiched and fixed by a finned heat conductor to which an electrically insulating film is attached, so that it can be easily manufactured. It has extremely high productivity and can also reduce the cost of expensive ceramic plates.
実施例
以下本発明の一実施例の熱電効果素子について、図面を
参照しながら、説明する。EXAMPLE Hereinafter, a thermoelectric effect element according to an example of the present invention will be described with reference to the drawings.
第１図は、本発明の一実施例における熱電効果素子であ
る。従来例と同一構成のものについては、同一番号を符
してその詳細な説明を省略する。FIG. 1 shows a thermoelectric effect element in one embodiment of the present invention. Components having the same configuration as the conventional example are denoted by the same numbers and detailed explanation thereof will be omitted.
図において、１は熱電効果素子であり、銅、アルミ、鉄
等の金属性の２個のフィン付ヒートコンダクタ−８の間
にＮ型半導体４とＰ型半導体５をはさみ込み固定してい
る。前記ヒートコンダクタ−８の片面には、電気絶縁性
のため５０〜１００μ程度のポリエステル等の電気絶縁
フィルム９を接着してあり、電気絶縁フィルム９上には
、前記Ｎ型半導体４とＰ型半導体５を電気的に直列に接
続し、かつ薄板２に固定するだめの導電性接着剤１０が
、接着前にあらかじめ・くターン塗布しである。In the figure, 1 is a thermoelectric effect element, in which an N-type semiconductor 4 and a P-type semiconductor 5 are sandwiched and fixed between two finned heat conductors 8 made of metal such as copper, aluminum, or iron. On one side of the heat conductor 8, an electrically insulating film 9 made of polyester or the like with a thickness of approximately 50 to 100 μm is adhered for electrical insulation. A conductive adhesive 10 for electrically connecting the parts 5 in series and fixing them to the thin plate 2 is pre-applied in a pattern before bonding.
導電性接着剤９としては、通常の溶剤型や２液温合反応
型の接着剤に、カーボンや金属粉を分散させたものを用
い、塗布厚は、１ｏ○μ〜２００μ程度で良い。Ｎ型半
導体４とＰ型半導体５を、前記導電性接着剤１０を塗布
した電気絶縁フィルム９付きヒートコンダクタ−８には
さみ、数分間５０ｙ／ｄ程度の圧力を加えれば、熱電効
果素子１が作られる。As the conductive adhesive 9, an ordinary solvent type or two-component thermal reaction type adhesive with carbon or metal powder dispersed therein may be used, and the coating thickness may be about 100μ to 200μ. By sandwiching the N-type semiconductor 4 and the P-type semiconductor 5 between the heat conductor 8 with the electrically insulating film 9 coated with the conductive adhesive 10 and applying pressure of about 50 y/d for several minutes, the thermoelectric effect element 1 is activated. It will be done.
以上の様に本実施例によれば、ヒートコンダクタ−８で
、Ｎ型半導体とＰ型半導体をはさみ固定するので、セラ
ミック板を省くことができ、両面テープやネジ止めで、
セラミック板上にヒートコンダクタ−を取りつけるとい
う手間が省け、極めて生産性が優れ、また、高価なセラ
ミック板コストを低減できる。As described above, according to this embodiment, since the N-type semiconductor and the P-type semiconductor are sandwiched and fixed by the heat conductor 8, the ceramic plate can be omitted, and double-sided tape or screws can be used to fix the N-type semiconductor and P-type semiconductor.
This eliminates the trouble of attaching a heat conductor to the ceramic plate, resulting in extremely high productivity and reducing the cost of the expensive ceramic plate.
発明の効果
以上の様に本発明は、Ｎ型半導体とＰ型半導体を交互に
直列につながる様に、導電性接着剤を電気絶縁フィルム
上にパターン塗布し、かつその電気絶縁フィルムを貼り
つけた２個のフィン付ヒートコンダクタ−ではさみ込み
固定した熱電効果素子であるので、熱電効果素子の生産
性が極めて高く、また、コストの低減も図れるものであ
る。Effects of the Invention As described above, the present invention applies a pattern of conductive adhesive onto an electrically insulating film so that N-type semiconductors and P-type semiconductors are connected in series alternately, and the electrically insulating film is attached. Since the thermoelectric effect element is sandwiched and fixed between two finned heat conductors, the productivity of the thermoelectric effect element is extremely high, and costs can also be reduced.
