JPH0162666U - - Google Patents
Info
- Publication number
- JPH0162666U JPH0162666U JP15709887U JP15709887U JPH0162666U JP H0162666 U JPH0162666 U JP H0162666U JP 15709887 U JP15709887 U JP 15709887U JP 15709887 U JP15709887 U JP 15709887U JP H0162666 U JPH0162666 U JP H0162666U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- circuit
- circuit board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図ａ〜ｃは本考案混成集積回路装置の一実
施例を説明する製造工程図、第２図は本考案の他
の実施例を示す混成集積回路装置の側面図、第３
図および第４図は本考案の混成集積回路装置が用
いるクリツプ端子の構造断面図である。
１……セラミツグ基板、２……多層回路、３…
…フリツプチツプ、４……半田バンプ、５……ク
リツプ端子、６……Ａｇ系接着剤、７……シリコ
ーン樹脂、８……絶縁性接着剤。
1A to 1C are manufacturing process diagrams illustrating one embodiment of the hybrid integrated circuit device of the present invention, FIG. 2 is a side view of the hybrid integrated circuit device showing another embodiment of the present invention, and FIG.
4 and 4 are structural sectional views of a clip terminal used in the hybrid integrated circuit device of the present invention. 1... Ceramic substrate, 2... Multilayer circuit, 3...
...Flip chip, 4...Solder bump, 5...Clip terminal, 6...Ag adhesive, 7...Silicone resin, 8...Insulating adhesive.
Claims (1)
フリツプチツプを搭載する混成集積回路基板と、
前記回路基板を挿入するクリツプ端子とが接着剤
で固定されることを特徴とする混成集積回路装置
。 a hybrid integrated circuit board on which a circuit is formed using film technology and a flip chip is mounted on the circuit;
A hybrid integrated circuit device characterized in that the clip terminal into which the circuit board is inserted is fixed with an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709887U JPH0162666U (en) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709887U JPH0162666U (en) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0162666U true JPH0162666U (en) | 1989-04-21 |
Family
ID=31436242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15709887U Pending JPH0162666U (en) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0162666U (en) |
-
1987
- 1987-10-13 JP JP15709887U patent/JPH0162666U/ja active Pending
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