JPH0368483B2 - - Google Patents

Info

Publication number
JPH0368483B2
JPH0368483B2 JP60086241A JP8624185A JPH0368483B2 JP H0368483 B2 JPH0368483 B2 JP H0368483B2 JP 60086241 A JP60086241 A JP 60086241A JP 8624185 A JP8624185 A JP 8624185A JP H0368483 B2 JPH0368483 B2 JP H0368483B2
Authority
JP
Japan
Prior art keywords
copper
powder
fine
silver
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60086241A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61245406A (ja
Inventor
Takashi Shoji
Kenji Ochiai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP60086241A priority Critical patent/JPS61245406A/ja
Publication of JPS61245406A publication Critical patent/JPS61245406A/ja
Publication of JPH0368483B2 publication Critical patent/JPH0368483B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP60086241A 1985-04-24 1985-04-24 導電ペ−スト Granted JPS61245406A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60086241A JPS61245406A (ja) 1985-04-24 1985-04-24 導電ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60086241A JPS61245406A (ja) 1985-04-24 1985-04-24 導電ペ−スト

Publications (2)

Publication Number Publication Date
JPS61245406A JPS61245406A (ja) 1986-10-31
JPH0368483B2 true JPH0368483B2 (enExample) 1991-10-28

Family

ID=13881307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60086241A Granted JPS61245406A (ja) 1985-04-24 1985-04-24 導電ペ−スト

Country Status (1)

Country Link
JP (1) JPS61245406A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61288308A (ja) * 1985-06-13 1986-12-18 住友金属鉱山株式会社 厚膜導体組成物
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト

Also Published As

Publication number Publication date
JPS61245406A (ja) 1986-10-31

Similar Documents

Publication Publication Date Title
JPS6254206B2 (enExample)
KR960001353B1 (ko) 다층 전자 회로의 제조방법
JP2793912B2 (ja) 熱サイクル接着性およびエージング接着性の高い銀に富む導電体組成物
US5165986A (en) Copper conductive composition for use on aluminum nitride substrate
JPH0334162B2 (enExample)
JPS62104878A (ja) 磁製化金属基板用の銅含有導電塗料
JPS61248302A (ja) 炭化ケイ素焼結体用メタライズペ−スト
CN1608298B (zh) 导体合成物在电路中的使用
KR100585909B1 (ko) 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물
JPH051562B2 (enExample)
JP2822518B2 (ja) 窒化アルミニウム焼結体への金属化層形成方法
JPH0368483B2 (enExample)
GB2103250A (en) Silver-filled glass
JPH0368486B2 (enExample)
TW202015073A (zh) 用於氮化矽和其他基板的導電厚膜漿料
JPH0367281B2 (enExample)
JP2918642B2 (ja) 導電ペースト
JPH0572681B2 (enExample)
JPH0368487B2 (enExample)
JPH0367283B2 (enExample)
JPH05156303A (ja) メタライズ用金属粉末組成物,それを用いたメタライズ基板及びメタライズ基板の製造方法
JPH10233119A (ja) 銅導体ペースト及び該銅導体ペーストを印刷した基板
JP2670679B2 (ja) メタライズ組成物
JPH026096A (ja) 金属―セラミックス接合用ろう材ペースト及び電子部品
JP3134234B2 (ja) メタライズ基板及びその製造方法