JPS63102314A - 多層レジストプロセスにおけるアライメント方法 - Google Patents
多層レジストプロセスにおけるアライメント方法Info
- Publication number
- JPS63102314A JPS63102314A JP61248790A JP24879086A JPS63102314A JP S63102314 A JPS63102314 A JP S63102314A JP 61248790 A JP61248790 A JP 61248790A JP 24879086 A JP24879086 A JP 24879086A JP S63102314 A JPS63102314 A JP S63102314A
- Authority
- JP
- Japan
- Prior art keywords
- alignment
- semiconductor wafer
- resist layer
- alignment mark
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 25
- 230000003287 optical effect Effects 0.000 abstract description 8
- 238000007796 conventional method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61248790A JPS63102314A (ja) | 1986-10-20 | 1986-10-20 | 多層レジストプロセスにおけるアライメント方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61248790A JPS63102314A (ja) | 1986-10-20 | 1986-10-20 | 多層レジストプロセスにおけるアライメント方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63102314A true JPS63102314A (ja) | 1988-05-07 |
| JPH0565048B2 JPH0565048B2 (enrdf_load_stackoverflow) | 1993-09-16 |
Family
ID=17183435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61248790A Granted JPS63102314A (ja) | 1986-10-20 | 1986-10-20 | 多層レジストプロセスにおけるアライメント方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102314A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536837U (ja) * | 1991-10-14 | 1993-05-18 | 株式会社アドバンテスト | ウエーハｏｆ位置検出装置 |
-
1986
- 1986-10-20 JP JP61248790A patent/JPS63102314A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536837U (ja) * | 1991-10-14 | 1993-05-18 | 株式会社アドバンテスト | ウエーハｏｆ位置検出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0565048B2 (enrdf_load_stackoverflow) | 1993-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4376581A (en) | Method of positioning disk-shaped workpieces, preferably semiconductor wafers | |
| JPS6324618A (ja) | 露光方法 | |
| KR19990088024A (ko) | 반도체디바이스및그정렬방법 | |
| GB2034059A (en) | Manufacture of integrated circuits | |
| JPH021241B2 (enrdf_load_stackoverflow) | ||
| US4461567A (en) | Method of and apparatus for the positioning of disk-shaped workpieces, particularly semiconductor wafers | |
| JPS63102314A (ja) | 多層レジストプロセスにおけるアライメント方法 | |
| JP2659203B2 (ja) | パターン形成方法 | |
| JPH07111952B2 (ja) | ホトリソグラフィー工程におけるガラスマスク | |
| KR0186077B1 (ko) | 반도체 웨이퍼의 주변노광용 마스크 및 이를 이용한 주변노광방법 | |
| JPH03177013A (ja) | 半導体装置の製造方法 | |
| JPS6254434A (ja) | 露光方法 | |
| JP2835746B2 (ja) | ウェーハの周辺露光装置 | |
| JPS5931852B2 (ja) | フォトレジスト露光用マスク | |
| JPH021110A (ja) | 露光用マスク及び露光方法 | |
| JPS6246522A (ja) | 高速アライメント露光方法 | |
| JPS5986221A (ja) | 特殊基準マ−クを用いたマスクのアライメント方法 | |
| JPS63275115A (ja) | 半導体装置のパタ−ン形成方法 | |
| JPS60224224A (ja) | マスクアライメント方法 | |
| JPH04287909A (ja) | ウエハのアライメント方法 | |
| JPH0513308A (ja) | 半導体装置の製造方法 | |
| JP2000294493A (ja) | フォトマスクの位置合わせ方法と位置合わせユニット | |
| JPH0282517A (ja) | パターン形成方法 | |
| JPH0437113A (ja) | 縮小投影露光装置 | |
| JPS61256635A (ja) | 半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |