JPS55151359A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55151359A JPS55151359A JP6089879A JP6089879A JPS55151359A JP S55151359 A JPS55151359 A JP S55151359A JP 6089879 A JP6089879 A JP 6089879A JP 6089879 A JP6089879 A JP 6089879A JP S55151359 A JPS55151359 A JP S55151359A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- pad
- type
- reduce
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000010408 film Substances 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 230000003071 parasitic effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6089879A JPS55151359A (en) | 1979-05-16 | 1979-05-16 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6089879A JPS55151359A (en) | 1979-05-16 | 1979-05-16 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55151359A true JPS55151359A (en) | 1980-11-25 |
JPS6310578B2 JPS6310578B2 (enrdf_load_stackoverflow) | 1988-03-08 |
Family
ID=13155628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6089879A Granted JPS55151359A (en) | 1979-05-16 | 1979-05-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55151359A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57166039A (en) * | 1981-04-06 | 1982-10-13 | Toshiba Corp | Semiconductor device and its manufacture |
JPS5833876A (ja) * | 1981-08-25 | 1983-02-28 | Toshiba Corp | 半導体装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02146060U (enrdf_load_stackoverflow) * | 1989-05-16 | 1990-12-11 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177058U (enrdf_load_stackoverflow) * | 1974-12-11 | 1976-06-17 | ||
JPS5185652U (enrdf_load_stackoverflow) * | 1974-12-27 | 1976-07-09 |
-
1979
- 1979-05-16 JP JP6089879A patent/JPS55151359A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177058U (enrdf_load_stackoverflow) * | 1974-12-11 | 1976-06-17 | ||
JPS5185652U (enrdf_load_stackoverflow) * | 1974-12-27 | 1976-07-09 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57166039A (en) * | 1981-04-06 | 1982-10-13 | Toshiba Corp | Semiconductor device and its manufacture |
JPS5833876A (ja) * | 1981-08-25 | 1983-02-28 | Toshiba Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6310578B2 (enrdf_load_stackoverflow) | 1988-03-08 |
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