JPH06237019A - Electronic heating and cooling apparatus - Google Patents
Electronic heating and cooling apparatusInfo
- Publication number
- JPH06237019A JPH06237019A JP5022866A JP2286693A JPH06237019A JP H06237019 A JPH06237019 A JP H06237019A JP 5022866 A JP5022866 A JP 5022866A JP 2286693 A JP2286693 A JP 2286693A JP H06237019 A JPH06237019 A JP H06237019A
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric element
- metal plate
- heat absorbing
- electronic heating
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims description 35
- 238000010438 heat treatment Methods 0.000 title claims description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 239000002470 thermal conductor Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 238000009833 condensation Methods 0.000 abstract description 12
- 230000005494 condensation Effects 0.000 abstract description 12
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 230000006866 deterioration Effects 0.000 abstract description 5
- 241001274961 Rubus repens Species 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱電素子を備えた電子
加熱冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic heating / cooling device having a thermoelectric element.
【０００２】[0002]
【従来の技術】従来より、電子加熱冷却装置に用いられ
る熱電素子１′は、例えば図８に示すように、Ｎ型半導
体素子３ａ及びＰ型半導体素子３ｂを金属板電極４，４
で挟持して半田溶接し、金属板電極４の一端２箇所に端
子５を設け、端子５間に電流を通電すると電流がＮ型半
導体素子３ａとＰ型半導体素子３ｂに交互に流れるよう
に上記金属板電極４，４が配列されている。また、電子
加熱冷却装置２′の防水構造としては、例えば図９に示
すように、熱電素子１′の両側に熱良導体から成る放熱
部６と吸熱部７を設け、電気的に絶縁した状態でネジ８
により熱電素子１′を放熱部６と吸熱部７との間で挟持
すると共に、放熱部６と吸熱部７との間にシリコン等の
防水材料１５を塗りつけ、この防水材料１５で熱電素子
１′の周囲を包囲して、熱電素子１′を防水材料１５に
よって密閉したものがある。2. Description of the Related Art Conventionally, as shown in FIG. 8, a thermoelectric element 1'used in an electronic heating / cooling apparatus has an N-type semiconductor element 3a and a P-type semiconductor element 3b as metal plate electrodes 4, 4, respectively.
It is sandwiched between and solder-welded, terminals 5 are provided at two ends of the metal plate electrode 4, and when a current is passed between the terminals 5, the current flows alternately to the N-type semiconductor element 3a and the P-type semiconductor element 3b. The metal plate electrodes 4 and 4 are arranged. Further, as a waterproof structure of the electronic heating / cooling device 2 ', as shown in FIG. 9, for example, a heat radiating portion 6 and a heat absorbing portion 7 made of a good heat conductor are provided on both sides of the thermoelectric element 1'in an electrically insulated state. Screw 8
The thermoelectric element 1 ′ is sandwiched between the heat radiating portion 6 and the heat absorbing portion 7, and a waterproof material 15 such as silicon is applied between the heat radiating portion 6 and the heat absorbing portion 7, and the thermoelectric element 1 ′ is covered with the waterproof material 15. There is one in which the thermoelectric element 1 ′ is surrounded by a waterproof material 15 and is surrounded.
【０００３】[0003]
【発明が解決しようとする課題】ところが、従来の金属
板電極４，４に通電して熱電素子１′及び電子加熱冷却
装置２′を動作させた時に、熱電素子１′の吸熱面１
１′或いは電子加熱冷却装置２′の吸熱部７の温度が結
露点以下に下がると熱電素子１′の吸熱面１１′或いは
電子加熱冷却装置２′の吸熱部７に結露水が付着する。
このとき、従来の電子加熱冷却装置２′には結露水が熱
電素子１′に付着しないようにするために熱電素子１′
の周囲をシリコン等の防水材料１５で包囲しているが、
防水材料１５を厚く塗りすぎると放熱部６と吸熱部７と
の間で熱的な短絡を起こし、性能が低下するおそれがあ
る。しかも、防水材料１５を塗り付けたものでは、コス
トアップを招くばかりか、電子加熱冷却装置２′を長年
使用していると、上記防水材料１５と吸熱部７との接着
面１６で冷熱剥離を起こし、これが原因で結露水が矢印
方向ａから内部に浸入することがあった。However, when the conventional metal plate electrodes 4 and 4 are energized to operate the thermoelectric element 1'and the electronic heating and cooling device 2 ', the heat absorbing surface 1 of the thermoelectric element 1'is obtained.
When the temperature of the heat absorbing part 1 of 1'or the electronic heating / cooling device 2'falls below the dew point, dew condensation water adheres to the heat absorbing surface 11 'of the thermoelectric element 1'or the heat absorbing part 7 of the electronic heating / cooling device 2'.
