JPS5837329A - Heat recovery type pad - Google Patents
Heat recovery type padInfo
- Publication number
- JPS5837329A JPS5837329A JP56135879A JP13587981A JPS5837329A JP S5837329 A JPS5837329 A JP S5837329A JP 56135879 A JP56135879 A JP 56135879A JP 13587981 A JP13587981 A JP 13587981A JP S5837329 A JPS5837329 A JP S5837329A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- back metal
- frame
- fitted
- heat recovery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011084 recovery Methods 0.000 title claims description 5
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 230000005678 Seebeck effect Effects 0.000 claims abstract description 4
- 239000012779 reinforcing material Substances 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 5
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000007767 bonding agent Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910016272 Bi2 Te3 Inorganic materials 0.000 description 1
- 229910005900 GeTe Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D61/00—Brakes with means for making the energy absorbed available for use
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Braking Arrangements (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、ディスクブレーキの熱回収型パッドに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat recovery type pad for a disc brake.
ディスクブレーキのパッドは、ブレーキ制動時に高温の
摩擦熱を受けてその温度が大きく上昇する。耐摩耗性を
考慮したセミメタリックパッドやメタリックパッドの温
度上昇は特に著しいが、従来、その熱を回収して利用す
るパッドは見られず、伝達された熟は全て外部に放散さ
れている。Disc brake pads receive high-temperature frictional heat during braking, causing their temperature to rise significantly. The temperature rise in semi-metallic pads and metallic pads designed with wear resistance in mind is particularly remarkable, but until now there has been no pad that recovers and utilizes that heat, and all of the transferred heat is dissipated to the outside.
この発明の目的は、−エネルギーの有効利用に鑑み、伝
達された摩擦熱を電気に変換して利用するようにしたパ
ッドを提供することにある。An object of the present invention is to provide a pad that converts transferred frictional heat into electricity and utilizes it in view of effective use of energy.
以下、この発明の構成を添付図面に基いて説明する。Hereinafter, the configuration of the present invention will be explained based on the accompanying drawings.
この発明のパッドは、ゼーベック効果の得られる熱電子
素子を用いて裏金に伝達された摩擦熱を電気に変換する
ようにしたものであって、具体的には、第１図に示すよ
うに、金属間化合物半導体によって形成されるＰ型素子
１とｎ型素子２を銅板等の導体３を用いて接続した素子
モジュール４を製作し、このモジュールを導体３′を用
いて多数直列に繋いでユニット化したものを第２図に示
すように学識膜等１１．ＩＴで電気的に絶縁されたパッ
ド裏金１０の後面に取付けである。なお、素子モジュー
ルは並列に繋いで（図示せず）も構わない。また、取付
けた素子ユニットは、第３図に示すよう；＝、裏金１０
に溶接或いはビス止めする等して、固着した枠１２とこ
の枠に取付けた裏金とはゾ相似形の保護板１Ｂで覆って
保護され、さらに、各素子１，２の間に生じた隙間に、
例えばエポキシレジン等の熱硬化性樹脂にガラス繊維や
アスベストを混入したもの或いは発泡性樹脂等の断熱性
に優れた絶縁補強材１４で補強されている。The pad of the present invention converts frictional heat transferred to the back metal into electricity using a thermionic element capable of obtaining the Seebeck effect. Specifically, as shown in FIG. An element module 4 is manufactured by connecting a P-type element 1 and an N-type element 2 formed of intermetallic compound semiconductors using a conductor 3 such as a copper plate, and a large number of these modules are connected in series using a conductor 3' to form a unit. 11. It is attached to the rear surface of the pad back metal 10 which is electrically insulated by IT. Note that the element modules may be connected in parallel (not shown). In addition, the attached element unit is as shown in FIG.
The fixed frame 12 and the back metal attached to this frame are covered and protected by a protective plate 1B having a similar shape, and the gap created between each element 1 and 2 is further protected by welding or screwing. ,
For example, it is reinforced with an insulating reinforcing material 14 having excellent heat insulation properties, such as a thermosetting resin such as epoxy resin mixed with glass fiber or asbestos, or a foamed resin.
