JPS629718Y2 - - Google Patents

Info

Publication number
JPS629718Y2
JPS629718Y2 JP483382U JP483382U JPS629718Y2 JP S629718 Y2 JPS629718 Y2 JP S629718Y2 JP 483382 U JP483382 U JP 483382U JP 483382 U JP483382 U JP 483382U JP S629718 Y2 JPS629718 Y2 JP S629718Y2
Authority
JP
Japan
Prior art keywords
plunger
actuator
molds
loading frame
detection means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP483382U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58118735U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP483382U priority Critical patent/JPS58118735U/ja
Publication of JPS58118735U publication Critical patent/JPS58118735U/ja
Application granted granted Critical
Publication of JPS629718Y2 publication Critical patent/JPS629718Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP483382U 1982-01-18 1982-01-18 トランスフア−成形装置 Granted JPS58118735U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP483382U JPS58118735U (ja) 1982-01-18 1982-01-18 トランスフア−成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP483382U JPS58118735U (ja) 1982-01-18 1982-01-18 トランスフア−成形装置

Publications (2)

Publication Number Publication Date
JPS58118735U JPS58118735U (ja) 1983-08-13
JPS629718Y2 true JPS629718Y2 (enrdf_load_html_response) 1987-03-06

Family

ID=30017663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP483382U Granted JPS58118735U (ja) 1982-01-18 1982-01-18 トランスフア−成形装置

Country Status (1)

Country Link
JP (1) JPS58118735U (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101353542B1 (ko) * 2012-05-21 2014-01-27 한국기계연구원 미소 시험편 축 정렬 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101353542B1 (ko) * 2012-05-21 2014-01-27 한국기계연구원 미소 시험편 축 정렬 장치

Also Published As

Publication number Publication date
JPS58118735U (ja) 1983-08-13

Similar Documents

Publication Publication Date Title
WO1999050908A1 (fr) Procede de fabrication de dispositif a semi-conducteur, appareil pour le moulage de dispositif a semi-conducteur et semi-conducteur
JPS629718Y2 (enrdf_load_html_response)
JPS629719Y2 (enrdf_load_html_response)
JPH043498Y2 (enrdf_load_html_response)
JPS6457724A (en) Resin seal device for semiconductor
JPH0339218Y2 (enrdf_load_html_response)
JP2670171B2 (ja) 封止用金型の型締装置
JPH1131705A (ja) 半導体装置の樹脂封止装置及び樹脂封止方法
JPH02163946A (ja) 半導体チップのモールドプレス方法
JPH053289Y2 (enrdf_load_html_response)
JP2808779B2 (ja) 半導体素子の樹脂封入成形機
JPH06143379A (ja) 樹脂成形機における異物検出方法
JPH05192959A (ja) 電子部品の樹脂封止部成形装置
JPH01312862A (ja) 半導体装置のリード成形装置
JP2502387B2 (ja) 半導体素子の樹脂封止方法及び樹脂封止金型
JP3562209B2 (ja) インサート成形機構
JP3005974B2 (ja) 電子部品の樹脂封止部成形装置
JP3038694B2 (ja) 電子部品の樹脂封止部成形装置
JP4052953B2 (ja) 半導体装置の樹脂封止装置およびその樹脂封止方法
JPH06315956A (ja) 樹脂封止装置
JPS6395636A (ja) 半導体装置の樹脂封止装置
JP2566391Y2 (ja) 半導体のモールド金型
JPH0620578Y2 (ja) 半導体射出成型機
JPH11176857A (ja) 樹脂封止用金型装置、樹脂封止方法及び樹脂封止用金型装置におけるトランスファ機構
JPS62161514A (ja) トランスフア成形方法および装置