JPS6310578B2 - - Google Patents

Info

Publication number
JPS6310578B2
JPS6310578B2 JP54060898A JP6089879A JPS6310578B2 JP S6310578 B2 JPS6310578 B2 JP S6310578B2 JP 54060898 A JP54060898 A JP 54060898A JP 6089879 A JP6089879 A JP 6089879A JP S6310578 B2 JPS6310578 B2 JP S6310578B2
Authority
JP
Japan
Prior art keywords
layer
capacitance
bonding pad
substrate
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54060898A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55151359A (en
Inventor
Junichi Nishizawa
Kenji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP6089879A priority Critical patent/JPS55151359A/ja
Publication of JPS55151359A publication Critical patent/JPS55151359A/ja
Publication of JPS6310578B2 publication Critical patent/JPS6310578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
JP6089879A 1979-05-16 1979-05-16 Semiconductor device Granted JPS55151359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6089879A JPS55151359A (en) 1979-05-16 1979-05-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6089879A JPS55151359A (en) 1979-05-16 1979-05-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55151359A JPS55151359A (en) 1980-11-25
JPS6310578B2 true JPS6310578B2 (enrdf_load_stackoverflow) 1988-03-08

Family

ID=13155628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6089879A Granted JPS55151359A (en) 1979-05-16 1979-05-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55151359A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146060U (enrdf_load_stackoverflow) * 1989-05-16 1990-12-11

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166039A (en) * 1981-04-06 1982-10-13 Toshiba Corp Semiconductor device and its manufacture
JPS5833876A (ja) * 1981-08-25 1983-02-28 Toshiba Corp 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177058U (enrdf_load_stackoverflow) * 1974-12-11 1976-06-17
JPS5185652U (enrdf_load_stackoverflow) * 1974-12-27 1976-07-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146060U (enrdf_load_stackoverflow) * 1989-05-16 1990-12-11

Also Published As

Publication number Publication date
JPS55151359A (en) 1980-11-25

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