At this time, in the conventional electronic heating and cooling device 2 ', in order to prevent condensed water from adhering to the thermoelectric element 1', the thermoelectric element 1 '
The circumference of is surrounded by a waterproof material 15 such as silicone,
If the waterproof material 15 is applied too thickly, a thermal short circuit may occur between the heat radiating portion 6 and the heat absorbing portion 7, and the performance may deteriorate. Moreover, if the waterproof material 15 is applied, not only will the cost be increased, but also if the electronic heating / cooling device 2'is used for many years, cold and heat peeling will occur at the adhesive surface 16 between the waterproof material 15 and the heat absorbing portion 7. This caused the dew condensation water to intrude in the direction of arrow a.
【０００４】また、熱電素子１′は一般にビスマステル
ル等の主材料の両端面にニッケルメッキ処理を施し、ニ
ッケルメッキ処理された銅製の金属板電極４，４に半田
にて結合されているため、銅、ニッケル、半田（錫、
鉛）等の異種金属が直列に結合されて構成されることと
なり、これら金属に通電して使用される時に、上記のよ
うに熱電素子１′近傍に不純物を含む水分が存在する
と、素子間で電気的に短絡を起こして性能の低下をきた
すおそれがある。そのうえ、イオン化傾向の順位に従っ
て電気分解（電蝕）が始まり、その結果、ニッケル、半
田等の結合材料が溶出して、所定の電流が熱電素子１′
に流れなくなり、ついには冷却不能になるという問題も
あった。Further, since the thermoelectric element 1'is generally nickel-plated on both end surfaces of a main material such as bismuth tellurium and is joined to the nickel-plated copper metal plate electrodes 4 and 4 by soldering, Copper, nickel, solder (tin,
Different metals such as lead) are connected in series, and when these metals are energized and used, if moisture containing impurities is present in the vicinity of the thermoelectric element 1 ′ as described above, the There is a risk of causing a short circuit electrically and degrading the performance. In addition, electrolysis (electrolytic corrosion) starts according to the order of the ionization tendency, and as a result, the binding material such as nickel and solder is eluted, and a predetermined current is applied to the thermoelectric element 1 '.
There was also a problem that it could not be cooled down and finally could not be cooled.
【０００５】本発明は、上記従来の課題に鑑みてなされ
たもので、その目的とするところは、熱電素子の吸熱面
或いは電子加熱冷却装置の吸熱部に付着する結露水によ
る素子間の電気的短絡を防止できると共に半田結合面に
おける電蝕を防止でき、且つ、放熱部と吸熱部との間の
熱的な短絡を最小限に抑えて性能の低下を防止できるよ
うにした電子加熱冷却装置を提供するにある。The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to electrically connect elements by dew condensation water adhering to a heat absorbing surface of a thermoelectric element or a heat absorbing section of an electronic heating and cooling device. An electronic heating / cooling device capable of preventing a short circuit, preventing electrolytic corrosion on a solder joint surface, and minimizing a thermal short circuit between a heat radiating portion and a heat absorbing portion to prevent performance deterioration. To provide.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、請求項１記載の発明は、半導体素子３ａ，３ｂとこ
の半導体素子３ａ，３ｂを挟持する金属板電極４，４と
から成る熱電素子１を備えた電子加熱冷却装置２におい
て、上記熱電素子１の表面全体に耐湿性材料から成る被
膜９を形成したことを特徴とする。In order to solve the above-mentioned problems, the invention according to claim 1 is a thermoelectric device comprising semiconductor elements 3a and 3b and metal plate electrodes 4 and 4 for sandwiching the semiconductor elements 3a and 3b. In the electronic heating / cooling device 2 including the element 1, a coating 9 made of a moisture resistant material is formed on the entire surface of the thermoelectric element 1.
【０００７】また、請求項２記載の発明は、半導体素子
３ａ，３ｂとこの半導体素子３ａ，３ｂを挟持する金属
板電極４，４とから成る熱電素子１と、一方の金属板電
極４に設けられる放熱部６と、他方の金属板電極４に設
けられる吸熱部７と、上記放熱部６と金属板電極４との
間及び吸熱部７と金属板電極４との間に夫々介在される
電気絶縁板１０とを備え、上記熱電素子１、放熱部６、
吸熱部７及び電気絶縁板１０の表面全体に耐湿性材料か
ら成る被膜９を形成したことを特徴とする。Further, in the second aspect of the invention, the thermoelectric element 1 including the semiconductor elements 3a and 3b and the metal plate electrodes 4 and 4 for sandwiching the semiconductor elements 3a and 3b, and the one metal plate electrode 4 are provided. The heat radiating portion 6, the heat absorbing portion 7 provided on the other metal plate electrode 4, the electricity interposed between the heat radiating portion 6 and the metal plate electrode 4, and between the heat absorbing portion 7 and the metal plate electrode 4, respectively. An insulating plate 10 is provided, and the thermoelectric element 1, the heat dissipation portion 6,
A coating 9 made of a moisture resistant material is formed on the entire surfaces of the heat absorbing portion 7 and the electric insulating plate 10.
