JPS6278145A - 電気絶縁体用セラミツク組成物 - Google Patents

電気絶縁体用セラミツク組成物

Info

Publication number
JPS6278145A
JPS6278145A JP60215761A JP21576185A JPS6278145A JP S6278145 A JPS6278145 A JP S6278145A JP 60215761 A JP60215761 A JP 60215761A JP 21576185 A JP21576185 A JP 21576185A JP S6278145 A JPS6278145 A JP S6278145A
Authority
JP
Japan
Prior art keywords
ceramic
ceramic composition
present
glass
peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60215761A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0324424B2 (enExample
Inventor
幸久 武内
増森　秀夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP60215761A priority Critical patent/JPS6278145A/ja
Priority to US06/911,389 priority patent/US4814304A/en
Publication of JPS6278145A publication Critical patent/JPS6278145A/ja
Publication of JPH0324424B2 publication Critical patent/JPH0324424B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)
JP60215761A 1985-09-28 1985-09-28 電気絶縁体用セラミツク組成物 Granted JPS6278145A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60215761A JPS6278145A (ja) 1985-09-28 1985-09-28 電気絶縁体用セラミツク組成物
US06/911,389 US4814304A (en) 1985-09-28 1986-09-25 Ceramic composition for dielectrics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60215761A JPS6278145A (ja) 1985-09-28 1985-09-28 電気絶縁体用セラミツク組成物

Publications (2)

Publication Number Publication Date
JPS6278145A true JPS6278145A (ja) 1987-04-10
JPH0324424B2 JPH0324424B2 (enExample) 1991-04-03

Family

ID=16677787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60215761A Granted JPS6278145A (ja) 1985-09-28 1985-09-28 電気絶縁体用セラミツク組成物

Country Status (2)

Country Link
US (1) US4814304A (enExample)
JP (1) JPS6278145A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62137897A (ja) * 1985-12-12 1987-06-20 旭硝子株式会社 絶縁層用組成物

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0628201B2 (ja) * 1988-02-18 1994-04-13 住友金属鉱山株式会社 抵抗被膜形成用組成物
JP2723324B2 (ja) * 1990-01-25 1998-03-09 日本特殊陶業株式会社 アルミナ焼結基板
DE69201714T2 (de) * 1991-11-14 1995-10-05 Du Pont Lichtabsorbierende, dielektrische Zusammensetzungen.
US6399230B1 (en) 1997-03-06 2002-06-04 Sarnoff Corporation Multilayer ceramic circuit boards with embedded resistors
US6133177A (en) * 1997-09-26 2000-10-17 Owens Corning Fiberglas Technology, Inc. Process for removing organic impurities while melting mineral compositions
JP4432489B2 (ja) * 2003-12-25 2010-03-17 パナソニック株式会社 静電気対策部品の製造方法
US8034402B2 (en) * 2007-07-27 2011-10-11 Ngk Insulators, Ltd. Method for producing ceramic compact and ceramic part

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221358A (ja) * 1984-04-13 1985-11-06 日本碍子株式会社 電気絶縁体用セラミック組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62137897A (ja) * 1985-12-12 1987-06-20 旭硝子株式会社 絶縁層用組成物

Also Published As

Publication number Publication date
JPH0324424B2 (enExample) 1991-04-03
US4814304A (en) 1989-03-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term