JP2868030B2 - Bonding tool - Google Patents
Bonding toolInfo
- Publication number
- JP2868030B2 JP2868030B2 JP15810191A JP15810191A JP2868030B2 JP 2868030 B2 JP2868030 B2 JP 2868030B2 JP 15810191 A JP15810191 A JP 15810191A JP 15810191 A JP15810191 A JP 15810191A JP 2868030 B2 JP2868030 B2 JP 2868030B2
- Authority
- JP
- Japan
- Prior art keywords
- heating
- bonding tool
- bonding
- heat generating
- generating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はボンディングツールに関
し、詳しくはＴＡＢ（テープ・オートメイテッド・ボン
ディング）方式によりリードが接合された半導体チップ
を装置基板に搭載する場合に、リードを装置基板の電極
パターンに一括して接合するボンディングツールに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding tool, and more particularly, to a method of mounting a semiconductor chip having leads joined by a TAB (Tape Automated Bonding) method on a device substrate. And a bonding tool for joining together.
【０００２】[0002]
【従来の技術】ＴＡＢ方式によりリードが接合された半
導体装置は図３に示すように半導体チップ１に銅箔より
なる多数本のリード２がボンディングされている。この
半導体装置を装置基板に搭載するには、図４に示すよう
に、ボンディングツール３に半導体チップ１を吸着保持
し、その状態でボンディングツール３を装置基板４の上
に降下させ、該装置基板４上の電極パターン５に半導体
チップ１のリード２を重ね合わせ、その上からボンディ
ングツール３で押圧すると同時に加熱して電極パターン
５とリード２を接合するのである。2. Description of the Related Art In a semiconductor device having leads joined by a TAB method, a large number of leads 2 made of copper foil are bonded to a semiconductor chip 1 as shown in FIG. In order to mount the semiconductor device on the device substrate, as shown in FIG. 4, the semiconductor chip 1 is sucked and held by the bonding tool 3, and in this state, the bonding tool 3 is lowered onto the device substrate 4, and The lead 2 of the semiconductor chip 1 is superimposed on the electrode pattern 5 on the substrate 4, and the electrode pattern 5 and the lead 2 are joined by being pressed by a bonding tool 3 and heated at the same time.
【０００３】この場合に用いるボンディングツールを図
５に示す。このボンディングツール３は、枠形をした発
熱部６と、該発熱部６の複数個所から延びた複数の平行
した電流供給用端子７とからなる加熱部材８が、該発熱
部８に電流を供給するＡ電極及びＢ電極とからなる支持
部材９にねじ10で固定されている。なお支持部材９に設
けられた孔11は半導体チップを吸着保持する真空吸引用
の孔であり、12はＡ電極とＢ電極を分離する絶縁物であ
る。FIG. 5 shows a bonding tool used in this case. The bonding tool 3 includes a heating member 8 having a frame-shaped heat generating portion 6 and a plurality of parallel current supply terminals 7 extending from a plurality of portions of the heat generating portion 6 to supply current to the heat generating portion 8. Are fixed to a supporting member 9 comprising an A electrode and a B electrode. The hole 11 provided in the support member 9 is a hole for vacuum suction for sucking and holding the semiconductor chip, and the reference numeral 12 is an insulator for separating the A electrode and the B electrode.
【０００４】[0004]
【発明が解決しようとする課題】上記従来のボンディン
グツールでは、図６（ａ）の非加熱時の状態から加熱時
になると、同図（ｂ）に示すように発熱部６が熱膨張し
て弓なりに変形してしまい、一番重要とされる圧着面６
ａの平面度が保てず、熱圧着時にリードに均一な力が加
わらなくなる。この変形は特に繰返し加熱を行なうパル
スヒート加熱方式の場合に大きい。このため全べてのリ
ードを均一に熱圧着することが不可能となりボンディン
グ品質が不良になるという問題がある。In the conventional bonding tool described above, when heating is performed from the non-heating state in FIG. 6A, the heat generating portion 6 thermally expands as shown in FIG. Crimping surface 6 which is most important
The flatness of “a” cannot be maintained, and a uniform force is not applied to the lead during thermocompression bonding. This deformation is particularly large in the case of a pulse heat heating method in which heating is repeated. For this reason, it is impossible to perform thermocompression bonding of all the leads uniformly, and there is a problem that bonding quality is deteriorated.
