JPS6293070A - 半田リボン圧着方法及びその装置 - Google Patents

半田リボン圧着方法及びその装置

Info

Publication number
JPS6293070A
JPS6293070A JP23210885A JP23210885A JPS6293070A JP S6293070 A JPS6293070 A JP S6293070A JP 23210885 A JP23210885 A JP 23210885A JP 23210885 A JP23210885 A JP 23210885A JP S6293070 A JPS6293070 A JP S6293070A
Authority
JP
Japan
Prior art keywords
tool
ribbon
solder ribbon
solder
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23210885A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338949B2 (US08124317-20120228-C00026.png
Inventor
Yasunobu Suzuki
鈴木　安信
Hiroshi Ushiki
博 丑木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP23210885A priority Critical patent/JPS6293070A/ja
Publication of JPS6293070A publication Critical patent/JPS6293070A/ja
Publication of JPH0338949B2 publication Critical patent/JPH0338949B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP23210885A 1985-10-17 1985-10-17 半田リボン圧着方法及びその装置 Granted JPS6293070A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23210885A JPS6293070A (ja) 1985-10-17 1985-10-17 半田リボン圧着方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23210885A JPS6293070A (ja) 1985-10-17 1985-10-17 半田リボン圧着方法及びその装置

Publications (2)

Publication Number Publication Date
JPS6293070A true JPS6293070A (ja) 1987-04-28
JPH0338949B2 JPH0338949B2 (US08124317-20120228-C00026.png) 1991-06-12

Family

ID=16934130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23210885A Granted JPS6293070A (ja) 1985-10-17 1985-10-17 半田リボン圧着方法及びその装置

Country Status (1)

Country Link
JP (1) JPS6293070A (US08124317-20120228-C00026.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017051989A (ja) * 2015-09-11 2017-03-16 株式会社アンド 半田付け装置
WO2018232374A1 (en) * 2017-06-16 2018-12-20 Indium Corporation Solder ribbon with embedded mesh for improved reliability of semiconductor die to substrate attachment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629670U (US08124317-20120228-C00026.png) * 1979-08-08 1981-03-20
JPS595496U (ja) * 1982-07-02 1984-01-13 三菱重工業株式会社 二重反転プロペラ装置
JPS60166190A (ja) * 1984-02-07 1985-08-29 Chobe Taguchi 熱歪変形の防止法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629670B2 (US08124317-20120228-C00026.png) * 1972-11-08 1981-07-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629670U (US08124317-20120228-C00026.png) * 1979-08-08 1981-03-20
JPS595496U (ja) * 1982-07-02 1984-01-13 三菱重工業株式会社 二重反転プロペラ装置
JPS60166190A (ja) * 1984-02-07 1985-08-29 Chobe Taguchi 熱歪変形の防止法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017051989A (ja) * 2015-09-11 2017-03-16 株式会社アンド 半田付け装置
WO2018232374A1 (en) * 2017-06-16 2018-12-20 Indium Corporation Solder ribbon with embedded mesh for improved reliability of semiconductor die to substrate attachment

Also Published As

Publication number Publication date
JPH0338949B2 (US08124317-20120228-C00026.png) 1991-06-12

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