JPS49115653A - - Google Patents

Info

Publication number
JPS49115653A
JPS49115653A JP2615873A JP2615873A JPS49115653A JP S49115653 A JPS49115653 A JP S49115653A JP 2615873 A JP2615873 A JP 2615873A JP 2615873 A JP2615873 A JP 2615873A JP S49115653 A JPS49115653 A JP S49115653A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2615873A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2615873A priority Critical patent/JPS49115653A/ja
Publication of JPS49115653A publication Critical patent/JPS49115653A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2615873A 1973-03-07 1973-03-07 Pending JPS49115653A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2615873A JPS49115653A (ja) 1973-03-07 1973-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2615873A JPS49115653A (ja) 1973-03-07 1973-03-07

Publications (1)

Publication Number Publication Date
JPS49115653A true JPS49115653A (ja) 1974-11-05

Family

ID=12185726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2615873A Pending JPS49115653A (ja) 1973-03-07 1973-03-07

Country Status (1)

Country Link
JP (1) JPS49115653A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197379A (ja) * 1975-02-21 1976-08-26
JPS56109043U (ja) * 1980-01-22 1981-08-24
JPS585347U (ja) * 1981-06-30 1983-01-13 日本電気株式会社 樹脂封止型半導体装置
JPS6280342U (ja) * 1985-11-08 1987-05-22
JPS63119248A (ja) * 1987-10-23 1988-05-23 Hitachi Ltd 半導体装置
JPS63119256U (ja) * 1987-01-29 1988-08-02
JP2011114190A (ja) * 2009-11-27 2011-06-09 Shindengen Electric Mfg Co Ltd 半導体パッケージ
JP2013197145A (ja) * 2012-03-16 2013-09-30 Renesas Electronics Corp 半導体装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197379A (ja) * 1975-02-21 1976-08-26
JPS56109043U (ja) * 1980-01-22 1981-08-24
JPS636673Y2 (ja) * 1980-01-22 1988-02-25
JPS585347U (ja) * 1981-06-30 1983-01-13 日本電気株式会社 樹脂封止型半導体装置
JPS6280342U (ja) * 1985-11-08 1987-05-22
JPS63119256U (ja) * 1987-01-29 1988-08-02
JPS63119248A (ja) * 1987-10-23 1988-05-23 Hitachi Ltd 半導体装置
JPH0526340B2 (ja) * 1987-10-23 1993-04-15 Hitachi Seisakusho Kk
JP2011114190A (ja) * 2009-11-27 2011-06-09 Shindengen Electric Mfg Co Ltd 半導体パッケージ
JP2013197145A (ja) * 2012-03-16 2013-09-30 Renesas Electronics Corp 半導体装置

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