JPS61245405A - 導電ペ−スト - Google Patents

導電ペ−スト

Info

Publication number
JPS61245405A
JPS61245405A JP60086240A JP8624085A JPS61245405A JP S61245405 A JPS61245405 A JP S61245405A JP 60086240 A JP60086240 A JP 60086240A JP 8624085 A JP8624085 A JP 8624085A JP S61245405 A JPS61245405 A JP S61245405A
Authority
JP
Japan
Prior art keywords
powder
fine
silver
copper
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60086240A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0367283B2 (enExample
Inventor
孝志 荘司
落合　健治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP60086240A priority Critical patent/JPS61245405A/ja
Publication of JPS61245405A publication Critical patent/JPS61245405A/ja
Publication of JPH0367283B2 publication Critical patent/JPH0367283B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP60086240A 1985-04-24 1985-04-24 導電ペ−スト Granted JPS61245405A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60086240A JPS61245405A (ja) 1985-04-24 1985-04-24 導電ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60086240A JPS61245405A (ja) 1985-04-24 1985-04-24 導電ペ−スト

Publications (2)

Publication Number Publication Date
JPS61245405A true JPS61245405A (ja) 1986-10-31
JPH0367283B2 JPH0367283B2 (enExample) 1991-10-22

Family

ID=13881278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60086240A Granted JPS61245405A (ja) 1985-04-24 1985-04-24 導電ペ−スト

Country Status (1)

Country Link
JP (1) JPS61245405A (enExample)

Also Published As

Publication number Publication date
JPH0367283B2 (enExample) 1991-10-22

Similar Documents

Publication Publication Date Title
JPS6254206B2 (enExample)
KR960001353B1 (ko) 다층 전자 회로의 제조방법
US5165986A (en) Copper conductive composition for use on aluminum nitride substrate
JPH0334162B2 (enExample)
CN101309874A (zh) 无铅和无镉的导电铜厚膜膏
CN114334216B (zh) 一种厚膜导体浆料
JP4291146B2 (ja) 銀導体組成物
KR20130113328A (ko) 전자 부품 및 그 제조 방법
US4004057A (en) Gold conductor compositions
US3970590A (en) Gold conductor compositions
JP2822518B2 (ja) 窒化アルミニウム焼結体への金属化層形成方法
JPS6280907A (ja) 導電ペ−スト
CN112673435B (zh) 用于氮化硅和其他基底的导电厚膜浆料
JPS61245405A (ja) 導電ペ−スト
JPH04277406A (ja) 銅導体ペースト
JP2009253196A (ja) 配線基板の製造方法
JPH0367281B2 (enExample)
JPS61245406A (ja) 導電ペ−スト
JPH0368487B2 (enExample)
JPH0572681B2 (enExample)
JPH0368486B2 (enExample)
JP2918642B2 (ja) 導電ペースト
JPH026096A (ja) 金属―セラミックス接合用ろう材ペースト及び電子部品
JPH01107592A (ja) 電気回路基板
JP3134234B2 (ja) メタライズ基板及びその製造方法