上記素子モジュール４を構成するＰ型素子１の化合物半
導体としては、例えばＢｉ２ Ｔｅ３． ＧｅＴｅ、
Ｚｎ５ｂ等が用いられ、一方、ｎ型素子２にはＰｂＴ
ｅ等が用いられる。ここで、素子１及び２は、長さが長
い程両端間における温度差が大きくなって大きな起電力
が得られるが、パッドを装着する際のスペース的問題が
あるので、長さを７〜１０閣程度とし、径も製作の容易
性を４えて５〜６ｍｍ程度とするのが望ましい。The compound semiconductor of the P-type element 1 constituting the element module 4 is, for example, Bi2 Te3. GeTe,
Zn5b etc. are used, while PbT is used for the n-type element 2.
e etc. are used. Here, the longer the length of elements 1 and 2, the larger the temperature difference between both ends, and the larger the electromotive force can be obtained. However, there is a space problem when attaching the pad, so the length is set to 7 to 10 mm. It is desirable that the diameter be about 5 to 6 mm, considering the ease of production.
また、各素子１．２と導体３．３との接合は、高温ｌこ
耐えるよう、不活性ガスの雰囲気中で行うのがよ（、そ
の際使用する接合剤としては、耐熱特性に優れたステン
ろう、銀ろう等が挙げられる。In addition, it is recommended that the bonding between each element 1.2 and the conductor 3.3 be performed in an inert gas atmosphere to withstand high temperatures (the bonding agent used in this case should be a bonding agent with excellent heat resistance properties). Examples include stainless steel wax and silver wax.
なお、第２図における１５．１５’は、素子ユニットの
両端番ζ接続したリード線を示し、このリード線は例え
ば車の蓄電池に接続される。Note that 15 and 15' in FIG. 2 indicate lead wires connected to both ends of the element unit, and this lead wire is connected to, for example, a storage battery of a car.
以上の構成としたこの発明のパッドにおいて、熱電子素
子の１個当りの熱起電能α、固有抵抗ρは以下の数値で
表わせる。即ち、
α＝ ２５０ ｌｌＶ／ｄｅｇ
、ρ＝ＩＸ１０ ９ｃｍ
ここで、電力１’＝Ｖ１−Ｖ２／Ｒであるから、Ｐ・ｎ
素子１．２の断面積をそれぞれＩＣ４とし、第３図にお
ける素子の長さｊを１０１１として上式に先の数字を代
入すると、１個の素子モジュール（素子１対）から得ら
れる電力は、
Ｐ＝ （（５Ｘ１０”）Ｘｉ Ｏ’）”／２Ｘ１０”＝
１．２５ ×１０−’ Ｗ／ｄｅｇとなり、このとき
の電圧は５×１０−４■である。In the pad of the present invention having the above configuration, the thermoelectromotive power α and specific resistance ρ per thermionic element can be expressed by the following numerical values. That is, α = 250 llV/deg, ρ = IX10 9cm Here, since power 1' = V1 - V2/R, P・n
If the cross-sectional areas of elements 1 and 2 are respectively IC4 and the length j of the element in FIG. P= ((5X10")Xi O')"/2X10"=
The voltage is 1.25 x 10-' W/deg, and the voltage at this time is 5 x 10-4.
なお、上記の寸法に合わせた熱電子素子のモジュール１
００組をセミメタリックパッドに取付けて実験を行った
ところ、１．．３ Ｗ近い電力が得られ、その際の電圧
は５■強であった。このときの電力計算式は
Ｐ＝１．２５Ｘ１０””’ＸΔＴ（温度差）ＸＮ（素子
の対数）であるので、上記の結果から逆算すると、第３
図１間における温度差ΔＴは１００℃以上あり、従って
、この発明のパッドによれば、摩擦熱が有効に利用され
るだけでなく、ブレーキピストンに伝わる熱が各素子と
その補強材によって遮断され、ピストンの作動液の温度
上昇も効果的に防止されることがわかる。In addition, module 1 of thermionic element according to the above dimensions
When we conducted an experiment by attaching 00 pairs to a semi-metallic pad, we found that: 1. ．． A power of nearly 3 W was obtained, and the voltage at that time was a little over 5 ■. The power calculation formula at this time is P = 1.25X10""'XΔT (temperature difference)
The temperature difference ΔT between FIGS. , it can be seen that the temperature rise of the hydraulic fluid in the piston is also effectively prevented.
