JPS5837329A - Heat recovery type pad - Google Patents

Abstract

PURPOSE:To convert friction heat generated upon braking into electricity to utilize the same by providing thermoelectronic elements which can obtain a Seebeck effect on the back metal of a pad. CONSTITUTION:Each of element modules 4 connecting to each other a P type element 1 and N type element 2 which are formed by intermetallic compound semiconductors using a conductor 3 such as a copper plate. A large number of element modules are tied into units, and fitted to the rear surface of the back metal 10 of a pad electrically insulated with coating films 11 and 11'. The thus fitted element units are covered and protected with a protective plate 13 substantially analogous to a frame 12 secured to the back metal and the back metal fitted to the frame, and further a gap produced between respective elements 1 and 2 is reinforced by an insulation reinforcing material 14 excellent in heat insulation.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat recovery type pad for a disc brake.

Disc brake pads receive high-temperature frictional heat during braking, causing their temperature to rise significantly. The temperature rise in semi-metallic pads and metallic pads designed with wear resistance in mind is particularly remarkable, but until now there has been no pad that recovers and utilizes that heat, and all of the transferred heat is dissipated to the outside.

An object of the present invention is to provide a pad that converts transferred frictional heat into electricity and utilizes it in view of effective use of energy.

Hereinafter, the configuration of the present invention will be explained based on the accompanying drawings.

The pad of the present invention converts frictional heat transferred to the back metal into electricity using a thermionic element capable of obtaining the Seebeck effect. Specifically, as shown in FIG. An element module 4 is manufactured by connecting a P-type element 1 and an N-type element 2 formed of intermetallic compound semiconductors using a conductor 3 such as a copper plate, and a large number of these modules are connected in series using a conductor 3' to form a unit. 11. It is attached to the rear surface of the pad back metal 10 which is electrically insulated by IT. Note that the element modules may be connected in parallel (not shown). In addition, the attached element unit is as shown in FIG.
The fixed frame 12 and the back metal attached to this frame are covered and protected by a protective plate 1B having a similar shape, and the gap created between each element 1 and 2 is further protected by welding or screwing. ,
For example, it is reinforced with an insulating reinforcing material 14 having excellent heat insulation properties, such as a thermosetting resin such as epoxy resin mixed with glass fiber or asbestos, or a foamed resin.

The compound semiconductor of the P-type element 1 constituting the element module 4 is, for example, Bi2 Te3. GeTe,
Zn5b etc. are used, while PbT is used for the n-type element 2.
e etc. are used. Here, the longer the length of elements 1 and 2, the larger the temperature difference between both ends, and the larger the electromotive force can be obtained. However, there is a space problem when attaching the pad, so the length is set to 7 to 10 mm. It is desirable that the diameter be about 5 to 6 mm, considering the ease of production.

In addition, it is recommended that the bonding between each element 1.2 and the conductor 3.3 be performed in an inert gas atmosphere to withstand high temperatures (the bonding agent used in this case should be a bonding agent with excellent heat resistance properties). Examples include stainless steel wax and silver wax.

Note that 15 and 15' in FIG. 2 indicate lead wires connected to both ends of the element unit, and this lead wire is connected to, for example, a storage battery of a car.

In the pad of the present invention having the above configuration, the thermoelectromotive power α and specific resistance ρ per thermionic element can be expressed by the following numerical values. That is, α = 250 llV/deg, ρ = IX10 9cm Here, since power 1' = V1 - V2/R, P・n
If the cross-sectional areas of elements 1 and 2 are respectively IC4 and the length j of the element in FIG. P= ((5X10")Xi O')"/2X10"=
The voltage is 1.25 x 10-' W/deg, and the voltage at this time is 5 x 10-4.

In addition, module 1 of thermionic element according to the above dimensions
When we conducted an experiment by attaching 00 pairs to a semi-metallic pad, we found that: 1. ．． A power of nearly 3 W was obtained, and the voltage at that time was a little over 5 ■. The power calculation formula at this time is P = 1.25X10""'XΔT (temperature difference)
The temperature difference ΔT between FIGS. , it can be seen that the temperature rise of the hydraulic fluid in the piston is also effectively prevented.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a thermionic element module used in the pad of the present invention, FIG. 2 is a rear view of the pad of the present invention, and FIG. 3 is a partially cutaway plan view of the same. DESCRIPTION OF SYMBOLS 1... P type element, 2... N type element, 3, 3... Conductor, 10... Pad back metal, 12... Frame, 13...
Protective plate, 14... Reinforcement material, 15. 15... Lead wire Figure 1 Figure 2 Figure 3 Figure 1 Procedural amendment (Mutsu) 1. Display of the case 1982 Patent Application No. 13587 Shizu 2, Name of the invention Heat recovery type pad 3, Relationship with the case Patent applicant address 5-15 Kitahama, Higashi-ku, Osaka Name Kakune) (2)
13) Sumitomo Electric Industries, Ltd. 4, Agent 5゜Showa Year, Month, Day (Delivery date) Contents of amendment as shown in the attached sheet 1. The scope of claims in the specification will be amended in the attached sheet. 2 "Compound semiconductor" on page 3, line 10 of the specification will be corrected to "intermetallic compound semiconductor." ClaimsP made of an intermetallic compound semiconductor with a large Seebeck effect
- n elements are electrically connected to form a thermionic element module, a unit in which a large number of these element modules are connected in series or in parallel is attached to the back surface of the pad backing plate, and a frame with the above element unit fixed to the backing plate is further attached. The backing plate attached to this frame is covered with a protective plate with a similar shape of 5゛, and the gaps between each element are filled with reinforcing material with good heat insulation, and the power generated by each thermoelectric element module is transferred to the element unit. A heat recovery type pad that can be taken out from the lead wires connected to both ends of the pad.

Claims (1)

[Claims] A thermionic element module is formed by electrically connecting p@n elements made of a compound semiconductor with a large Seebeck effect, and a unit in which a large number of these element modules are connected in series or in parallel is attached to the rear surface of the pad backing, and further, The frame to which the above element unit is fixed to the backing metal and the backing metal attached to this frame are covered with protective plates of a similar shape, and the gaps between each element are filled and reinforced with a reinforcing material with good heat insulation. A heat recovery pad that extracts the power generated by the module from the lead wires connected to both ends of the element unit.