【０００８】さらに、請求項３記載の発明は、半導体素
子３ａ，３ｂとこの半導体素子３ａ，３ｂを挟持する金
属板電極４，４とから成る熱電素子１と、上記金属板電
極４，４の少なくとも一方に当接し且つ当接面１３に電
気絶縁層１４が形成された熱良導体から成る補強部材１
２とを備え、上記熱電素子１及び補強部材１２の表面全
体に耐湿性材料から成る被膜９を形成したことを特徴と
する。Further, according to the third aspect of the invention, the thermoelectric element 1 including the semiconductor elements 3a and 3b and the metal plate electrodes 4 and 4 sandwiching the semiconductor elements 3a and 3b, and the metal plate electrodes 4 and 4 are provided. Reinforcing member 1 made of a good thermal conductor that is in contact with at least one side and has an electrically insulating layer 14 on the contact surface 13.
2, and a coating 9 made of a moisture resistant material is formed on the entire surfaces of the thermoelectric element 1 and the reinforcing member 12.
【０００９】[0009]
【作用】本発明によれば、半導体素子３ａ，３ｂとこの
半導体素子３ａ，３ｂを挟持する金属板電極４，４とか
ら成る熱電素子１の表面全体に耐湿性材料から成る被膜
９を形成するようにしたので、熱電素子１及び電子加熱
冷却装置２の動作時に、熱電素子１の吸熱面１１或いは
電子加熱冷却装置２の吸熱部７の温度が結露点以下に下
がって上記吸熱面１１或いは吸熱部７に結露水が付着し
ても、この結露水による素子間の電気的短絡を上記耐湿
性材料から成る被膜９によって防ぐことができると共
に、金属板電極４，４と半導体素子３ａ，３ｂの半田結
合面における電蝕もまた上記被膜９によって防ぐことが
できる。しかも、上記被膜９は耐湿性材料であるから、
放熱部６と吸熱部７との間に従来のようなシリコン等の
防水材料を塗る必要がなくなり、放熱部６と吸熱部７で
の熱的な短絡を最小限に抑えて性能の低下を防止でき
る。According to the present invention, the coating 9 made of the moisture resistant material is formed on the entire surface of the thermoelectric element 1 including the semiconductor elements 3a and 3b and the metal plate electrodes 4 and 4 sandwiching the semiconductor elements 3a and 3b. Therefore, when the thermoelectric element 1 and the electronic heating / cooling device 2 are in operation, the temperature of the heat absorbing surface 11 of the thermoelectric element 1 or the temperature of the heat absorbing portion 7 of the electronic heating / cooling device 2 falls below the dew point and the heat absorbing surface 11 or the heat absorbing surface Even if the dew condensation water adheres to the portion 7, an electrical short circuit between the elements due to the dew condensation water can be prevented by the film 9 made of the moisture resistant material, and the metal plate electrodes 4, 4 and the semiconductor elements 3a, 3b can be prevented. Electrolytic corrosion on the solder joint surface can also be prevented by the coating 9. Moreover, since the coating 9 is a moisture resistant material,
There is no need to apply a conventional waterproof material such as silicon between the heat radiating portion 6 and the heat absorbing portion 7, and the thermal short circuit between the heat radiating portion 6 and the heat absorbing portion 7 is minimized to prevent the performance from deteriorating. it can.
【００１０】[0010]
【実施例】以下、本発明の一実施例を図面に基づいて説
明する。本発明の第１実施例に用いられる熱電素子１の
防水構造を図１乃至図３に示す。同図において、熱電素
子１は、Ｎ型半導体素子３ａとＰ型半導体素子３ｂとを
交互に複数配列し、これらを金属板電極４，４で挟持し
て半田溶接し、金属板電極４の一端２箇所に端子５を設
け、端子５間に電流を通電すると電流がＮ型半導体素子
３ａとＰ型半導体素子３ｂに交互に流れるように上記金
属板電極４，４が配列されている。また、上記一方の金
属板電極４に放熱部６を備え、他方の金属板電極４に吸
熱部７を備え、上記熱電素子１は放熱部６と吸熱部７と
の間でネジ８にて挟持固定されることにより電子加熱冷
却装置２が構成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The waterproof structure of the thermoelectric element 1 used in the first embodiment of the present invention is shown in FIGS. In the figure, the thermoelectric element 1 has a plurality of N-type semiconductor elements 3a and P-type semiconductor elements 3b alternately arranged, and these are sandwiched by metal plate electrodes 4 and 4 and solder-welded. The metal plate electrodes 4 and 4 are arranged so that the terminals 5 are provided at two locations, and when a current is passed between the terminals 5, the current flows alternately to the N-type semiconductor element 3a and the P-type semiconductor element 3b. Further, the one metal plate electrode 4 is provided with a heat radiating portion 6, the other metal plate electrode 4 is provided with a heat absorbing portion 7, and the thermoelectric element 1 is sandwiched between the heat radiating portion 6 and the heat absorbing portion 7 with a screw 8. The electronic heating / cooling device 2 is configured by being fixed.
