JPH0367283B2 - - Google Patents
Info
- Publication number
- JPH0367283B2 JPH0367283B2 JP60086240A JP8624085A JPH0367283B2 JP H0367283 B2 JPH0367283 B2 JP H0367283B2 JP 60086240 A JP60086240 A JP 60086240A JP 8624085 A JP8624085 A JP 8624085A JP H0367283 B2 JPH0367283 B2 JP H0367283B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- fine
- silver
- copper
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/30—
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60086240A JPS61245405A (ja) | 1985-04-24 | 1985-04-24 | 導電ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60086240A JPS61245405A (ja) | 1985-04-24 | 1985-04-24 | 導電ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61245405A JPS61245405A (ja) | 1986-10-31 |
| JPH0367283B2 true JPH0367283B2 (enExample) | 1991-10-22 |
Family
ID=13881278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60086240A Granted JPS61245405A (ja) | 1985-04-24 | 1985-04-24 | 導電ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61245405A (enExample) |
-
1985
- 1985-04-24 JP JP60086240A patent/JPS61245405A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61245405A (ja) | 1986-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6254206B2 (enExample) | ||
| US4172919A (en) | Copper conductor compositions containing copper oxide and Bi2 O3 | |
| US5165986A (en) | Copper conductive composition for use on aluminum nitride substrate | |
| JPH0334162B2 (enExample) | ||
| US4004057A (en) | Gold conductor compositions | |
| JPH0653594B2 (ja) | 導体組成物 | |
| JPS5873904A (ja) | 銀充填ガラス | |
| US3970590A (en) | Gold conductor compositions | |
| JPS61248302A (ja) | 炭化ケイ素焼結体用メタライズペ−スト | |
| KR100585909B1 (ko) | 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물 | |
| JP2822518B2 (ja) | 窒化アルミニウム焼結体への金属化層形成方法 | |
| JPS6280907A (ja) | 導電ペ−スト | |
| GB2103250A (en) | Silver-filled glass | |
| JPH04277406A (ja) | 銅導体ペースト | |
| JPH0367281B2 (enExample) | ||
| TW202015073A (zh) | 用於氮化矽和其他基板的導電厚膜漿料 | |
| JPH0367283B2 (enExample) | ||
| JPH0368483B2 (enExample) | ||
| JPH0368487B2 (enExample) | ||
| JPH0368486B2 (enExample) | ||
| JPH0572681B2 (enExample) | ||
| JPH10233119A (ja) | 銅導体ペースト及び該銅導体ペーストを印刷した基板 | |
| JP2918642B2 (ja) | 導電ペースト | |
| JPH06342965A (ja) | セラミックス回路基板及びその製造方法 | |
| JP2670679B2 (ja) | メタライズ組成物 |