JPS6280342U - - Google Patents

Info

Publication number
JPS6280342U
JPS6280342U JP1985170860U JP17086085U JPS6280342U JP S6280342 U JPS6280342 U JP S6280342U JP 1985170860 U JP1985170860 U JP 1985170860U JP 17086085 U JP17086085 U JP 17086085U JP S6280342 U JPS6280342 U JP S6280342U
Authority
JP
Japan
Prior art keywords
lead frame
pad
semiconductor chip
depressions
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985170860U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985170860U priority Critical patent/JPS6280342U/ja
Publication of JPS6280342U publication Critical patent/JPS6280342U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１，２図は夫々本考案のリードフレームのパ
ツド部の平面図と第１図のＡ―Ａ′断面図であり
、第３図はモールドパツケージの説明図である。 １：リードフレーム、２：パツド、３：半導体
チツプ、５：樹脂、６，７：窪み、８：保持リー
ド。

Claims (1)

    【実用新案登録請求の範囲】
  1. プレス加工されたリードフレームにおいて、半
    導体チツプが固着されるパツドの両面に略々全面
    に亘つて深さ方向に傾斜面を有する多数の窪みを
    設けたことを特徴とする樹脂封止用リードフレー
    ム。
JP1985170860U 1985-11-08 1985-11-08 Pending JPS6280342U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985170860U JPS6280342U (ja) 1985-11-08 1985-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985170860U JPS6280342U (ja) 1985-11-08 1985-11-08

Publications (1)

Publication Number Publication Date
JPS6280342U true JPS6280342U (ja) 1987-05-22

Family

ID=31105960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985170860U Pending JPS6280342U (ja) 1985-11-08 1985-11-08

Country Status (1)

Country Link
JP (1) JPS6280342U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4739111B2 (ja) * 2006-05-15 2011-08-03 ローム株式会社 リードフレームの製造方法および製造装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49115653A (ja) * 1973-03-07 1974-11-05
JPS5029415U (ja) * 1973-07-10 1975-04-03
JPS5295173A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Lead frame
JPS5553450A (en) * 1978-10-16 1980-04-18 Hitachi Ltd Semiconductor device with resin enclosure
JPS5525391B2 (ja) * 1972-12-27 1980-07-05
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS5760860A (en) * 1980-09-29 1982-04-13 Nec Corp Semiconductor
JPS58199548A (ja) * 1982-05-17 1983-11-19 Hitachi Ltd リ−ドフレ−ム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525391B2 (ja) * 1972-12-27 1980-07-05
JPS49115653A (ja) * 1973-03-07 1974-11-05
JPS5029415U (ja) * 1973-07-10 1975-04-03
JPS5295173A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Lead frame
JPS5553450A (en) * 1978-10-16 1980-04-18 Hitachi Ltd Semiconductor device with resin enclosure
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS5760860A (en) * 1980-09-29 1982-04-13 Nec Corp Semiconductor
JPS58199548A (ja) * 1982-05-17 1983-11-19 Hitachi Ltd リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4739111B2 (ja) * 2006-05-15 2011-08-03 ローム株式会社 リードフレームの製造方法および製造装置

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