【００１１】ここで、熱電素子１の表面全体には、図１
に示すように、耐湿性材料から成る被膜９が形成されて
いる。この耐湿性材料から成る被膜９は、例えばパラキ
シレン等の有機系材料であり、本実施例では、気化蒸着
等の方法で厚さ５μ程度に熱電素子１の表面全体に均一
に形成されている。これにより、Ｎ型半導体素子３ａ、
Ｐ型半導体素子３ｂ、金属板電極４，４の表面全体が被
膜９にて夫々覆われている。Here, the entire surface of the thermoelectric element 1 is shown in FIG.
As shown in, a coating film 9 made of a moisture resistant material is formed. The film 9 made of this moisture-resistant material is, for example, an organic material such as paraxylene, and in this embodiment, it is uniformly formed on the entire surface of the thermoelectric element 1 to a thickness of about 5 μm by a method such as vapor deposition. . As a result, the N-type semiconductor element 3a,
The entire surfaces of the P-type semiconductor element 3b and the metal plate electrodes 4 and 4 are covered with the coating film 9, respectively.
【００１２】このように、熱電素子１の表面全体を耐湿
性材料から成る被膜９で覆ったことにより、熱電素子１
及び電子加熱冷却装置２の動作時に、熱電素子１の吸熱
面１１或いは電子加熱冷却装置２の吸熱部７の温度が結
露点以下に下がって上記吸熱面１１或いは吸熱部７に結
露水が付着しても、この結露水による素子間の電気的短
絡を上記耐湿性材料から成る被膜９によって防ぐことが
できるる。また、金属板電極４，４と半導体素子３ａ，
３ｂのニッケル、半田結合面における電蝕もまた上記被
膜９によって防ぐことができる。さらに、上記被膜９は
耐湿性材料であるから、放熱部６と吸熱部７との間に従
来のようなシリコン等の防水材料を塗る必要がなくな
り、コストダウンが図られると共に、放熱部６と吸熱部
７での熱的な短絡を最小限に抑えて性能低下を極力少な
くすることができ、冷却不能などの不具合を回避でき
る。By thus covering the entire surface of the thermoelectric element 1 with the film 9 made of a moisture resistant material, the thermoelectric element 1
During operation of the electronic heating / cooling device 2, the temperature of the heat absorbing surface 11 of the thermoelectric element 1 or the heat absorbing portion 7 of the electronic heating / cooling device 2 falls below the dew point, and dew condensation water adheres to the heat absorbing surface 11 or the heat absorbing portion 7. However, the electrical short circuit between the elements due to the condensed water can be prevented by the coating film 9 made of the moisture resistant material. In addition, the metal plate electrodes 4, 4 and the semiconductor element 3a,
Electrolytic corrosion on the nickel-solder bonding surface of 3b can also be prevented by the coating 9. Further, since the film 9 is a moisture resistant material, it is not necessary to apply a conventional waterproof material such as silicon between the heat radiating portion 6 and the heat absorbing portion 7, and the cost can be reduced and the heat radiating portion 6 and It is possible to minimize thermal short-circuiting in the heat absorbing section 7 and minimize performance degradation, and avoid problems such as inability to cool.
【００１３】また、本実施例では、耐湿性材料から成る
被膜９を厚さ５μ程度の薄膜で構成したことにより、熱
膨張差による低熱剥離が生じなくなり、性能低下をより
効果的に防止できる。さらに、上記被膜９に電気絶縁性
のある耐湿性材料を用いた場合は、この被膜９と放熱部
６と吸熱部７とにより熱電素子１が電気的に絶縁される
ので、放熱部６と吸熱部７との夫々の表面を電気絶縁処
理する必要がなくなり、一層のコストダウンを図ること
ができる。Further, in this embodiment, since the coating film 9 made of the moisture resistant material is formed of a thin film having a thickness of about 5 μ, low thermal peeling due to the difference in thermal expansion does not occur, and the deterioration of performance can be prevented more effectively. Furthermore, when a moisture resistant material having electrical insulation is used for the coating 9, since the thermoelectric element 1 is electrically insulated by the coating 9, the heat radiating portion 6 and the heat absorbing portion 7, the heat radiating portion 6 and the heat absorbing portion 6 are absorbed. Since it is not necessary to electrically insulate the surfaces of the parts 7 and 7, the cost can be further reduced.
【００１４】本発明の第２実施例を図４及び図５に示
す。図５において、電子加熱冷却装置２は、Ｎ型半導体
素子３ａ及びＰ型半導体素子３ｂを金属板電極４，４で
挟持して成る熱電素子１と、少なくとも熱電素子１と接
する面が電気絶縁処理された熱良導体から成る放熱部６
及び吸熱部７と、上記放熱部６と金属板電極４との間及
び吸熱部７と金属板電極４との間に夫々介在される電気
絶縁板１０とを備えると共に、上記熱電素子１、放熱部
６、吸熱部７及び電気絶縁板１０の夫々の表面全体には
耐湿性材料から成る被膜９が形成されている。A second embodiment of the present invention is shown in FIGS. In FIG. 5, the electronic heating / cooling device 2 includes a thermoelectric element 1 formed by sandwiching an N-type semiconductor element 3a and a P-type semiconductor element 3b between metal plate electrodes 4 and 4, and at least a surface in contact with the thermoelectric element 1 is electrically insulated. Radiating part 6 made of a good thermal conductor
And a heat absorbing portion 7, an electric insulating plate 10 interposed between the heat radiating portion 6 and the metal plate electrode 4 and between the heat absorbing portion 7 and the metal plate electrode 4, respectively, and the thermoelectric element 1 A coating 9 made of a moisture resistant material is formed on the entire surface of each of the portion 6, the heat absorbing portion 7, and the electric insulating plate 10.