【０００５】本発明は、加熱による発熱部圧着面の変形
を防止し、ボンディングの信頼度を向上したボンディン
グツールを実現しようとする。An object of the present invention is to provide a bonding tool which prevents deformation of a heat-generating portion crimping surface due to heating and improves the reliability of bonding.
【０００６】[0006]
【課題を解決するための手段】本発明のボンディングツ
ールに於いては、電気抵抗を有する材料で形成された枠
形の発熱部23と該発熱部23の複数個所から放射状に設け
られた電流供給用の端子24とよりなる加熱部材20と、該
加熱部材20を支持すると共に電流を供給する一対の電極
Ａ，Ｂよりなる角柱状の支持部材22とを具備し、該支持
部材22の一端の平面部に前記加熱部材20が取付けられて
成ることを特徴とする。In a bonding tool according to the present invention, a frame-shaped heat generating portion made of a material having electric resistance and a current supply provided radially from a plurality of portions of the heat generating portion are provided. A heating member 20 comprising a heating terminal 20 and a prismatic support member 22 comprising a pair of electrodes A and B for supporting the heating member 20 and supplying an electric current. The heating member 20 is attached to a flat portion.
【０００７】また、それに加えて、上記支持部材22の加
熱部材20が取付けられた面に半導体チップを吸着保持す
る真空吸引用の孔28を設けたことを特徴とする。この構
成を採ることにより、加熱による加熱部圧着面の変形を
防止し、ボンディングの信頼度を向上したボンディング
ツールが得られる。[0007] In addition, a hole 28 for vacuum suction for sucking and holding the semiconductor chip is provided on the surface of the support member 22 on which the heating member 20 is mounted. With this configuration, it is possible to prevent the deformation of the press-bonded surface of the heating portion due to heating, and to obtain a bonding tool with improved reliability of bonding.
【０００８】[0008]
【作用】発熱部23に電流を供給する複数の端子24を該加
熱部23の複数個所から放射状に設け、支持部材22の端部
の平面上に取付けたことにより、発熱部23の発熱による
熱膨張の歪は平面方向に逃げるため、発熱部23の圧着面
23ａの平面度は維持される。従ってボンディング時には
全べてのリードを均一に押圧し装置基板の電極パターン
に圧着することが可能となる。A plurality of terminals for supplying a current to the heating portion are provided radially from a plurality of portions of the heating portion and are mounted on a flat surface of an end portion of the support member so that heat generated by the heating portion is generated. Because the expansion strain escapes in the plane direction, the crimping surface of the heating part 23
The flatness of 23a is maintained. Therefore, at the time of bonding, it is possible to uniformly press all the leads and press-bond them to the electrode patterns of the device substrate.
【０００９】[0009]
【実施例】図１及び図２は本発明の実施例を示す図であ
り、図１は組立斜視図、図２は分解斜視図である。図
１、図２において、20は加熱部材、21は断熱絶縁板、22
は支持部材である。1 and 2 show an embodiment of the present invention. FIG. 1 is an assembled perspective view, and FIG. 2 is an exploded perspective view. 1 and 2, reference numeral 20 denotes a heating member, 21 denotes a heat insulating insulating plate, 22
Is a support member.
【００１０】加熱部材20は、電気抵抗を有する材料で
（例えばFe＋42％Ni合金) で形成されており、半導体装
置の四辺のリードに当接する大きさの枠状の発熱部23
と、該発熱部23の複数個所から放射状に設けられた電流
供給用の複数の端子24とからなる。なお端子24には取付
用の孔24ａが穿設されており、また該端子24の裏面は発
熱部23の裏面（圧着面23ａの反対面）と同一平面となっ
ている。The heating member 20 is made of a material having electric resistance (for example, Fe + 42% Ni alloy), and has a frame-shaped heat generating portion 23 having a size to be in contact with the leads on four sides of the semiconductor device.
