JPS6280907A - 導電ペ−スト - Google Patents

導電ペ−スト

Info

Publication number
JPS6280907A
JPS6280907A JP61092669A JP9266986A JPS6280907A JP S6280907 A JPS6280907 A JP S6280907A JP 61092669 A JP61092669 A JP 61092669A JP 9266986 A JP9266986 A JP 9266986A JP S6280907 A JPS6280907 A JP S6280907A
Authority
JP
Japan
Prior art keywords
powder
silver
fine
copper
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61092669A
Other languages
English (en)
Japanese (ja)
Other versions
JPH051562B2 (enExample
Inventor
孝志 荘司
落合　健治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of JPS6280907A publication Critical patent/JPS6280907A/ja
Publication of JPH051562B2 publication Critical patent/JPH051562B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP61092669A 1985-04-23 1986-04-22 導電ペ−スト Granted JPS6280907A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8686785 1985-04-23
JP60-86867 1985-04-23

Publications (2)

Publication Number Publication Date
JPS6280907A true JPS6280907A (ja) 1987-04-14
JPH051562B2 JPH051562B2 (enExample) 1993-01-08

Family

ID=13898768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61092669A Granted JPS6280907A (ja) 1985-04-23 1986-04-22 導電ペ−スト

Country Status (1)

Country Link
JP (1) JPS6280907A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991013445A1 (en) * 1990-02-23 1991-09-05 Asahi Kasei Kogyo Kabushiki Kaisha Copper alloy composition
JPH04359069A (ja) * 1991-06-05 1992-12-11 Fukuda Metal Foil & Powder Co Ltd 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
JPH05222546A (ja) * 1992-02-07 1993-08-31 Narumi China Corp 銀ペースト
JPH0715022A (ja) * 1993-06-16 1995-01-17 Hokuriku Toryo Kk 太陽電池用電極
JP2007327140A (ja) * 2002-08-20 2007-12-20 Primet Technology Inc 防錆剤
JPWO2007083811A1 (ja) * 2006-01-23 2009-06-18 日立金属株式会社 導体ペースト、多層セラミック基板及び多層セラミック基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132502A (ja) * 1983-01-20 1984-07-30 住友金属鉱山株式会社 導電被膜形成用組成物
JPS59146103A (ja) * 1983-02-09 1984-08-21 昭和電工株式会社 ドツテイングペ−スト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132502A (ja) * 1983-01-20 1984-07-30 住友金属鉱山株式会社 導電被膜形成用組成物
JPS59146103A (ja) * 1983-02-09 1984-08-21 昭和電工株式会社 ドツテイングペ−スト

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991013445A1 (en) * 1990-02-23 1991-09-05 Asahi Kasei Kogyo Kabushiki Kaisha Copper alloy composition
US5242511A (en) * 1990-02-23 1993-09-07 Asahi Kasei Kogyo Kabushiki Kaisha Copper alloy compositions
JPH04359069A (ja) * 1991-06-05 1992-12-11 Fukuda Metal Foil & Powder Co Ltd 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
JPH05222546A (ja) * 1992-02-07 1993-08-31 Narumi China Corp 銀ペースト
JPH0715022A (ja) * 1993-06-16 1995-01-17 Hokuriku Toryo Kk 太陽電池用電極
JP2007327140A (ja) * 2002-08-20 2007-12-20 Primet Technology Inc 防錆剤
JPWO2007083811A1 (ja) * 2006-01-23 2009-06-18 日立金属株式会社 導体ペースト、多層セラミック基板及び多層セラミック基板の製造方法
JP4507012B2 (ja) * 2006-01-23 2010-07-21 日立金属株式会社 多層セラミック基板

Also Published As

Publication number Publication date
JPH051562B2 (enExample) 1993-01-08

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