【００１５】ここで、上記耐湿性材料から成る被膜９
は、例えばパラキシレン等の有機系材料であり、気化蒸
着等の方法で熱電素子１、放熱部６、吸熱部７及び電気
絶縁板１０の表面全体に均一に夫々形成されており、従
って、第１実施例と同様、熱電素子１の吸熱面１１等に
付着する結露水による素子間の電気的短絡をより確実に
防止できると共に、金属板電極４，４と半導体素子３
ａ，３ｂのニッケル、半田結合面における電蝕を防止で
き、且つ、吸熱部７と放熱部６の熱的短絡を最小限に抑
えて性能低下を少なくすることができるという利点に加
えて、複数の半導体素子３ａ，３ｂを連結した状態で被
膜９を一度で形成できるようになり、従って、電子加熱
冷却装置２の製作が容易になると共に、電気絶縁板１０
を設けたことによって、放熱部６と吸熱部７の夫々の表
面を電気絶縁処理する必要がなくなり、コストダウンが
図られるという利点がある。Here, the film 9 made of the moisture resistant material
Is, for example, an organic material such as paraxylene and is uniformly formed on the entire surfaces of the thermoelectric element 1, the heat radiating portion 6, the heat absorbing portion 7 and the electric insulating plate 10 by a method such as vapor deposition and the like. Similar to the first embodiment, it is possible to more surely prevent an electrical short circuit between the elements due to the dew condensation water adhering to the heat absorbing surface 11 of the thermoelectric element 1 and the metal plate electrodes 4 and 4 and the semiconductor element 3.
In addition to the advantages that electrolytic corrosion on the nickel and solder joint surfaces of a and 3b can be prevented, and that thermal short-circuiting between the heat absorbing portion 7 and the heat radiating portion 6 can be minimized to reduce performance degradation, The coating film 9 can be formed at once with the semiconductor elements 3a and 3b connected to each other. Therefore, the electronic heating / cooling device 2 can be easily manufactured, and the electric insulating plate 10 can be formed.
By providing the above, it is not necessary to electrically insulate the surfaces of the heat radiating portion 6 and the heat absorbing portion 7, and there is an advantage that the cost can be reduced.
【００１６】本発明の第３実施例を図６に示す。同図に
おいて、電子加熱冷却装置は、Ｎ型半導体素子３ａ及び
Ｐ型半導体素子３ｂを金属板電極４，４で挟持して成る
熱電素子１と、一方の金属板電極４のみに設けられる熱
良導体から成る補強部材１２とを備え、熱電素子１及び
補強部材１２の表面全体に耐湿性材料から成る被膜９が
形成されている。補強部材１２における一方の金属板電
極４との当接面１３に電気絶縁層１４が形成され、この
電気絶縁層１４を介して補強部材１２が一方の金属板電
極４に取付けられている。ここで、上記耐湿性材料から
成る被膜９は、例えばパラキシレン等の有機系材料であ
り、気化蒸着等の方法で補強部材１２を備えた熱電素子
１の表面全体に均一に形成されており、上記補強部材１
２に吸熱部を取付け、且つ他方の金属板電極４に放熱部
を取付ることによって電子加熱冷却装置が構成される。
従って、複数の半導体素子３ａ，３ｂを連結した状態で
被膜９を形成できるようになり、電子加熱冷却装置の製
作が容易となり、さらに補強部材１２によって強度を高
めることができるという利点がある。A third embodiment of the present invention is shown in FIG. In the figure, the electronic heating / cooling device includes a thermoelectric element 1 formed by sandwiching an N-type semiconductor element 3a and a P-type semiconductor element 3b between metal plate electrodes 4 and 4, and a good thermal conductor provided only on one metal plate electrode 4. And a reinforcing member 12 made of, and a coating 9 made of a moisture resistant material is formed on the entire surfaces of the thermoelectric element 1 and the reinforcing member 12. An electric insulating layer 14 is formed on the contact surface 13 of the reinforcing member 12 with the one metal plate electrode 4, and the reinforcing member 12 is attached to the one metal plate electrode 4 via the electric insulating layer 14. Here, the film 9 made of the moisture resistant material is an organic material such as paraxylene, and is uniformly formed on the entire surface of the thermoelectric element 1 having the reinforcing member 12 by a method such as vapor deposition. The reinforcing member 1
An electronic heating and cooling device is constructed by attaching a heat absorbing portion to 2 and a heat radiating portion to the other metal plate electrode 4.