And a plurality of current supply terminals 24 provided radially from a plurality of locations of the heat generating portion 23. The terminal 24 is provided with a mounting hole 24a, and the back surface of the terminal 24 is flush with the back surface of the heat generating portion 23 (the surface opposite to the crimping surface 23a).
【００１１】支持部材22は端面が十字形をなす電極Ｂ
と、それを絶縁物25を介して取り囲んだ電極Ａ（ハッチ
ングを入れて示す）とよりなる段付の角柱状をなしてい
る。またその端面は平面状をなし、断熱絶縁板21が挿入
される凹部26と、加熱部材取付兼電気的接続用のねじ孔
27と、半導体チップ吸着用の真空吸引用孔28とが形成さ
れている。The supporting member 22 has an electrode B having a cross-shaped end face.
And an electrode A (shown with hatching) surrounding it with an insulator 25 interposed therebetween to form a stepped prismatic shape. In addition, the end face has a flat shape, and a concave portion 26 into which the heat insulating insulating plate 21 is inserted, and a screw hole for attaching a heating member and for electrical connection.
27, and a vacuum suction hole 28 for sucking a semiconductor chip are formed.
【００１２】断熱絶縁板21は加熱部材20の発熱部23の外
周と同じ大きさで、中央に真空吸引用孔29が設けられて
いる。このように形成された各部材は図１の如く組み立
てられる。即ち支持部材22の凹部26に断熱絶縁板21が挿
入され、その上から加熱部材20が載置され、その各端子
24がねじ30で締付固定される。この際各隣り合う端子は
別々の電極に取付けられるようになっている。The heat insulating insulating plate 21 has the same size as the outer periphery of the heat generating portion 23 of the heating member 20, and has a vacuum suction hole 29 in the center. The members thus formed are assembled as shown in FIG. That is, the heat insulating insulating plate 21 is inserted into the concave portion 26 of the support member 22, the heating member 20 is placed thereon,
24 is tightened and fixed with screws 30. At this time, each adjacent terminal is attached to a separate electrode.
【００１３】このように構成された本実施例は、電極
Ａ，Ｂ間に電流を流すことにより加熱部材20の発熱部23
をジュール熱により発熱させボンディングを行うことが
できる。この場合発熱部23は熱膨張するが、その歪は平
面方向に逃げるため、圧着面23ａの平面度は確保され
る。In this embodiment constructed as described above, a current is applied between the electrodes A and B so that the heating portion 23 of the heating member 20 is heated.
Is heated by Joule heat to perform bonding. In this case, the heat generating portion 23 thermally expands, but the distortion escapes in the plane direction, so that the flatness of the crimping surface 23a is secured.
【００１４】[0014]
【発明の効果】本発明によれば、発熱部と、該発熱部に
電流を供給する複数の端子よりなる加熱部材を平面的に
構成することにより、発熱による発熱部の膨張による歪
が平面方向に逃げるため、発熱部の圧着面の平面度は確
保される。これにより半導体装置のリードを基板の電極
パターンにボンディングするとき、全べてのリードを均
一に加圧することができ、従来に比してボンディング品
質を向上することができる。According to the present invention, by forming a heat generating portion and a heating member including a plurality of terminals for supplying current to the heat generating portion in a planar manner, distortion due to expansion of the heat generating portion due to heat generation is reduced in a plane direction. As a result, the flatness of the crimping surface of the heat generating portion is ensured. Thus, when bonding the leads of the semiconductor device to the electrode patterns on the substrate, all the leads can be pressed uniformly, and the bonding quality can be improved as compared with the related art.
【図１】本発明の実施例を示す組立斜視図である。FIG. 1 is an assembled perspective view showing an embodiment of the present invention.
【図２】本発明の実施例を示す分解斜視図である。FIG. 2 is an exploded perspective view showing an embodiment of the present invention.