第１図は、この発明のパッドに使用する熱電子素子のモ
ジュールを示す斜視図、第２図はこの発明のパッドを示
す背面図、第３図は同上の一部破断平面図である。
１・・・Ｐ型素子、２・・・ｎ型素子、３，３・・・導
体、１０・・・パッド裏金、１２・・・枠、１３・・・
保護板、１４・・・補強材、１５．１５・・・リード線
第１図
第２図
第３図
１
手続補正書（睦）
１．事件の表示
昭和５６年特許願第１３５８７鴫
２、 発明の名称
熱回収型パッド
３、補正をする者
事件との関係 特許出願人
住所 大阪市東区北浜５丁目１５番地氏名格祢）（２
１３）住友電気工業株式会社４、代理人
５゜
昭和 年 月 日 （発送日
）別紙の通り
補正の内容
１、 明細書の特許請求の範囲を別紙の通シ補正します
。
２ 明細書３頁、１０行目「化合物半導体」を「金属間
化合物半導体」に補正します。
特許請求の範囲
ゼーベック効果の大きい金属間化合物半導体から成るｐ
−ｎ素子を電気的に接続して熱電子素子モジュールを形
成し、この素子モジュールを多数直列又は並列に繋いだ
ユニットをパッド裏金の後面に取付け、さらに、上記素
子ユニットを裏金に固着した枠とこの枠に取付けた裏金
とは５゛相似形の保護板で覆うと共に各素子間に生じる
隙間を断熱性の良好な補強材で埋めて補強し、各熱電素
子モジュールにより発電された電力を素子ユニットの両
端に接続したリード線より取出すようにした熱回収型パ
ッド。FIG. 1 is a perspective view of a thermionic element module used in the pad of the present invention, FIG. 2 is a rear view of the pad of the present invention, and FIG. 3 is a partially cutaway plan view of the same. DESCRIPTION OF SYMBOLS 1... P type element, 2... N type element, 3, 3... Conductor, 10... Pad back metal, 12... Frame, 13...
Protective plate, 14... Reinforcement material, 15. 15... Lead wire Figure 1 Figure 2 Figure 3 Figure 1 Procedural amendment (Mutsu) 1. Display of the case 1982 Patent Application No. 13587 Shizu 2, Name of the invention Heat recovery type pad 3, Relationship with the case Patent applicant address 5-15 Kitahama, Higashi-ku, Osaka Name Kakune) (2)
13) Sumitomo Electric Industries, Ltd. 4, Agent 5゜Showa Year, Month, Day (Delivery date) Contents of amendment as shown in the attached sheet 1. The scope of claims in the specification will be amended in the attached sheet. 2 "Compound semiconductor" on page 3, line 10 of the specification will be corrected to "intermetallic compound semiconductor." ClaimsP made of an intermetallic compound semiconductor with a large Seebeck effect
- n elements are electrically connected to form a thermionic element module, a unit in which a large number of these element modules are connected in series or in parallel is attached to the back surface of the pad backing plate, and a frame with the above element unit fixed to the backing plate is further attached. The backing plate attached to this frame is covered with a protective plate with a similar shape of 5゛, and the gaps between each element are filled with reinforcing material with good heat insulation, and the power generated by each thermoelectric element module is transferred to the element unit. A heat recovery type pad that can be taken out from the lead wires connected to both ends of the pad.
Claims (1)
子を電気的に接続して熱電子素子モジュールを゛形成し
、この素子モジュールを多数直列又は並列に繋いだユニ
ットをパッド裏金の後面に取付け、さらに、上記素子ユ
ニットを裏金に固着した枠とこの枠に取付けた裏金とは
ゾ相似形の保護板で覆うと共に各素子間に生じる隙間を
断熱性の良好な補強材で埋めて補強し、各熱電素子モジ
ュールにより発電された電力を素子ユニットの両端に接
続したリード線より取出すようｌこした熱回収型パッド
。A thermionic element module is formed by electrically connecting p@n elements made of a compound semiconductor with a large Seebeck effect, and a unit in which a large number of these element modules are connected in series or in parallel is attached to the rear surface of the pad backing, and further, The frame to which the above element unit is fixed to the backing metal and the backing metal attached to this frame are covered with protective plates of a similar shape, and the gaps between each element are filled and reinforced with a reinforcing material with good heat insulation. A heat recovery pad that extracts the power generated by the module from the lead wires connected to both ends of the element unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56135879A JPS5837329A (en) | 1981-08-27 | 1981-08-27 | Heat recovery type pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56135879A JPS5837329A (en) | 1981-08-27 | 1981-08-27 | Heat recovery type pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5837329A true JPS5837329A (en) | 1983-03-04 |