Therefore, the coating 9 can be formed in a state where the plurality of semiconductor elements 3a and 3b are connected, the electronic heating and cooling device can be easily manufactured, and the strength can be increased by the reinforcing member 12.
【００１７】さらに、本発明の第４実施例として、図７
に示すように、熱良導体から成る補強部材１２を両方の
金属板電極４，４に夫々設けて、一層の強度向上を図る
ようにしてもよい。この場合、一方の補強部材１２に放
熱部を取付け、且つ他方の補強部材１２に吸熱部を取付
けることによって電子加熱冷却装置が構成されるように
なっている。Further, as a fourth embodiment of the present invention, FIG.
As shown in, the reinforcing member 12 made of a good thermal conductor may be provided on each of the metal plate electrodes 4 and 4 to further improve the strength. In this case, an electronic heating / cooling device is configured by attaching a heat radiating portion to one reinforcing member 12 and attaching a heat absorbing portion to the other reinforcing member 12.
【００１８】[0018]
【発明の効果】上述のように請求項１記載の発明は、半
導体素子とこの半導体素子を挟持する金属板電極とから
成る熱電素子の表面全体に耐湿性材料から成る被膜を形
成したから、熱電素子の吸熱面或いは電子加熱冷却装置
の吸熱部に結露水が付着しても結露水による素子間の電
気的短絡、半田結合面における電蝕を上記耐湿性材料か
ら成る被膜によって夫々防止でき、さらに、従来のよう
な防水材料が不要となることで、放熱部と吸熱部との間
の熱的な短絡を最小限に抑えて性能の低下を防ぐことが
できると共に、コストダウンを図ることができる。As described above, according to the first aspect of the present invention, since the coating film made of the moisture resistant material is formed on the entire surface of the thermoelectric element composed of the semiconductor element and the metal plate electrodes sandwiching the semiconductor element, the thermoelectric element is formed. Even if dew condensation water adheres to the heat absorption surface of the element or the heat absorption portion of the electronic heating / cooling device, electrical short circuit between elements due to dew condensation water and electrolytic corrosion on the solder joint surface can be respectively prevented by the film made of the moisture resistant material. Since the conventional waterproof material is not required, it is possible to minimize the thermal short circuit between the heat radiating portion and the heat absorbing portion to prevent the performance from deteriorating and to reduce the cost. .
【００１９】また、請求項２記載の発明は、半導体素子
とこの半導体素子を挟持する金属板電極とから成る熱電
素子と、一方の金属板電極に設けられる放熱部と、他方
の金属板電極に設けられる吸熱部と、上記放熱部と金属
板電極との間及び吸熱部と金属板電極との間に夫々介在
される電気絶縁板とを備え、上記熱電素子、放熱部、吸
熱部及び電気絶縁板の表面全体に耐湿性材料から成る被
膜を形成したことにより、結露水による素子間の電気的
短絡の防止、半田結合面における電蝕の防止、及び熱的
短絡による性能低下の防止に加えて、複数の半導体素子
が連結された状態で被膜を形成できるので、電子加熱冷
却装置の製作が容易となり、また、電気絶縁板を設けた
ことによって放熱部及び吸熱部の夫々の表面を電気絶縁
処理する必要がなくなり、一層のコストダウンを図るこ
とができる。Further, according to the second aspect of the present invention, a thermoelectric element including a semiconductor element and a metal plate electrode sandwiching the semiconductor element, a heat dissipation portion provided on one metal plate electrode, and the other metal plate electrode are provided. The thermoelectric element, the heat radiating portion, the heat absorbing portion, and the electrical insulation, which are provided with a heat absorbing portion provided and an electric insulating plate interposed between the heat radiating portion and the metal plate electrode and between the heat absorbing portion and the metal plate electrode, respectively. By forming a film made of moisture resistant material on the entire surface of the plate, in addition to preventing electrical short circuit between elements due to dew condensation water, preventing electrolytic corrosion on the solder joint surface, and preventing performance deterioration due to thermal short circuit Since the coating can be formed in the state where a plurality of semiconductor elements are connected, the electronic heating / cooling device can be easily manufactured, and the surface of each of the heat radiating portion and the heat absorbing portion is electrically insulated by providing the electric insulating plate. I need to It, it is possible to further reduce costs.
