JP4481606B2 - Thermoelectric converter - Google Patents

Description

  The present invention relates to a thermoelectric conversion device including a thermoelectric conversion module or a thermoelectric conversion unit that directly converts heat energy into electric energy, and more particularly to a thermoelectric conversion device that reduces heat loss and improves thermoelectric conversion efficiency.

  In general, this type of thermoelectric conversion device includes a thermoelectric conversion module or a thermoelectric conversion unit in which a plurality of thermoelectric conversion modules are combined. The thermoelectric conversion module or unit is configured by combining P-type semiconductor and N-type semiconductor thermoelectric conversion elements, and directly converts thermal energy into electrical energy using thermoelectric effects such as the Thomson effect, Peltier effect, Seebeck effect, etc. It is like that.

  A conventional thermoelectric conversion device is disclosed in Japanese Patent Laid-Open No. 2003-179274 (Patent Document 1).

In this thermoelectric conversion device, a plurality of pairs of P-type semiconductor and N-type semiconductor columnar thermoelectric conversion elements are erected in parallel between opposing insulating substrates, and solder layers are provided at both ends of the thermoelectric conversion elements. It joins to an electrode, each thermoelectric conversion element is electrically connected in series, and is thermally arranged in parallel.
Japanese Patent Laying-Open No. 2003-179274 (FIG. 3)

  A conventional thermoelectric conversion device constitutes a rigid thermoelectric conversion module by rigidly fixing both ends of each columnar thermoelectric conversion element composed of a P-type semiconductor and an N-type semiconductor to an electrode on an insulating substrate via a solder layer. is doing. Since the thermoelectric conversion module adopts a rigid structure in which both sides of each thermoelectric conversion element are rigidly fixed to the electrodes, the degree of freedom with respect to thermal expansion is small, and when using the thermoelectric conversion module, along with the thermal expansion of each thermoelectric conversion element, A large stress concentration occurs at the end portion on the high temperature side, causing breakage or damage to the thermoelectric conversion element, which is a cause of deteriorating the mechanical life.

  Further, in order to improve the thermoelectric conversion efficiency (performance) of the thermoelectric conversion module or unit, the thermoelectric conversion device smoothly supplies heat to the thermoelectric conversion element and releases heat from the thermoelectric conversion element, and the heat source has a high temperature. It is desirable that all the heat supplied from the side system is radiated from the low temperature side system through the thermoelectric conversion element 10.

  However, in the conventional thermoelectric conversion module or unit, a part of the heat supplied from the high temperature side system (heat supply) is transferred by heat radiation or convection in the gap between the thermoelectric conversion element or thermoelectric conversion module, and the thermoelectric conversion Since there are those that reach the low temperature system without passing through the element, there is a problem that the thermoelectric conversion efficiency of the thermoelectric conversion module or unit is low with respect to the performance of the thermoelectric conversion element.

  Moreover, in the conventional thermoelectric conversion module or unit, no measures for preventing heat loss from the thermoelectric conversion module are taken into consideration, and a large heat loss occurs, and both ends of each thermoelectric conversion element are respectively connected via solder layers. Since the rigid structure is bonded to the electrode, the thermoelectric conversion module has a low thermal conductivity, and the thermoelectric conversion efficiency cannot be increased.

  The present invention has been made in consideration of the above-described circumstances, and has been provided with sufficient and effective measures for heat loss of the thermoelectric conversion module, improving the thermoelectric conversion efficiency, and obtaining a large electromotive force. An object is to provide an apparatus.

  Another object of the present invention is to provide a heat transfer conversion device that improves heat transfer of a thermoelectric conversion module or unit and improves thermoelectric conversion efficiency.

  Furthermore, another object of the present invention is to provide a heat transfer conversion device that can reduce the heat loss and improve the heat transfer of the thermoelectric conversion module or unit, and can efficiently and sufficiently draw out the performance of each thermoelectric conversion element. It is in.

In order to solve the above-described problem, a thermoelectric conversion module according to the present invention includes a matrix of a plurality of thermoelectric conversion elements between an opposing heat-absorbing-side insulating substrate and a heat-dissipating-side insulating substrate. The thermoelectric conversion elements are arranged in a shape, and the heat absorption side electrode is attached to the heat absorption surface of the thermoelectric conversion element, and the heat dissipation side electrode is attached to the heat dissipation surface, so that all thermoelectric conversion elements are electrically connected in series and thermally in parallel. In the thermoelectric conversion module configured to be connected, the inside of the thermoelectric conversion module is configured to have a heat loss prevention structure in order to reduce the amount of heat that does not pass through the thermoelectric conversion element due to radiation and convection, and the thermoelectric conversion module includes each thermoelectric conversion module. At least one of the joint surfaces between the conversion element and the heat absorption side electrode and at least one of the joint surfaces between each thermoelectric conversion element and the heat radiation side electrode are plated with a material having excellent heat conduction characteristics. Is a thin plate formed with a material having excellent heat conduction characteristics on the bonding surface between each thermoelectric conversion element and the heat absorption side electrode and the bonding surface between each thermoelectric conversion element and the heat radiation side electrode. Furthermore, the high temperature side heat absorption surface of each thermoelectric conversion element has a degree of freedom by contact or bonding to the heat absorption side electrode and is not rigidly attached, and the low temperature side heat dissipation surface of each thermoelectric conversion element The heat loss prevention structure is attached to the side electrode directly or via a solder layer so that the internal space formed by the high temperature side insulating substrate and the low temperature side insulating substrate is divided into a plurality of flat small spaces. In addition, a plurality of radiation prevention plates are arranged in a multi-stage shape .