【図３】ＴＡＢ方式によりリードが接合された半導体装
置を示す図である。FIG. 3 is a diagram showing a semiconductor device in which leads are joined by a TAB method.
【図４】図３の半導体装置を装置基板に搭載する方法を
示す図である。FIG. 4 is a diagram illustrating a method of mounting the semiconductor device of FIG. 3 on a device substrate.
【図５】従来のボンディングツールを示す図である。FIG. 5 is a view showing a conventional bonding tool.
【図６】発明が解決しようとする課題を説明するための
図で、 (ａ）は非加熱時の状態、 (ｂ）は加熱時の状態
を示す図である。FIGS. 6A and 6B are diagrams for explaining a problem to be solved by the present invention, wherein FIG. 6A is a diagram showing a state during non-heating, and FIG. 6B is a diagram showing a state during heating.
20…加熱部材 21…断熱絶縁板 22…支持部材 23…発熱部 24…端子 25…絶縁物 26…凹部 27…ねじ孔 28，29…真空吸引用孔 30…ねじ Ａ，Ｂ…電極 20 ... Heating member 21 ... Heat insulation insulating plate 22 ... Support member 23 ... Heat generating part 24 ... Terminal 25 ... Insulator 26 ... Recess 27 ... Screw hole 28,29 ... Vacuum suction hole 30 ... Screw A, B ... Electrode
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平３−270144（ＪＰ，Ａ) 特開 平２−40930（ＪＰ，Ａ) 特開 平２−18946（ＪＰ，Ａ) 特開 昭54−19657（ＪＰ，Ａ) 実開 平３−3742（ＪＰ，Ｕ) 実開 平２−4243（ＪＰ，Ｕ) 実開 平１−157426（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/60 311 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-3-270144 (JP, A) JP-A-2-40930 (JP, A) JP-A-2-18946 (JP, A) JP-A-54- 19657 (JP, A) Japanese Utility Model Hei 3-3742 (JP, U) Japanese Utility Model Hei 2-4243 (JP, U) Japanese Utility Model Utility Model 1-157426 (JP, U) (58) Fields surveyed (Int. 6 , DB name) H01L 21/60 311
Claims (2)
の発熱部（23）と該発熱部（23）の複数個所から放射状
に設けられた電流供給用の端子（24）とよりなる加熱部
材（20）と、該加熱部材（20）を支持すると共に電流を
供給する一対の電極（Ａ，Ｂ）よりなる角柱状の支持部
材（22）とを具備し、該支持部材（22）の一端の平面部
に前記加熱部材（20）が取付けられて成ることを特徴と
するボンディングツール。1. A heating system comprising: a frame-shaped heating portion (23) made of a material having electric resistance; and a current supply terminal (24) provided radially from a plurality of portions of the heating portion (23). A member (20), and a prismatic support member (22) composed of a pair of electrodes (A, B) for supporting the heating member (20) and supplying an electric current are provided. A bonding tool comprising the heating member (20) attached to a flat surface at one end.
取付けられた面に半導体チップを吸着保持する真空吸引
用の孔 (28)を設けたことを特徴とする請求項１のボン
ディングツール。2. A bonding apparatus according to claim 1, wherein a hole for vacuum suction for holding a semiconductor chip by suction is provided on a surface of said support member on which the heating member is mounted. tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15810191A JP2868030B2 (en) | 1991-06-28 | 1991-06-28 | Bonding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15810191A JP2868030B2 (en) | 1991-06-28 | 1991-06-28 | Bonding tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH056923A JPH056923A (en) | 1993-01-14 |
| JP2868030B2 true JP2868030B2 (en) | 1999-03-10 |
Family
ID=15664328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15810191A Expired - Lifetime JP2868030B2 (en) | 1991-06-28 | 1991-06-28 | Bonding tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2868030B2 (en) |
-
1991
- 1991-06-28 JP JP15810191A patent/JP2868030B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH056923A (en) | 1993-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19981110 |