JPS63105325U - - Google Patents

Info

Publication number
JPS63105325U
JPS63105325U JP1986200044U JP20004486U JPS63105325U JP S63105325 U JPS63105325 U JP S63105325U JP 1986200044 U JP1986200044 U JP 1986200044U JP 20004486 U JP20004486 U JP 20004486U JP S63105325 U JPS63105325 U JP S63105325U
Authority
JP
Japan
Prior art keywords
electronic component
surface mounting
solder
heated
adhesive force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986200044U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986200044U priority Critical patent/JPS63105325U/ja
Priority to GB8729741A priority patent/GB2200801B/en
Priority to CA000554929A priority patent/CA1278876C/en
Priority to FR8718143A priority patent/FR2609232B1/en
Priority to US07/138,237 priority patent/US4873397A/en
Priority to DE19873744290 priority patent/DE3744290A1/en
Publication of JPS63105325U publication Critical patent/JPS63105325U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る表面実装用電子部品の一
例を示す仰角斜視図、第２図は同部品を搬送テー
プに収容した状態の側断面図、第３図は同部品の
実装工程を示す説明図である。 １：部品本体、２，３：外部端子、４：高分子
膜層、５，６：半田層。 Fig. 1 is an elevational perspective view showing an example of a surface-mounted electronic component according to the present invention, Fig. 2 is a side sectional view of the part housed in a transport tape, and Fig. 3 shows the mounting process of the part. It is an explanatory diagram. 1: Part body, 2, 3: External terminal, 4: Polymer film layer, 5, 6: Solder layer.

Claims (1)

【実用新案登録請求の範囲】 (1) 外部端子を除く部品本体の装着面に加熱で
粘着力を発生する高分子膜層を設けてなることを
特徴とする表面実装用電子部品。 (2) 上記高分子膜層が、８０℃程度の加熱で粘
着力を発生するシリコンまたはアクリル系の高分
子材料で設けられているところの実用新案登録請
求の範囲第１項記載の表面実装用電子部品。 (3) 上記外部端子が、半田層を備えているとこ
ろの実用新案登録請求の範囲第１項記載の表面実
装用電子部品。 (4) 上記半田層が、１００℃程度で半田付け可
能で１３０℃以上で再溶融する半田で形成されて
いるところの実用新案登録請求の範囲第３項記載
の表面実装用電子部品。[Scope of Claim for Utility Model Registration] (1) An electronic component for surface mounting, characterized in that a polymer film layer that generates adhesive force when heated is provided on the mounting surface of the component body, excluding external terminals. (2) The surface mount device according to claim 1, wherein the polymer film layer is made of a silicone or acrylic polymer material that generates adhesive force when heated to about 80°C. electronic components. (3) The surface mounting electronic component according to claim 1, wherein the external terminal includes a solder layer. (4) The surface mounting electronic component according to claim 3, wherein the solder layer is formed of a solder that can be soldered at about 100°C and remelted at 130°C or higher.
JP1986200044U 1986-12-25 1986-12-25 Pending JPS63105325U (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1986200044U JPS63105325U (en) 1986-12-25 1986-12-25
GB8729741A GB2200801B (en) 1986-12-25 1987-12-21 Electronic circuit element
CA000554929A CA1278876C (en) 1986-12-25 1987-12-21 Adhesive mounted electronic circuit element
FR8718143A FR2609232B1 (en) 1986-12-25 1987-12-24 ELECTRONIC CIRCUIT ELEMENT
US07/138,237 US4873397A (en) 1986-12-25 1987-12-28 Electronic circuit element
DE19873744290 DE3744290A1 (en) 1986-12-25 1987-12-28 ELECTRONIC COMPONENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986200044U JPS63105325U (en) 1986-12-25 1986-12-25

Publications (1)

Publication Number Publication Date
JPS63105325U true JPS63105325U (en) 1988-07-08

Family

ID=31162216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986200044U Pending JPS63105325U (en) 1986-12-25 1986-12-25

Country Status (1)

Country Link
JP (1) JPS63105325U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03131010A (en) * 1989-10-17 1991-06-04 Marcon Electron Co Ltd Laminated film capacitor
JP2014112712A (en) * 2012-05-30 2014-06-19 Samsung Electro-Mechanics Co Ltd Packaging unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57148311A (en) * 1981-02-10 1982-09-13 Bosch Gmbh Robert Constituent with planar contactor and method of securing same element to circuit board
JPS5820559B2 (en) * 1977-01-17 1983-04-23 株式会社椿本チエイン Induction motor speed control device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820559B2 (en) * 1977-01-17 1983-04-23 株式会社椿本チエイン Induction motor speed control device
JPS57148311A (en) * 1981-02-10 1982-09-13 Bosch Gmbh Robert Constituent with planar contactor and method of securing same element to circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03131010A (en) * 1989-10-17 1991-06-04 Marcon Electron Co Ltd Laminated film capacitor
JP2014112712A (en) * 2012-05-30 2014-06-19 Samsung Electro-Mechanics Co Ltd Packaging unit
US9576728B2 (en) 2012-05-30 2017-02-21 Samsung Electro-Mechanics Co., Ltd. Laminated chip electronic component, board for mounting the same, and packing unit thereof

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