Also, the thermoelectric conversion module according to the present invention, in order to solve the above problems, as described in claim 8, and the heat absorption side insulating substrate facing the plurality of thermoelectric conversion elements between the radiation side insulating substrate The thermoelectric conversion elements are arranged in a matrix, and the heat absorption side electrode is attached to the heat absorption surface of the thermoelectric conversion element, and the heat dissipation side electrode is attached to the heat dissipation surface, so that all thermoelectric conversion elements are electrically connected in series and thermally. In the thermoelectric conversion module configured to be connected in parallel, the thermoelectric conversion module is configured in a heat loss prevention structure in order to reduce the amount of heat that does not pass through the thermoelectric conversion element due to radiation and convection, while the thermoelectric conversion module Applying or plating a material having excellent heat conductivity to at least one of the internal joint surfaces, or applying heat to the joint surface inside the thermoelectric conversion module Conductive properties is interposed sheet made of superior materials, further, the hot-side heat absorbing faces of the thermoelectric conversion element, there is freedom in contact or joined to the heat absorption side electrodes, and attaching not rigid, the conversion each thermoelectric The low temperature side heat radiating surface of the element is attached directly to the heat radiating side electrode directly or via a solder layer, and the heat loss prevention structure has a plurality of internal spaces formed by the high temperature side insulating substrate and the low temperature side insulating substrate. It is characterized in that it is configured by dividing it into flat small spaces in a multistage manner with a radiation preventing plate .

Moreover, in order to solve the above-described problem, a thermoelectric conversion device according to the present invention includes the thermoelectric conversion module according to claim 1 or 8 as described in claim 16 , and includes a plurality of the thermoelectric conversion modules. A thermoelectric conversion unit is configured in combination.

  In the thermoelectric conversion device according to the present invention, since the thermoelectric conversion module or the thermoelectric conversion unit is provided with a heat loss prevention structure, the heat absorption from the high temperature side system can be efficiently guided to each thermoelectric conversion element of the thermoelectric conversion module, Conversion performance can be improved, and since there are no moving parts in the thermoelectric conversion module or thermoelectric conversion unit, the reliability is improved and the mechanical and physical life can be sufficiently maintained.

  Moreover, since the thermoelectric conversion device according to the present invention has improved the heat conduction characteristics in the thermoelectric conversion module and the thermoelectric conversion unit, the heat flow flowing through each thermoelectric conversion element of the thermoelectric conversion module increases, and the thermoelectric conversion performance and thus the power generation performance Can be greatly improved.

  An embodiment of a thermoelectric conversion device according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a schematic diagram showing in principle a first embodiment of a thermoelectric conversion device according to the present invention.

  The thermoelectric conversion device 10 includes a thermoelectric conversion module 11 that directly converts thermal energy into electrical energy. This thermoelectric conversion module 11 is sandwiched between a high temperature side or heat absorption side insulating substrate 12 and a low temperature side or heat dissipation side insulating substrate 13, and is formed into a matrix, grid or row of thermoelectric conversion element groups 15 constituting thermoelectric conversion means. Have The high temperature side and low temperature side insulating substrates 12 and 13 are formed of a heat-resistant material such as ceramics having excellent thermal conductivity and electrical insulating properties. The outer surface of the high temperature side insulating substrate 12 is a high temperature side heat transfer surface 12a, the inner surface is a high temperature side wall surface 12b, and the outer surface of the low temperature side insulating substrate 13 is a low temperature side heat transfer surface 13a. Is formed on the low temperature side wall surface 13b.

  The thermoelectric conversion element group 15 is a combination of a plurality of pairs of columnar P-type semiconductors (semiconductor elements) 16 and N-type semiconductors (semiconductor elements) 17 such as prismatic or cylindrical, and arranged in a matrix or grid as a whole. The thermoelectric conversion element is used. One end side of each thermoelectric conversion element 16, 17 is a high-temperature side heat absorption surface, and the other end side is formed as a low-temperature side heat dissipation surface. The heat absorbing surfaces of the thermoelectric conversion elements 16 and 17 are in contact with or bonded to the heat absorbing side electrode 18, while the heat radiating surfaces are attached to the heat radiating side electrode 19 directly or via the solder layer 20. The heat absorption side electrode 18 is provided on the high temperature side insulating substrate 12, and the heat dissipation side electrode 19 is provided on the low temperature side insulating substrate 13.

  On the other hand, the thermoelectric conversion module 11 obtains an electromotive force due to a temperature difference between both ends of the element generated on the high temperature side heat absorbing surface 21 and the low temperature side heat radiating surface 22 of the thermoelectric conversion elements 16 and 17. By maintaining the temperature difference between both ends, higher thermoelectric conversion performance can be obtained.

  As shown in FIG. 2, the thermoelectric conversion module 11 arranges the heat absorption side electrodes 18 and the heat radiation side electrodes 19 attached to the thermoelectric conversion elements 16 and 17 alternately in a zigzag manner. 17 are electrically connected in series and thermally arranged in parallel. The electromotive force generated in each thermoelectric conversion element 16, 17 is taken out through the lead wire 23.

  In order to improve the thermoelectric conversion performance, the thermoelectric conversion module 11 is subjected to heat loss prevention measures and heat conduction improvement measures. In order to improve the thermoelectric conversion performance, the thermoelectric conversion module 11 smoothly supplies heat to the thermoelectric conversion elements 16 and 17 and dissipates heat from the thermoelectric conversion elements 16 and 17, and heat sources such as high-temperature members and high-temperature parts. It is desirable that all the heat supplied from the high temperature side system passes through the thermoelectric conversion elements 16 and 17 and is radiated from the low temperature side system.