【００２０】さらに、請求項３記載の発明は、半導体素
子とこの半導体素子を挟持する金属板電極とから成る熱
電素子と、上記金属板電極の少なくとも一方に当接し且
つ当接面に電気絶縁層が形成された熱良導体から成る補
強部材とを備え、上記熱電素子及び補強部材の表面全体
に耐湿性材料から成る被膜を形成したことにより、結露
水による素子間の電気的短絡の防止、半田結合面におけ
る電蝕の防止、及び熱的短絡による性能低下の防止に加
えて、複数の半導体素子が連結された状態で被膜を形成
して、電子加熱冷却装置の製作が容易となり、また、補
強部材を設けたことによって強度に強い構造とすること
ができる。Further, according to the invention of claim 3, a thermoelectric element composed of a semiconductor element and a metal plate electrode sandwiching the semiconductor element, and at least one of the metal plate electrodes is in contact with the contact surface, and an electrically insulating layer is provided on the contact surface. And a reinforcing member made of a good thermal conductor formed thereon, and by forming a coating film made of a moisture resistant material on the entire surface of the thermoelectric element and the reinforcing member, preventing electrical short circuit between elements due to dew condensation water, soldering In addition to preventing electrolytic corrosion on the surface and preventing performance deterioration due to a thermal short circuit, a coating is formed in a state in which a plurality of semiconductor elements are connected to each other, facilitating the manufacture of an electronic heating and cooling device, and a reinforcing member. By providing the structure, it is possible to make the structure strong in strength.
【図１】本発明の第１実施例に用いられる熱電素子の正
面図である。FIG. 1 is a front view of a thermoelectric element used in a first embodiment of the present invention.
【図２】同上の熱電素子を備えた電子加熱冷却装置の正
面図である。FIG. 2 is a front view of an electronic heating / cooling apparatus including the thermoelectric element of the above.
【図３】同上の電子加熱冷却装置の分解斜視図である。FIG. 3 is an exploded perspective view of the above electronic heating and cooling device.
【図４】本発明の第２実施例に用いられる電子加熱冷却
装置の分解斜視図である。FIG. 4 is an exploded perspective view of an electronic heating and cooling device used in a second embodiment of the present invention.
【図５】同上の正面図である。FIG. 5 is a front view of the above.
【図６】本発明の第３実施例に用いられる補強部材を備
えた熱電素子の正面断面図である。FIG. 6 is a front sectional view of a thermoelectric element including a reinforcing member used in a third embodiment of the present invention.
【図７】本発明の第４実施例に用いられる補強部材を備
えた熱電素子の正面断面図である。FIG. 7 is a front sectional view of a thermoelectric element having a reinforcing member used in a fourth embodiment of the present invention.
【図８】従来の熱電素子の斜視図である。FIG. 8 is a perspective view of a conventional thermoelectric element.
【図９】従来の熱電素子を備えた電子加熱冷却装置の正
面断面図である。FIG. 9 is a front sectional view of an electronic heating / cooling device including a conventional thermoelectric element.
１ 熱電素子 ２ 電子加熱冷却装置 ３ａ Ｎ型半導体素子 ３ｂ Ｐ型半導体素子 ４ 金属板電極 ６ 放熱部 ７ 吸熱部 ９ 被膜 10 電気絶縁板 12 補強部材 13 当接面 14 電気絶縁層 DESCRIPTION OF SYMBOLS 1 Thermoelectric element 2 Electronic heating / cooling device 3a N-type semiconductor element 3b P-type semiconductor element 4 Metal plate electrode 6 Heat dissipation part 7 Endothermic part 9 Coating 10 Electric insulating plate 12 Reinforcing member 13 Contact surface 14 Electric insulating layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中山 俊一 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 山田 正信 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Shunichi Nakayama 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Masanobu Yamada, 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works Co., Ltd.
Claims (3)
金属板電極とから成る熱電素子を備えた電子加熱冷却装
置において、上記熱電素子の表面全体に耐湿性材料から
成る被膜を形成したことを特徴とする電子加熱冷却装
置。1. An electronic heating / cooling device comprising a thermoelectric element comprising a semiconductor element and a metal plate electrode sandwiching the semiconductor element, wherein a film made of a moisture resistant material is formed on the entire surface of the thermoelectric element. Electronic heating and cooling device.
金属板電極とから成る熱電素子と、一方の金属板電極に
設けられる放熱部と、他方の金属板電極に設けられる吸
熱部と、上記放熱部と金属板電極との間及び吸熱部と金
属板電極との間に夫々介在される電気絶縁板とを備え、
上記熱電素子、放熱部、吸熱部及び電気絶縁板の表面全
体に耐湿性材料から成る被膜を形成したことを特徴とす
る電子加熱冷却装置。2. A thermoelectric element comprising a semiconductor element and a metal plate electrode sandwiching the semiconductor element, a heat radiating portion provided on one metal plate electrode, a heat absorbing portion provided on the other metal plate electrode, and the heat radiation. And an electric insulating plate interposed between the heat absorbing part and the metal plate electrode, respectively,
An electronic heating and cooling device, wherein a film made of a moisture resistant material is formed on the entire surfaces of the thermoelectric element, the heat radiating portion, the heat absorbing portion and the electric insulating plate.
