JPS6310599B2 - - Google Patents

Info

Publication number
JPS6310599B2
JPS6310599B2 JP58218069A JP21806983A JPS6310599B2 JP S6310599 B2 JPS6310599 B2 JP S6310599B2 JP 58218069 A JP58218069 A JP 58218069A JP 21806983 A JP21806983 A JP 21806983A JP S6310599 B2 JPS6310599 B2 JP S6310599B2
Authority
JP
Japan
Prior art keywords
hole
layer
printed wiring
protective layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58218069A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60110196A (ja
Inventor
Tei Kobayashi
Hiromaru Higuchi
Makoto Kuranaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58218069A priority Critical patent/JPS60110196A/ja
Publication of JPS60110196A publication Critical patent/JPS60110196A/ja
Publication of JPS6310599B2 publication Critical patent/JPS6310599B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP58218069A 1983-11-18 1983-11-18 スルホ−ル印刷配線板 Granted JPS60110196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58218069A JPS60110196A (ja) 1983-11-18 1983-11-18 スルホ−ル印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58218069A JPS60110196A (ja) 1983-11-18 1983-11-18 スルホ−ル印刷配線板

Publications (2)

Publication Number Publication Date
JPS60110196A JPS60110196A (ja) 1985-06-15
JPS6310599B2 true JPS6310599B2 (https=) 1988-03-08

Family

ID=16714158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58218069A Granted JPS60110196A (ja) 1983-11-18 1983-11-18 スルホ−ル印刷配線板

Country Status (1)

Country Link
JP (1) JPS60110196A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427182Y2 (https=) * 1986-11-07 1992-06-30
JP3038144B2 (ja) * 1995-12-25 2000-05-08 北陸電気工業株式会社 回路基板

Also Published As

Publication number Publication date
JPS60110196A (ja) 1985-06-15

Similar Documents

Publication Publication Date Title
US5030800A (en) Printed wiring board with an electronic wave shielding layer
US6169253B1 (en) Solder resist window configurations for solder paste overprinting
US20080302257A1 (en) Legend printing stencil and method for manufacturing printed circuit boards using the same
US5100695A (en) Method of manufacturing a printed circuit board
US5886878A (en) Printed circuit board manufacturing method for through hole components with a metal case
JPS6310599B2 (https=)
US5219607A (en) Method of manufacturing printed circuit board
JPH06112633A (ja) 回路用基板
JPH0430494A (ja) 印刷配線板及びその製造法
JPH11238993A (ja) 部品実装プリント基板及び部品実装プリント基板の実装方法
JPH0738239A (ja) フレキシブルプリント配線板
JP3200754B2 (ja) 半導体装置の製造方法
JPH11204897A (ja) 印刷回路基板
JPH01217994A (ja) 印刷配線板
KR900004079Y1 (ko) 프린트 배선 기판
EP0375954B1 (en) Method of manufacturing printed circuit board
JPH11150346A (ja) 配線基板
JPH02177590A (ja) プリント配線板
JPS5917295A (ja) 印刷配線基板
JPH06216508A (ja) プリント配線板
JPS6399594A (ja) プリント配線基板の製造方法
JPH0529177U (ja) 配線基板
JPS63181499A (ja) プリント配線板
JPS63204790A (ja) プリント配線板
JPS6393194A (ja) マスキングテ−プを用いた部品実装方法