  A part of the heat supplied from the high temperature side system is transferred by heat radiation or convection generated between the thermoelectric conversion elements 16 and 17 or in the gap between the thermoelectric conversion modules 11, and there is little heat flow through the thermoelectric conversion elements 16 and 17. In order to prevent this, the surface of the thermoelectric conversion elements 16, 17, the opposing surface of the high-temperature side and low-temperature side insulating substrates 12, 13, and the exposed surfaces of the electrodes 18, 19 are painted with a high heat reflectance such as white or silver. A plating coating 24 is applied.

  The surface of the thermoelectric conversion elements 16 and 17 and the exposed surface such as the opposing surfaces of the pair of insulating substrates 12 and 13 are covered with a coating 24 such as a coating or plating having high heat reflectivity, whereby each thermoelectric conversion element 16, The generation of radiant heat a emitted from 17, radiant heat b from the high temperature side insulating substrate 12, and fluid convection c in the thermoelectric conversion module 11 can be greatly reduced, and measures against heat loss can be taken. .

The coating 24 having a high heat reflectivity can be formed by plating silver (Ag), platinum (Pt), gold (Au), copper (Cu), tin, Ni, Zn, or the like. Alternatively, Al ₂ O ₃ or the like may be applied. Instead of applying the coating 24 having a high thermal reflectance, the surface exposed in the thermoelectric conversion module 11 may be mirror-finished.

  By taking this heat loss prevention measure, it is possible to prevent the temperature of the high-temperature side insulating substrate 12 and the high-temperature side wall surfaces of the thermoelectric conversion elements 16 and 17 from decreasing, and the low-temperature side portion of the thermoelectric conversion elements 16 and 17 and the low-temperature side insulating substrate 13. Therefore, the temperature difference between the both ends of each thermoelectric conversion element 16 and 17 is hardly reduced, and the thermoelectric conversion performance and thus the power generation performance is not deteriorated.

  The thermoelectric conversion elements 16 and 17 of the thermoelectric conversion module 11 are joined or brought into contact with the high temperature side electrode 18 and the low temperature side electrode 19. At this time, the thermoelectric conversion elements 16 and 17 and the high temperature side electrode 18 or the low temperature side electrode 19 are joined. At least one of the joint surfaces with the electrode 19 may be plated with a material having high thermal conductivity, such as Cu, Ag, Au, or Ni. Thereby, the heat conduction efficiency of each thermoelectric conversion element 16 and 17 can be improved.

  The thermoelectric conversion module 11 absorbs high-temperature, for example, 400 ° C. to 800 ° C. radiant heat from a heat source or a high-temperature side system by the high-temperature side insulating substrate 12, and guides the absorbed heat to the thermoelectric conversion elements 16 and 17. By causing the heat flow to flow through the thermoelectric conversion elements 16 and 17, a power generation action occurs, and the heat flow drops in temperature to about 100 ° C., for example. The heat flow whose temperature has dropped is dissipated from the low-temperature insulating substrate 13.

  At that time, the thermoelectric conversion module 11 is provided with a coating 24 made of a material having a high heat reflectivity on the exposed surface inside, so that a heat loss prevention structure is formed. For this reason, there is little generation | occurrence | production of the radiation a and b which generate | occur | produce in the internal space (gap) of the thermoelectric conversion module 11, and the heat | fever absorbed at the high temperature side of the thermoelectric conversion module 11 is effective in each thermoelectric conversion element 16 and 17. As a result, it is possible to improve the thermoelectric conversion capacity and thus the power generation capacity.

  The thermoelectric conversion elements 16 and 17 constituting the thermoelectric conversion element group 15 of the thermoelectric conversion module 11 are formed in a prismatic shape of about several mm, for example, about 2 to 3 mm, and the height of the columnar thermoelectric conversion elements 16 and 17 is 1 mm to The thickness is about several cm, preferably 2 to 3 mm. In addition, the spacing between the thermoelectric conversion elements 16 and 17 of the thermoelectric conversion element group 15 is 1 mm or less, for example, about 0.3 mm to 0.4 mm, thereby increasing the packing density of the thermoelectric conversion elements 16 and 17. And thermoelectric conversion efficiency can be improved.

  The thermoelectric conversion module 11 has a size of about several cm square as a whole even if several thermoelectric conversion elements 16 and 17 are arranged in a matrix. Even in the thermoelectric conversion module 11 having a size of several centimeters, the high temperature side is set to 500 ° C. to 600 ° C., and the low temperature side is set to 100 ° C. For example, several thermoelectric conversion elements 16 and 17 (for example, 4 × 4) When arranged in a matrix, the experiment yields a two-digit watt output per module.

  In this thermoelectric conversion module 11, the heat absorption surfaces of the thermoelectric conversion elements 16 and 17 are attached to the heat absorption side electrode 18, and the heat dissipation surface is attached to the heat dissipation side electrode 19, respectively. The side electrode 18 is attached with a relatively high degree of freedom such as contact, and is not attached to the rigid via the solder layer. Therefore, since the thermoelectric conversion module 11 is not configured in a rigid structure in which the thermoelectric conversion elements 16 and 17 are rigidly fixed to the heat absorption side electrode 18 of the high temperature side insulating substrate 12, the degree of freedom with respect to thermal expansion is large, and stress due to thermal expansion is large. Concentration can be prevented and the mechanical and physical life can be sufficiently maintained.

  FIG. 3 is a view showing in principle the second embodiment of the thermoelectric conversion device according to the present invention.

  FIG. 3 schematically shows a cross-sectional structure of the thermoelectric conversion module 11A constituting the thermoelectric conversion device. The same components as those of the thermoelectric conversion module 11 shown in FIG. .