第１図は本発明の一実施例における熱電効果素子の斜視
図、第２図は第１図のＩ−Ｉ’ 線における断面図、第
３図は従来の熱電効果素子の斜視図、第４図は第３図の
ｌｌ−ｆｆ’線における断面図である。
４・・・・・・Ｎ型半導体、５・・・・・Ｐ型半導体、
８・・・・・・ヒートコンダクタ−１９・・・・・・を
気絶縁フイ／ｌ／ム、１Ｑ・・・・・導電性接着剤。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名４−
Ｎ贋１停
デー１気地、４＆フ（ルム
Ｉθ−−一導ｔ４ｔｌ、ｔ（’１
第２図
５４Ｊ
第３図
４ ｊ ４ ５FIG. 1 is a perspective view of a thermoelectric effect element according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line II' in FIG. The figure is a sectional view taken along the line ll-ff' in FIG. 3. 4...N-type semiconductor, 5...P-type semiconductor,
8... Heat conductor - 19... Gas insulating film/l/m, 1Q... Conductive adhesive. Name of agent: Patent attorney Toshio Nakao and 1 other person 4-
N fake 1 stop day 1 kiji, 4 & fu (rum Iθ--1 lead t4tl, t('1 Fig. 2 54J Fig. 3 4 j 4 5
Claims (1)
、導電性接着剤を電気絶縁フィルム上にパターン塗布し
、かつその電気絶縁フィルムを貼りつけた２個のフィン
付きヒートコンダクターではさみ込み固定した熱電効果
素子。N-type semiconductors and P-type semiconductors are connected in series alternately by applying a pattern of conductive adhesive on an electrically insulating film, and sandwiching the electrically insulating film between two finned heat conductors. Fixed thermoelectric effect element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61145359A JPS631084A (en) | 1986-06-20 | 1986-06-20 | Thermoelectric effect element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61145359A JPS631084A (en) | 1986-06-20 | 1986-06-20 | Thermoelectric effect element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631084A true JPS631084A (en) | 1988-01-06 |
Family
ID=15383372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61145359A Pending JPS631084A (en) | 1986-06-20 | 1986-06-20 | Thermoelectric effect element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631084A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994017559A1 (en) * | 1993-01-30 | 1994-08-04 | Global Domestic Products Limited | Peltier devices |
| JPH06288658A (en) * | 1993-04-05 | 1994-10-18 | Nissin Electric Co Ltd | Heat absorption-radiation unit |
-
1986
- 1986-06-20 JP JP61145359A patent/JPS631084A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994017559A1 (en) * | 1993-01-30 | 1994-08-04 | Global Domestic Products Limited | Peltier devices |
| JPH06288658A (en) * | 1993-04-05 | 1994-10-18 | Nissin Electric Co Ltd | Heat absorption-radiation unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4648008A (en) | Mounting device for a thick layer electronic module | |
| KR970063589A (en) | Semiconductor body with adhesive material layer and method for bonding the semiconductor body | |
| JP2828335B2 (en) | Drive parts | |
| JPS631084A (en) | Thermoelectric effect element | |
| JPH06237019A (en) | Electronic heating and cooling apparatus | |
| US6370767B1 (en) | Method for fabricating an electrical apparatus | |
| JPS61240665A (en) | Semiconductor device | |
| JPS5837329A (en) | Heat recovery type pad | |
| JPS631083A (en) | Thermoelectric effect element | |
| JP3169501B2 (en) | Thermally conductive rubber members for crimp bonding of electronic and electrical equipment parts | |
| JP4091896B2 (en) | Manufacturing method of semiconductor device | |
| JPS6076179A (en) | Thermoelectric converter | |
| JPH0420269B2 (en) | ||
| JPS62125691A (en) | Electric circuit forming substrate | |
| JPH1187575A (en) | Semiconductor device | |
| JPS6112678Y2 (en) | ||
| JPH01276707A (en) | Coil cooling device, normal conducting magnet provided with same and manufacture thereof | |
| JPH0512961Y2 (en) | ||
| JPS6074462A (en) | Semiconductor device | |
| US20050146024A1 (en) | Electronics unit | |
| JPH02141262A (en) | Thermal head and production thereof | |
| JPS6062140A (en) | Resin seal type semiconductor device | |
| JPS6225440A (en) | Thermal conductive sheet for electric part | |
| JP2868030B2 (en) | Bonding tool | |
| JP2670568B2 (en) | Semiconductor device |