金属板電極とから成る熱電素子と、上記金属板電極の少
なくとも一方に当接し且つ当接面に電気絶縁層が形成さ
れた熱良導体から成る補強部材とを備え、上記熱電素子
及び補強部材の表面全体に耐湿性材料から成る被膜を形
成したことを特徴とする電子加熱冷却装置。3. A thermoelectric element comprising a semiconductor element and a metal plate electrode sandwiching the semiconductor element, and a good thermal conductor that is in contact with at least one of the metal plate electrodes and has an electrically insulating layer formed on the contact surface. An electronic heating and cooling device comprising: a reinforcing member, wherein a coating film made of a moisture resistant material is formed on the entire surfaces of the thermoelectric element and the reinforcing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02286693A JP3400479B2 (en) | 1993-02-10 | 1993-02-10 | Electronic heating and cooling equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02286693A JP3400479B2 (en) | 1993-02-10 | 1993-02-10 | Electronic heating and cooling equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06237019A true JPH06237019A (en) | 1994-08-23 |
| JP3400479B2 JP3400479B2 (en) | 2003-04-28 |
Family
ID=12094630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02286693A Expired - Fee Related JP3400479B2 (en) | 1993-02-10 | 1993-02-10 | Electronic heating and cooling equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3400479B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06288658A (en) * | 1993-04-05 | 1994-10-18 | Nissin Electric Co Ltd | Heat absorption-radiation unit |
| JPH07307495A (en) * | 1994-05-12 | 1995-11-21 | Matsushita Electric Ind Co Ltd | Peltier element |
| US6252154B1 (en) * | 1998-11-25 | 2001-06-26 | Matsushita Electric Works, Ltd. | Thermoelectric module |
| KR100320761B1 (en) * | 1997-08-25 | 2002-01-18 | 하루타 히로시 | Thermoelectric device |
| KR100320760B1 (en) * | 1997-08-01 | 2002-01-18 | 하루타 히로시 | Thermoelectric element and method for manufacturing the same |
| WO2006006884A1 (en) * | 2004-07-08 | 2006-01-19 | Gennadiy Gusamovich Gromov | Thermoelectric module |
| JP2007123530A (en) * | 2005-10-27 | 2007-05-17 | Denso Corp | Thermoelectric conversion device and manufacturing method thereof |
| JP2012523110A (en) * | 2009-04-02 | 2012-09-27 | ビーエーエスエフ ソシエタス・ヨーロピア | Thermoelectric material coated with protective layer |
| WO2014116145A1 (en) * | 2013-01-28 | 2014-07-31 | Открытое Акционерное Общество "Автоштамп" | Thermoelectric module (variants) |
| JP2020167800A (en) * | 2019-03-28 | 2020-10-08 | 三井化学株式会社 | Thermoelectric conversion device |
| JP6822609B1 (en) * | 2019-10-24 | 2021-01-27 | 三菱電機株式会社 | Thermoelectric conversion element module and manufacturing method of thermoelectric conversion element module |
-
1993
- 1993-02-10 JP JP02286693A patent/JP3400479B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06288658A (en) * | 1993-04-05 | 1994-10-18 | Nissin Electric Co Ltd | Heat absorption-radiation unit |
| JPH07307495A (en) * | 1994-05-12 | 1995-11-21 | Matsushita Electric Ind Co Ltd | Peltier element |
| KR100320760B1 (en) * | 1997-08-01 | 2002-01-18 | 하루타 히로시 | Thermoelectric element and method for manufacturing the same |
| KR100320761B1 (en) * | 1997-08-25 | 2002-01-18 | 하루타 히로시 | Thermoelectric device |
| DE19946700B4 (en) * | 1998-11-25 | 2007-12-06 | Matsushita Electric Works, Ltd., Kadoma | Thermoelectric modules and method for their production |
| US6252154B1 (en) * | 1998-11-25 | 2001-06-26 | Matsushita Electric Works, Ltd. | Thermoelectric module |
| WO2006006884A1 (en) * | 2004-07-08 | 2006-01-19 | Gennadiy Gusamovich Gromov | Thermoelectric module |
| JP2007123530A (en) * | 2005-10-27 | 2007-05-17 | Denso Corp | Thermoelectric conversion device and manufacturing method thereof |
| JP2012523110A (en) * | 2009-04-02 | 2012-09-27 | ビーエーエスエフ ソシエタス・ヨーロピア | Thermoelectric material coated with protective layer |
| WO2014116145A1 (en) * | 2013-01-28 | 2014-07-31 | Открытое Акционерное Общество "Автоштамп" | Thermoelectric module (variants) |
| RU2537096C2 (en) * | 2013-01-28 | 2014-12-27 | Открытое Акционерное Общество "Автоштамп" | Thermoelectric module (versions) |
| CN105556689A (en) * | 2013-01-28 | 2016-05-04 | 阿弗托什塔姆普股份公司 | Thermoelectric module (variants) |
| CN105556689B (en) * | 2013-01-28 | 2018-06-22 | 阿弗托什塔姆普股份公司 | Electrothermal module |
| JP2020167800A (en) * | 2019-03-28 | 2020-10-08 | 三井化学株式会社 | Thermoelectric conversion device |
| JP6822609B1 (en) * | 2019-10-24 | 2021-01-27 | 三菱電機株式会社 | Thermoelectric conversion element module and manufacturing method of thermoelectric conversion element module |
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| Publication number | Publication date |
|---|---|
| JP3400479B2 (en) | 2003-04-28 |
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