  This thermoelectric conversion module 11 </ b> A has a radiation preventing plate 30 interposed between a high temperature side insulating substrate 12 and a low temperature side insulating substrate 13. The radiation preventing plate 30 is made of a material having high heat reflectivity, for example, stainless steel, Ni-plated iron, aluminum (alumite), zinc or the like.

  The radiation preventing plate 30 is a thin plate interposed in the gap between the high temperature side insulating substrate 12 and the low temperature side insulating substrate 13 so that the gap is divided into two in a plane perpendicular to the direction of heat transfer. Provided.

  By providing the radiation preventing plate 30 between the high temperature side and low temperature side insulating substrates 12 and 13, the amount of heat that does not pass through the thermoelectric conversion elements 16 and 17 due to radiation and convection inside the thermoelectric conversion module 11A is reduced, and this is a heat source. Heat received by the high temperature side insulating substrate 12 from the high temperature side system is effectively guided through the thermoelectric conversion elements 16 and 17 to the low temperature side insulating substrate 13 and radiated from the low temperature side insulating substrate 13 to the outside.

  The thermoelectric conversion module 11A generates an electromotive force when a heat received from a heat source or the like flows as a heat flow through the thermoelectric conversion elements 16 and 17 of the thermoelectric conversion element group 15 and generates an electromotive force. The temperature is lowered by the power generation action by the heat flow passing through each thermoelectric conversion element 16, 17 and is guided to the low temperature side insulating substrate 13.

  At that time, the thermoelectric conversion module 11A is coated or plated with a highly heat-reflective material such as white or silver, as shown in FIG. Also good. Instead of applying this coating, the exposed surface inside the thermoelectric conversion module 11A, at least the inner surfaces of the insulating substrates 12 and 13, may be formed into a mirror finish.

  FIG. 4 shows a first modification of the thermoelectric conversion module 11A shown in FIG.

  In the thermoelectric conversion module 11B shown in this modification, a plurality of radiation prevention plates 30 are provided at intervals between the high temperature side insulating substrate 12 and the low temperature side insulating substrate 13 (gap). Other configurations are not different from the thermoelectric conversion module 11A shown in FIG.

  The thermoelectric conversion module 11B shown in FIG. 4 has a plurality of radiation prevention plates 30 arranged in a multistage structure. By disposing each radiation prevention plate 30 in an internal space (gap) between the two insulating substrates 12 and 13 at an appropriate interval, the internal space is partitioned into a plurality of small spaces, and a heat loss prevention structure is formed. The

  Each radiation prevention plate 30 is a thin plate formed of a material having a high heat reflectance, and each radiation prevention plate 30 is held by a plurality of columnar thermoelectric conversion elements 16 and 17 penetrating therethrough.

  Thus, the internal space formed between the two insulating substrates 12 and 13 of the thermoelectric conversion module 11B is partitioned into a plurality of small spaces by the radiation prevention plates 30 arranged in parallel, and each small space is divided into the two insulating substrates 12 and 13. Is formed in substantially parallel to the heat loss prevention structure, which effectively and reliably prevents large radiation and convection action from occurring in the internal space between the two insulating substrates 12 and 13.

  By arranging a plurality of radiation prevention plates 30 in a multi-stage manner and partitioning the internal space between the two insulating substrates 12 and 13 into a plurality of flat small spaces, heat outflow due to radiation and convection can be prevented. In particular, the heat received by the high temperature side insulating substrate 12 and absorbed can be guided to the thermoelectric conversion elements 16 and 17.

  FIG. 5 shows a second modification of the thermoelectric conversion module.

  The thermoelectric conversion module 11C shown in this modification is different from the thermoelectric conversion module 11B shown in FIG. 4 only in the interval holding structure in which the plurality of radiation preventing plates 30 are held at a predetermined interval by the interval holding means 33. Since other configurations and operations are not different, the same reference numerals are given and description thereof is omitted. In the thermoelectric conversion module 11C of FIG. 5, illustration of a high-temperature side insulating substrate, a low-temperature side insulating substrate, and electrodes that are attached to each insulating substrate by bonding or stretching is omitted.

  In the thermoelectric conversion module 11 </ b> C shown in FIG. 5, a plurality of radiation prevention plates 30 are held in a multistage structure by a gap holding means 33. The spacing holding means 33 is configured such that a head bolt 34 is inserted into each radiation preventing plate 30 and fastened with a nut 35, and each radiation preventing plate 30 is spaced and held in a multistage structure by a spacer 36. Each radiation prevention plate 30 is previously provided with holes through which the bolts 34 and the thermoelectric conversion elements 16 and 17 are inserted.

  The interval holding means 33 is composed of fastening means 34 and 35 such as bolts and nuts, and a spacer 36, and is similar to that shown in FIG. 4 between the high temperature side insulating substrate and the low temperature side insulating substrate (both not shown). The internal space is formed in a flat and small space in a multi-stage manner, and it has a heat loss prevention structure. The arrangement interval of the radiation preventing plates 30 can be adjusted according to the thickness or number of thin plates.

  FIG. 6 shows a third modification of the thermoelectric conversion module.

  The thermoelectric conversion module 11D shown in this modified example is different from the thermoelectric conversion module 11C shown in FIG. 5 only in the configuration of the interval holding means 38 of each radiation prevention plate 30, and the other configurations and functions are as shown in FIG. Since it is not different from the thermoelectric conversion module 11C, the same reference numerals are given and description thereof is omitted.

  The thermoelectric conversion module 11D is configured such that the end of each radiation prevention plate 30 is bent at an acute angle, and the tip of the bent portion 39 is brought into contact with the surface of the adjacent radiation prevention plate 30 on the non-bending side. The holding means 38 is configured. In this case, the interval holding means 38 does not require an independent component member and can be configured only by bending the end portion of the radiation preventing plate 30, so that the number of parts can be reduced and the cost can be reduced. Moreover, it can comprise in a heat loss prevention structure by bending the edge part of the radiation prevention board 30, and adjusting space | interval.

