JPS6273750A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6273750A
JPS6273750A JP60213720A JP21372085A JPS6273750A JP S6273750 A JPS6273750 A JP S6273750A JP 60213720 A JP60213720 A JP 60213720A JP 21372085 A JP21372085 A JP 21372085A JP S6273750 A JPS6273750 A JP S6273750A
Authority
JP
Japan
Prior art keywords
external
welding
external terminal
semiconductor device
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60213720A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0461507B2 (cs
Inventor
Naomasa Sugita
尚正 杉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60213720A priority Critical patent/JPS6273750A/ja
Publication of JPS6273750A publication Critical patent/JPS6273750A/ja
Publication of JPH0461507B2 publication Critical patent/JPH0461507B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP60213720A 1985-09-27 1985-09-27 半導体装置 Granted JPS6273750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60213720A JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60213720A JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS6273750A true JPS6273750A (ja) 1987-04-04
JPH0461507B2 JPH0461507B2 (cs) 1992-10-01

Family

ID=16643877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60213720A Granted JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6273750A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251620A (ja) * 1992-03-09 1993-09-28 Mitsubishi Electric Corp 半導体装置
US7848112B2 (en) 2006-12-15 2010-12-07 Mitsubishi Electric Corporation Semiconductor device
JP2012124422A (ja) * 2010-12-10 2012-06-28 Denso Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251620A (ja) * 1992-03-09 1993-09-28 Mitsubishi Electric Corp 半導体装置
US7848112B2 (en) 2006-12-15 2010-12-07 Mitsubishi Electric Corporation Semiconductor device
US8004847B2 (en) 2006-12-15 2011-08-23 Mitsubishi Electric Corporation Semiconductor device
JP2012124422A (ja) * 2010-12-10 2012-06-28 Denso Corp 半導体装置

Also Published As

Publication number Publication date
JPH0461507B2 (cs) 1992-10-01

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