JPS6273648A - 気密ガラス端子 - Google Patents
気密ガラス端子Info
- Publication number
- JPS6273648A JPS6273648A JP21325885A JP21325885A JPS6273648A JP S6273648 A JPS6273648 A JP S6273648A JP 21325885 A JP21325885 A JP 21325885A JP 21325885 A JP21325885 A JP 21325885A JP S6273648 A JPS6273648 A JP S6273648A
- Authority
- JP
- Japan
- Prior art keywords
- iron
- glass
- eyelet
- film
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 46
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910001080 W alloy Inorganic materials 0.000 claims abstract description 13
- 229910052742 iron Inorganic materials 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 25
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 11
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- JHOPGIQVBWUSNH-UHFFFAOYSA-N iron tungsten Chemical compound [Fe].[Fe].[W] JHOPGIQVBWUSNH-UHFFFAOYSA-N 0.000 claims 1
- 229910000531 Co alloy Inorganic materials 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 4
- 150000004706 metal oxides Chemical class 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 abstract description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 235000013980 iron oxide Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 iron plating Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- UVTGXFAWNQTDBG-UHFFFAOYSA-N [Fe].[Pb] Chemical compound [Fe].[Pb] UVTGXFAWNQTDBG-UHFFFAOYSA-N 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21325885A JPS6273648A (ja) | 1985-09-26 | 1985-09-26 | 気密ガラス端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21325885A JPS6273648A (ja) | 1985-09-26 | 1985-09-26 | 気密ガラス端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273648A true JPS6273648A (ja) | 1987-04-04 |
| JPH0455336B2 JPH0455336B2 (enrdf_load_stackoverflow) | 1992-09-03 |
Family
ID=16636116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21325885A Granted JPS6273648A (ja) | 1985-09-26 | 1985-09-26 | 気密ガラス端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273648A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569102A (zh) * | 2011-12-10 | 2012-07-11 | 中国振华集团永光电子有限公司 | 晶体管管座与管脚的气密封装方法及结构 |
| WO2013080396A1 (ja) * | 2011-11-30 | 2013-06-06 | パナソニック株式会社 | 窒化物半導体発光装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4936778A (enrdf_load_stackoverflow) * | 1972-08-10 | 1974-04-05 | ||
| JPS4960682A (enrdf_load_stackoverflow) * | 1972-10-13 | 1974-06-12 | ||
| JPS53136960A (en) * | 1977-05-06 | 1978-11-29 | Toshiba Corp | Manufacture of stem |
| JPS6086878A (ja) * | 1983-10-18 | 1985-05-16 | Sumitomo Electric Ind Ltd | 光素子パツケ−ジ |
-
1985
- 1985-09-26 JP JP21325885A patent/JPS6273648A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4936778A (enrdf_load_stackoverflow) * | 1972-08-10 | 1974-04-05 | ||
| JPS4960682A (enrdf_load_stackoverflow) * | 1972-10-13 | 1974-06-12 | ||
| JPS53136960A (en) * | 1977-05-06 | 1978-11-29 | Toshiba Corp | Manufacture of stem |
| JPS6086878A (ja) * | 1983-10-18 | 1985-05-16 | Sumitomo Electric Ind Ltd | 光素子パツケ−ジ |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013080396A1 (ja) * | 2011-11-30 | 2013-06-06 | パナソニック株式会社 | 窒化物半導体発光装置 |
| CN103907249A (zh) * | 2011-11-30 | 2014-07-02 | 松下电器产业株式会社 | 氮化物半导体发光装置 |
| US20140241388A1 (en) * | 2011-11-30 | 2014-08-28 | Panasonic Corporation | Nitride semiconductor light-emitting system |
| JPWO2013080396A1 (ja) * | 2011-11-30 | 2015-04-27 | パナソニック株式会社 | 窒化物半導体発光装置 |
| US9059569B2 (en) | 2011-11-30 | 2015-06-16 | Panasonic Intellectual Property Management Co., Ltd. | Nitride semiconductor light-emitting system |
| CN102569102A (zh) * | 2011-12-10 | 2012-07-11 | 中国振华集团永光电子有限公司 | 晶体管管座与管脚的气密封装方法及结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455336B2 (enrdf_load_stackoverflow) | 1992-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |