JPS629741Y2 - - Google Patents

Info

Publication number
JPS629741Y2
JPS629741Y2 JP1980172970U JP17297080U JPS629741Y2 JP S629741 Y2 JPS629741 Y2 JP S629741Y2 JP 1980172970 U JP1980172970 U JP 1980172970U JP 17297080 U JP17297080 U JP 17297080U JP S629741 Y2 JPS629741 Y2 JP S629741Y2
Authority
JP
Japan
Prior art keywords
package
semiconductor chip
clip
semiconductor device
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980172970U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5794959U (ru
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980172970U priority Critical patent/JPS629741Y2/ja
Publication of JPS5794959U publication Critical patent/JPS5794959U/ja
Application granted granted Critical
Publication of JPS629741Y2 publication Critical patent/JPS629741Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1980172970U 1980-12-02 1980-12-02 Expired JPS629741Y2 (ru)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980172970U JPS629741Y2 (ru) 1980-12-02 1980-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980172970U JPS629741Y2 (ru) 1980-12-02 1980-12-02

Publications (2)

Publication Number Publication Date
JPS5794959U JPS5794959U (ru) 1982-06-11
JPS629741Y2 true JPS629741Y2 (ru) 1987-03-06

Family

ID=29531244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980172970U Expired JPS629741Y2 (ru) 1980-12-02 1980-12-02

Country Status (1)

Country Link
JP (1) JPS629741Y2 (ru)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0331085Y2 (ru) * 1985-05-07 1991-07-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315787A (en) * 1976-07-28 1978-02-14 Fujitsu Ltd Integrated circuit package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315787A (en) * 1976-07-28 1978-02-14 Fujitsu Ltd Integrated circuit package

Also Published As

Publication number Publication date
JPS5794959U (ru) 1982-06-11

Similar Documents

Publication Publication Date Title
KR920008248B1 (ko) 반도체장치
EP0785575A2 (en) Semiconductor device and semiconductor module
ITMI952508A1 (it) Componente elettronico pluripolare montabile sulla superficie
KR980006174A (ko) 버틈 리드 패키지
JPS629741Y2 (ru)
JP2705030B2 (ja) リードフレームおよび放熱板および半導体装置
JPS6130742B2 (ru)
JPH0878461A (ja) 放熱板付き半導体装置及びその製造方法
JPS6329413B2 (ru)
JPH05206315A (ja) 半導体装置
JPS6138193Y2 (ru)
JPS6018848Y2 (ja) 樹脂モ−ルド型半導体装置用リ−ドフレ−ム
JPS638618B2 (ru)
KR100273226B1 (ko) 버텀리드패키지
JPS59110146A (ja) パツケ−ジ形モジユ−ルの外部引出し端子
JP2944588B2 (ja) 半導体装置及び半導体装置用リードフレーム
JPS6130426B2 (ru)
JPS6240449Y2 (ru)
JPS6130287Y2 (ru)
KR100206886B1 (ko) 컬럼형 패키지
JPH0357259A (ja) 半導体装置
JPS6057655A (ja) 半導体装置
JPS5926603Y2 (ja) ハイブリッド・イグナイタ−
JP2561470Y2 (ja) 絶縁封止電子部品
JPH04171848A (ja) 半導体装置