  On the other hand, the radiation prevention plate 30 interposed in the internal space of the high-temperature side and low-temperature side insulating substrates (not shown) of the thermoelectric conversion module 11D is formed of a thin plate made of a material having a high heat reflectivity. For this reason, it is a condition that the bent portion formed by bending the end portion of the radiation preventing plate 30 is bent at an acute angle. Further, instead of bending the end portion of the radiation preventing plate 30, a part of the radiation preventing plate 30 may be cut and raised into a tongue shape, and the tongue piece may be bent at an acute angle to constitute a space holding means. . Further, the tongue piece may be formed by utilizing a hole portion of the radiation preventing plate 30 through which the thermoelectric conversion elements 16 and 17 are passed. A tongue piece may be formed in a portion to be punched out as a hole, and this tongue piece may be used as a distance holding means.

  FIG. 7 is a principle view showing a third embodiment of the thermoelectric converter according to the present invention.

  In FIG. 7, the thermoelectric conversion module 11 constituting the thermoelectric conversion device is provided with a deterioration prevention structure due to the thermoelectric conversion elements 16 and 17 and oxidation of the junctions thereof.

  The thermoelectric conversion module 11 is stored in a sealed box-shaped casing 41 and the inside of the sealed casing 41 is kept airtight. By holding the thermoelectric conversion module 11 with an airtight sealing structure, the thermoelectric conversion module 11 can be installed in an airtight environment, and its oxidation can be effectively and reliably prevented.

  In the thermoelectric conversion device 10A shown in FIG. 7, in order to keep the thermoelectric conversion module 11 airtight, the inner surface 41a and / or the outer surface 41b of the sealed casing 41 are coated with a material having a high heat reflectance such as white or silver. The coating 24 may be formed, or the inner and outer surfaces of the sealed casing 41 may be finished in a mirror state instead of the coating.

  Since the thermoelectric conversion module 11 accommodated in the hermetic casing 41 has the same configuration and function as the thermoelectric conversion module shown in FIG.

  FIG. 8 is a diagram showing a fourth embodiment of the thermoelectric conversion device according to the present invention.

  FIG. 8 shows an example in which the thermoelectric conversion device 10 </ b> B is configured with a thermoelectric conversion unit 45. The thermoelectric conversion unit 45 is configured by combining a plurality of thermoelectric conversion modules 11. In the example of FIG. 8, three thermoelectric conversion modules 11 are combined. The thermoelectric conversion unit 45 is assembled by electrically connecting a plurality of thermoelectric conversion modules 11 in series or in parallel.

  Each thermoelectric conversion module 11 is stored in a sealed casing 46 which is a flat box-shaped container. The inside of the sealed casing 46 is formed in an airtight structure in order to prevent oxidation of the thermoelectric conversion unit 45 that is an aggregate of the thermoelectric conversion modules 11.

  Since the thermoelectric conversion unit 45 is sealed and housed in the hermetic casing 46 with an airtight sealing structure, the thermoelectric conversion unit 45 is shielded from the outside air and kept airtight. The mechanical and physical life of the thermoelectric conversion unit 45 can be maintained.

  In the thermoelectric conversion unit 45 accommodated in the hermetic casing 46, the number of thermoelectric conversion modules 11 and a method for connecting the modules are determined according to the required output. Since each thermoelectric conversion module 11 is shown in FIG. 2 and is not different from the thermoelectric conversion module 11, the same reference numerals are given and description thereof is omitted.

  Coating is applied to the wall surface 46a of the sealed casing 46, which is a container containing the plurality of thermoelectric conversion modules 11, with a material having a high heat reflectance such as white or silver, and a film having a high heat reflectance is formed. Instead of painting, the wall surface 46a of the sealed casing 46 may be finished in a mirror state.

  FIG. 9 is a view showing a fifth embodiment of the thermoelectric conversion device according to the present invention.

  FIG. 9 shows an example in which the thermoelectric conversion device 10 </ b> C is applied to the thermoelectric conversion unit 50. The thermoelectric conversion unit 50 is configured by combining a plurality of thermoelectric conversion modules 11A. In the example of FIG. 8, it is configured by combining three thermoelectric conversion modules 11A.

  Each thermoelectric conversion module 11A has the same configuration and function as the thermoelectric conversion module 11A shown in FIG. Each thermoelectric conversion module 11A is stored in a sealed casing 46, which is a flat box-like container. The hermetic casing 46 has an airtight structure to prevent oxidation of the thermoelectric conversion unit 50 accommodated therein. By preventing oxidation of the thermoelectric conversion unit 50, the mechanical and physical life of the thermoelectric conversion unit 50 can be sufficiently maintained.

  In the thermoelectric conversion unit 50, the number of thermoelectric conversion modules 11A and the method of connecting the modules are determined according to the required output. As shown in FIG. 8, the radiation prevention plate 30 of the heat loss prevention structure provided in each thermoelectric conversion module 11A may be shared by each thermoelectric conversion module 11A, or may be provided individually by each thermoelectric conversion module 11A.

  In FIG. 9, each thermoelectric conversion module 11 </ b> A constituting the thermoelectric conversion unit 50 has a heat loss prevention structure in which one radiation prevention plate 30 is interposed in the internal space between the high temperature side and low temperature side insulating substrates 12 and 13. However, instead of each thermoelectric conversion module 11A, the thermoelectric conversion modules 11B, 11C, and 11D shown in FIGS. 4 to 6 may be used, and each thermoelectric conversion module 11A may be replaced with another thermoelectric conversion module. It may be shared with 11B, 11C, and 11D.