Family
ID=15161902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56135879A Pending JPS5837329A (en) | 1981-08-27 | 1981-08-27 | Heat recovery type pad |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837329A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04351333A (en) * | 1991-05-30 | 1992-12-07 | Nissin Kogyo Kk | Brake device |
| WO2010109592A1 (en) * | 2009-03-24 | 2010-09-30 | トヨタ自動車株式会社 | Braking system |
| WO2012041321A1 (en) * | 2010-09-29 | 2012-04-05 | Aalborg Universitet | Energy-recovering brake pad |
| CN104595399A (en) * | 2014-11-26 | 2015-05-06 | 柳州金特机械有限公司 | Brake pad |
| IT201700102064A1 (en) * | 2017-09-12 | 2019-03-12 | Itt Italia Srl | Brake pad with thermoelectric energy recuperator for braking system |
| WO2019086122A1 (en) | 2017-11-03 | 2019-05-09 | Wabco Europe Bvba | Apparatus for generating energy for a disc brake, and method for generating and storing energy for a disc brake |
| JP2020139538A (en) * | 2019-02-27 | 2020-09-03 | 日信工業株式会社 | Braking device |
| JP2020139539A (en) * | 2019-02-27 | 2020-09-03 | 日信工業株式会社 | Braking device |
| US11035425B2 (en) | 2017-09-12 | 2021-06-15 | Itt Italia S.R.L. | Brake pad with thermoelectric energy harvester |
-
1981
- 1981-08-27 JP JP56135879A patent/JPS5837329A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04351333A (en) * | 1991-05-30 | 1992-12-07 | Nissin Kogyo Kk | Brake device |
| WO2010109592A1 (en) * | 2009-03-24 | 2010-09-30 | トヨタ自動車株式会社 | Braking system |
| CN102232153A (en) * | 2009-03-24 | 2011-11-02 | 丰田自动车株式会社 | Braking system |
| JP5099259B2 (en) * | 2009-03-24 | 2012-12-19 | トヨタ自動車株式会社 | Braking device |
| DE112009004577B4 (en) * | 2009-03-24 | 2014-04-03 | Toyota Jidosha Kabushiki Kaisha | braking system |
| US8770352B2 (en) | 2009-03-24 | 2014-07-08 | Toyota Jidosha Kabushiki Kaisha | Braking system |
| WO2012041321A1 (en) * | 2010-09-29 | 2012-04-05 | Aalborg Universitet | Energy-recovering brake pad |
| CN104595399A (en) * | 2014-11-26 | 2015-05-06 | 柳州金特机械有限公司 | Brake pad |
| CN104595399B (en) * | 2014-11-26 | 2017-08-01 | 江苏方意汽车配件制造股份有限公司 | A kind of brake block |
| WO2019052865A1 (en) | 2017-09-12 | 2019-03-21 | Itt Italia S.R.L. | Brake pad with integrated thermoelectric energy harvester for braking system |
| IT201700102064A1 (en) * | 2017-09-12 | 2019-03-12 | Itt Italia Srl | Brake pad with thermoelectric energy recuperator for braking system |
| CN111094787A (en) * | 2017-09-12 | 2020-05-01 | 意大利Itt有限责任公司 | Brake pad with integrated thermoelectric energy collector for a brake system |
| KR20200051785A (en) * | 2017-09-12 | 2020-05-13 | 아이티티 이탈리아 에스.알.엘. | Braking pad with integrated thermoelectric energy harvester for braking system |
| JP2020533540A (en) * | 2017-09-12 | 2020-11-19 | アイティーティー・イタリア・エス．アール．エル | Brake pads with integrated thermoelectric energy collector for the braking system |
| US11035425B2 (en) | 2017-09-12 | 2021-06-15 | Itt Italia S.R.L. | Brake pad with thermoelectric energy harvester |
| CN111094787B (en) * | 2017-09-12 | 2021-11-30 | 意大利Itt有限责任公司 | Brake pad with integrated thermoelectric energy collector for a brake system |
| US11635115B2 (en) | 2017-09-12 | 2023-04-25 | Itt Italia S.R.L. | Brake pad with thermoelectric energy harvester |
| WO2019086122A1 (en) | 2017-11-03 | 2019-05-09 | Wabco Europe Bvba | Apparatus for generating energy for a disc brake, and method for generating and storing energy for a disc brake |
| JP2020139538A (en) * | 2019-02-27 | 2020-09-03 | 日信工業株式会社 | Braking device |
| JP2020139539A (en) * | 2019-02-27 | 2020-09-03 | 日信工業株式会社 | Braking device |
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