  By providing the radiation prevention plate 30 in each thermoelectric conversion module 11A (11B, 11C, 11D), a heat loss prevention structure can be provided, and heat outflow due to heat radiation or convection can be efficiently prevented.

  FIG. 10 is a diagram showing a sixth embodiment of a thermoelectric conversion device according to the present invention.

  FIG. 10 shows an example in which the thermoelectric conversion device 10D is applied to a thermoelectric conversion module 11 having excellent heat conduction characteristics.

  This thermoelectric conversion device 10D is obtained by joining the high temperature side heat transfer surface 12a of the thermoelectric conversion module 11 to the high temperature side system 55 and joining the low temperature side heat transfer surface 13a of the thermoelectric conversion module 11 to the low temperature side system 56. . The high temperature side system 55 receives or collects heat such as radiant heat emitted from a heat source (not shown) such as a high temperature member or a high temperature part, and the heat absorbed by the high temperature side system 55 is excellent in thermal conductivity. Then, the heat is transferred to the high temperature side insulating substrate 12 and led to the thermoelectric conversion elements 16 and 17 of the thermoelectric conversion element group 15 through the heat absorption side electrode 18.

  At that time, in order to improve the heat conduction characteristics of the joint surface or the contact surface 57 between the high temperature side system 55 and the thermoelectric conversion module 11, a substance having excellent thermal conductivity, for example, on at least one joint surface (contact surface), for example, Plating treatment (heat treatment) is performed with Au, Ag, Cu, oxide, or the like.

  This plating process (heat treatment) may be performed on at least one of the joint surfaces (contact surfaces) 58 between the low temperature side system 56 and the thermoelectric conversion module 11. Further, at least one of the bonding surfaces or contact surfaces 59 of the thermoelectric conversion elements 16 and 17 and the heat absorption side electrode 18 of the thermoelectric conversion element group 15, and the bonding surfaces or contacts of the thermoelectric conversion elements 16 and 17 and the heat dissipation side electrode 19. You may make it give to at least one of the surface 60, respectively.

  At least one of the joint surfaces (contact surfaces) between the thermoelectric conversion module 11 and the high temperature side system 55, at least one of the joint surfaces between the thermoelectric conversion module 11 and the low temperature side system 56, and each thermoelectric conversion element of the thermoelectric conversion element group 15 A material having excellent thermal conductivity is used on at least one of the joint surfaces or contact surfaces between the heat sink side electrodes 18 and 17 and the contact surface between the thermoelectric conversion elements 16 and 17 and the heat radiation side electrode 19. By performing heat treatment such as plating, the contact area of the joint surface can be increased, and the heat conduction characteristics of the thermoelectric conversion module 11 can be improved.

  By improving the heat conduction characteristics of the thermoelectric conversion module 11, the heat flow guided to the thermoelectric conversion elements 16 and 17 of the thermoelectric conversion module 11 can be increased, and the thermoelectric conversion performance, that is, the power generation performance can be improved. it can.

  In addition, instead of plating each bonding surface or at least one of the contact surfaces of the thermoelectric conversion module 11 with a material having excellent heat conductivity, gold (Au) or silver having excellent heat conductivity between the bonding surfaces. A thin plate of (Ag) or platinum (Pt) may be interposed, or a thin plate of good thermal conductivity such as copper may be sandwiched by Ag or oxide plating.

  Furthermore, although this thermoelectric conversion apparatus 10D demonstrated the example provided with the thermoelectric conversion module 11, it may replace with this thermoelectric conversion module 11, and may employ | adopt the thermoelectric conversion module shown by FIG.

  FIG. 11 is a diagram showing a seventh embodiment of the thermoelectric conversion device according to the present invention.

  FIG. 11 shows an example in which the thermoelectric conversion device 10E is applied to a thermoelectric conversion unit 45 having excellent heat conduction characteristics.

  In the thermoelectric conversion unit 45, a plurality of thermoelectric conversion modules 11 are stored in a sealed casing 46 which is a box-shaped flat container. The thermoelectric conversion unit 45 is configured by combining a plurality of thermoelectric conversion modules 11. FIG. 11 illustrates an example in which three thermoelectric conversion modules 11 are combined.

  The outer wall surface of the thermoelectric conversion unit 45 becomes a joint surface with the high temperature side system 55 and the low temperature side system 56. The high temperature side system 55 receives or collects heat such as radiant heat emitted from a heat source such as a high temperature member or a high temperature part. The heat absorbed by the high temperature side system 55 is guided to the thermoelectric conversion unit 45, and this thermoelectric conversion is performed. It is guided to each thermoelectric conversion module 11 through the sealed casing 46 of the unit 45.

  At that time, in order to improve the heat conduction characteristics of the joint surface or the contact surface between the high temperature side system 55 and the thermoelectric conversion unit 45, a material having excellent heat conductivity characteristics on at least one joint surface (contact surface), for example, Au, Ag, Cu and oxides thereof are plated.

  This plating process is also applied to at least one of the joint surface or the contact surface between the sealed casing 46 and the thermoelectric conversion module 11 of the thermoelectric conversion unit 45 and at least one of the joint surfaces of the thermoelectric conversion unit 45 and the low temperature side system 56. Is done. Instead of performing a plating process between each joint surface, you may interpose thin plates, such as Au, Pt, Ag, Cu, which were excellent in heat conduction. Further, a thin plate having good thermal conductivity, such as copper, may be sandwiched between Ag, Pt or an oxide thereof.

  The thermoelectric conversion device 10E includes at least one of the joint surfaces between the thermoelectric conversion unit 45 and the high temperature side system 55 and the low temperature side system 56, and the joint surface between the sealed casing 46 in the thermoelectric conversion unit 45 and each thermoelectric conversion module 11. Since at least one of them is plated with a material having excellent thermal conductivity or a thin plate having excellent thermal conductivity is interposed between the joining surfaces, the thermal conductivity characteristics of the thermoelectric conversion unit 45 can be improved.

  In addition, at least one of the joint surfaces between the thermoelectric conversion elements 16 and 17 and the electrodes of the thermoelectric conversion modules 11 constituting the thermoelectric conversion unit 45 may be plated with a material having excellent heat conduction characteristics.

  Also in this case, the thermoelectric conversion unit 45 can improve the heat conduction characteristics of the joint surface with the high temperature side system 55 and the low temperature side system 56, and the thermoelectric conversion unit 45 further includes each thermoelectric conversion module 11 and the sealed casing 46. It is possible to improve the heat conduction characteristics of the joint surface with and improve the heat conductivity. Since heat conductivity such as plating treatment can be applied to the thermoelectric conversion unit 45 in the manufacturing process to improve the thermal conductivity, the heat supplied from the high temperature side system 55 is efficiently guided to the thermoelectric conversion elements 16 and 17. The heat can be radiated from the low temperature side system 56 through the thermoelectric conversion elements 16 and 17.

  The heat absorbed by the high-temperature side system 55 is efficiently guided to the thermoelectric conversion elements 16 and 17 of the thermoelectric conversion modules 11, so that the thermoelectric conversion performance of the thermoelectric conversion elements 16 and 17 can be improved. .

The figure which shows 1st Embodiment of the thermoelectric conversion apparatus which concerns on this invention in principle. The figure which shows the example which applied the thermoelectric conversion apparatus which concerns on this invention to the thermoelectric conversion module. Sectional drawing of the thermoelectric conversion module which shows 2nd Embodiment of the thermoelectric conversion apparatus which concerns on this invention. The figure which shows the 1st modification of the thermoelectric conversion module shown by FIG. The figure which shows the 2nd modification of the thermoelectric conversion module shown by FIG. The figure which shows the 3rd modification of the thermoelectric conversion module shown by FIG. The figure which shows 3rd Embodiment of the thermoelectric conversion apparatus which concerns on this invention. The figure which shows 4th Embodiment of the thermoelectric conversion apparatus which concerns on this invention. The figure which shows 5th Embodiment of the thermoelectric conversion apparatus which concerns on this invention. The figure which shows 6th Embodiment of the thermoelectric conversion apparatus which concerns on this invention. The figure which shows 7th Embodiment of the thermoelectric conversion apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Thermoelectric conversion apparatus 11 Thermoelectric conversion module 12 High temperature side (heat absorption side) insulating substrate 13 Low temperature side (heat radiation side) insulating substrate 15 Thermoelectric conversion element group (thermoelectric conversion means)
16 P-type semiconductor (thermoelectric conversion element)
17 N-type semiconductor (thermoelectric conversion element)
18 Heat absorption side electrode 19 Heat radiation side electrode 20 Solder layer 21 Heat absorption surface 22 Heat radiation surface 23 Lead wire 30 Radiation prevention plates 33, 38 Space holding means 34 Bolt 35 Nut 36 Spacer 41 Sealed casing 45, 50 Thermoelectric conversion unit 46 Sealed casing 55 High temperature Side system 56 Low temperature system 57, 58, 59, 60 Joint surface (contact surface)

Claims (22)

Sandwiching a thermoelectric conversion element group in which a plurality of thermoelectric conversion elements are arranged in a matrix between the opposing heat absorption side insulating substrate and the heat dissipation side insulating substrate;
In the thermoelectric conversion module configured by attaching the heat absorption side electrode to the heat absorption surface of the thermoelectric conversion element and attaching the heat radiation side electrode to the heat dissipation surface, respectively, and connecting all the thermoelectric conversion elements electrically in series and thermally in parallel,
In order to reduce the amount of heat that does not pass through the thermoelectric conversion element due to radiation and convection, the inside of the thermoelectric conversion module is configured in a heat loss prevention structure,
The thermoelectric conversion module is formed by plating or painting a material having excellent heat conduction characteristics on at least one of the joint surfaces of each thermoelectric conversion element and the heat absorption side electrode and at least one of the joint surfaces of each thermoelectric conversion element and the heat radiation side electrode. A thin plate formed of a material having excellent heat conduction characteristics is formed on the bonding surface between each thermoelectric conversion element and the heat absorption side electrode and the bonding surface between each thermoelectric conversion element and the heat radiation side electrode. Let
Further, the high temperature side heat absorption surface of each thermoelectric conversion element has a degree of freedom by contact or bonding to the heat absorption side electrode and is not rigidly attached, and the low temperature side heat radiation surface of each thermoelectric conversion element is directly or directly on the heat radiation side electrode. It is attached integrally through the solder layer ,
In the heat loss prevention structure, a plurality of radiation prevention plates are arranged in multiple stages so as to divide an internal space formed by the high temperature side insulating substrate and the low temperature side insulating substrate into a plurality of flat small spaces. A thermoelectric conversion module characterized by being configured . 2. The thermoelectric conversion module according to claim 1, wherein the heat loss prevention structure is configured by a coating formed by applying or plating a material having a high thermal reflectance on an exposed surface inside the thermoelectric conversion module. The thermoelectric conversion module according to claim 1, wherein the heat loss prevention structure is configured by finishing the exposed surface inside the thermoelectric conversion module in a mirror state. In the heat loss prevention structure, a plurality of radiation prevention plates are arranged in a multistage shape in an internal space formed by a high temperature side insulating substrate and a low temperature side insulating substrate, and each radiation prevention plate is arranged at a predetermined interval by an interval holding means. The thermoelectric conversion module according to claim 1, which is held in a container. The spacing holding means bends the end portions of the radiation prevention plates arranged in a multi-stage shape at an acute angle, or cuts and raises the tongue pieces of the radiation prevention plate at an acute angle, and the tip of the bent portion or the cut and raised portion is formed. The thermoelectric conversion module according to claim 4 , wherein the thermoelectric conversion module is configured by contacting an adjacent radiation preventing plate. 2. The thermoelectric conversion module is housed in an airtight sealed casing, and at least one of the joint surfaces of the thermoelectric conversion module and the sealed casing is coated with a material having excellent heat conduction characteristics, or coated or thin by plating. The thermoelectric conversion module as described. The thermoelectric conversion module according to claim 1, wherein the thermoelectric conversion module is provided with a high temperature side system that absorbs radiant heat from a heat source on the heat absorption side, a low temperature side system is provided on the heat dissipation side, and heat is radiated from the low temperature side system to the outside. Conversion module. Sandwiching a thermoelectric conversion element group in which a plurality of thermoelectric conversion elements are arranged in a matrix between the opposing heat absorption side insulating substrate and the heat dissipation side insulating substrate;
In the thermoelectric conversion module constituted by attaching the heat absorption side electrode to the heat absorption surface of the thermoelectric conversion element and attaching the heat dissipation side electrode to the heat dissipation surface, respectively, and connecting all the thermoelectric conversion elements electrically in series and thermally in parallel,
In order to reduce the amount of heat that does not pass through the thermoelectric conversion element due to radiation and convection, the inside of the thermoelectric conversion module is configured in a heat loss prevention structure,
A thin plate made of a material having excellent heat conductivity on the bonding surface inside the thermoelectric conversion module, or by coating or plating a material having excellent heat conductivity on at least one of the bonding surfaces inside the thermoelectric conversion module Interpose
Further, the high temperature side heat absorption surface of each thermoelectric conversion element has a degree of freedom by contact or bonding to the heat absorption side electrode and is not rigidly attached, and the low temperature side heat radiation surface of each thermoelectric conversion element is directly or directly on the heat radiation side electrode. It is attached integrally through the solder layer ,
The heat loss prevention structure is characterized in that an internal space formed by a high-temperature side insulating substrate and a low-temperature side insulating substrate is formed by dividing a plurality of radiation prevention plates into flat small spaces in a multistage manner. module. The thermoelectric conversion module according to claim 8 , wherein a heat loss prevention structure is configured by applying or coating a material having a high thermal reflectance on the exposed surface inside the thermoelectric conversion module. The thermoelectric conversion module according to claim 8, wherein the exposed surface inside the thermoelectric conversion module is finished in a mirror state to form a heat loss prevention structure. The thermoelectric conversion module according to claim 8, wherein the plurality of radiation prevention plates are held at a predetermined interval in a multi-stage shape by an interval holding unit. The one thermoelectric conversion module to be stored in the sealed casing of the airtight structure, closed casing and at least one heat conduction properties of the bonding surface of the thermoelectric conversion module excellent material by coating or plating of claim 8 which has been subjected to coating Thermoelectric conversion module. The thermoelectric conversion module, a high-temperature-side line provided for absorbs radiant heat from the heat source to the heat-absorbing surface, the low temperature-side line provided on the heat radiating surface, according to claim 8, wherein the heat is radiated to the outside from the low temperature side line Thermoelectric conversion module. 14. The thermoelectric conversion module according to claim 13, wherein a coating film by coating or plating with a material having excellent thermal conductivity is formed on at least one of the joint surfaces with the high temperature side system and at least one of the joint surfaces with the low temperature side system. Thermoelectric conversion module. The thermoelectric conversion module according to claim 13, wherein the thermoelectric conversion module includes a thin plate having excellent heat conduction characteristics interposed between a joint surface with the high temperature side system and a joint surface with the low temperature side system. The thermoelectric conversion module according to claim 1 or 8 ,
A thermoelectric conversion device comprising a plurality of thermoelectric conversion modules to form a thermoelectric conversion unit. The thermoelectric conversion unit has a plurality of thermoelectric conversion modules stored in a hermetically sealed casing.
The thermoelectric conversion device according to claim 16, wherein a coating or a thin plate is applied to a joint surface between the sealed casing and each thermoelectric conversion module from a material having excellent heat conduction characteristics. 18. The thermoelectric conversion device according to claim 17, wherein the thermoelectric conversion unit is configured to have a heat loss prevention structure by coating a surface exposed inside each thermoelectric conversion module with a material having high heat reflectance by coating or plating. Heat is applied to at least one of the joint surface between the thermoelectric conversion unit and the high temperature side system that receives radiant heat emitted from the heat source, and at least one of the joint surface between the thermoelectric conversion unit and the low temperature side system that wastes the received heat. The thermoelectric conversion device according to claim 17, wherein the coating film is formed by painting or plating a material having excellent conduction characteristics. The thermoelectric conversion device according to claim 17, wherein a thin plate made of a material having excellent heat conduction characteristics is interposed on a joint surface between the thermoelectric conversion unit and the high temperature side system and a joint surface between the thermoelectric conversion unit and the low temperature side system. The thermoelectric conversion device according to claim 17 , wherein heat treatment is performed on a joint surface between the thermoelectric conversion unit or thermoelectric conversion module and the high-temperature side system to increase a contact area of the joint surface. The thermoelectric conversion device according to claim 17 or 20, wherein a heat treatment is performed on a joint surface between the thermoelectric conversion unit or thermoelectric conversion module and the low-temperature system to increase a contact area of the joint surface.

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