JPS6273648A - 気密ガラス端子 - Google Patents
気密ガラス端子Info
- Publication number
- JPS6273648A JPS6273648A JP60213258A JP21325885A JPS6273648A JP S6273648 A JPS6273648 A JP S6273648A JP 60213258 A JP60213258 A JP 60213258A JP 21325885 A JP21325885 A JP 21325885A JP S6273648 A JPS6273648 A JP S6273648A
- Authority
- JP
- Japan
- Prior art keywords
- iron
- glass
- eyelet
- film
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60213258A JPS6273648A (ja) | 1985-09-26 | 1985-09-26 | 気密ガラス端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60213258A JPS6273648A (ja) | 1985-09-26 | 1985-09-26 | 気密ガラス端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273648A true JPS6273648A (ja) | 1987-04-04 |
| JPH0455336B2 JPH0455336B2 (cs) | 1992-09-03 |
Family
ID=16636116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60213258A Granted JPS6273648A (ja) | 1985-09-26 | 1985-09-26 | 気密ガラス端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273648A (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569102A (zh) * | 2011-12-10 | 2012-07-11 | 中国振华集团永光电子有限公司 | 晶体管管座与管脚的气密封装方法及结构 |
| WO2013080396A1 (ja) * | 2011-11-30 | 2013-06-06 | パナソニック株式会社 | 窒化物半導体発光装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4936778A (cs) * | 1972-08-10 | 1974-04-05 | ||
| JPS4960682A (cs) * | 1972-10-13 | 1974-06-12 | ||
| JPS53136960A (en) * | 1977-05-06 | 1978-11-29 | Toshiba Corp | Manufacture of stem |
| JPS6086878A (ja) * | 1983-10-18 | 1985-05-16 | Sumitomo Electric Ind Ltd | 光素子パツケ−ジ |
-
1985
- 1985-09-26 JP JP60213258A patent/JPS6273648A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4936778A (cs) * | 1972-08-10 | 1974-04-05 | ||
| JPS4960682A (cs) * | 1972-10-13 | 1974-06-12 | ||
| JPS53136960A (en) * | 1977-05-06 | 1978-11-29 | Toshiba Corp | Manufacture of stem |
| JPS6086878A (ja) * | 1983-10-18 | 1985-05-16 | Sumitomo Electric Ind Ltd | 光素子パツケ−ジ |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013080396A1 (ja) * | 2011-11-30 | 2013-06-06 | パナソニック株式会社 | 窒化物半導体発光装置 |
| CN103907249A (zh) * | 2011-11-30 | 2014-07-02 | 松下电器产业株式会社 | 氮化物半导体发光装置 |
| US20140241388A1 (en) * | 2011-11-30 | 2014-08-28 | Panasonic Corporation | Nitride semiconductor light-emitting system |
| JPWO2013080396A1 (ja) * | 2011-11-30 | 2015-04-27 | パナソニック株式会社 | 窒化物半導体発光装置 |
| US9059569B2 (en) | 2011-11-30 | 2015-06-16 | Panasonic Intellectual Property Management Co., Ltd. | Nitride semiconductor light-emitting system |
| CN102569102A (zh) * | 2011-12-10 | 2012-07-11 | 中国振华集团永光电子有限公司 | 晶体管管座与管脚的气密封装方法及结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455336B2 (cs) | 1992-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05508259A (ja) | 改善された電磁障害抵抗を有する金属電子パッケージ | |
| KR930006850B1 (ko) | 반도체장치의 제조방법 | |
| JPS6273648A (ja) | 気密ガラス端子 | |
| US4765528A (en) | Plating process for an electronic part | |
| JPS58175852A (ja) | 半導体装置 | |
| JP2001326002A (ja) | 気密端子 | |
| JPS5916353A (ja) | リ−ドフレ−ム | |
| JP3269420B2 (ja) | 気密端子およびその製造方法 | |
| JPH02144864A (ja) | 気密端子の製造方法 | |
| KR830000962B1 (ko) | 기밀단자(氣密端子) | |
| JPS6041860B2 (ja) | 気密端子の製造方法 | |
| JPS6032774Y2 (ja) | 半導体装置用ステム | |
| JPS58100967A (ja) | 金属部品の製造方法 | |
| JPH107441A (ja) | 金属ガラス接合体 | |
| JPS637653A (ja) | 半導体用気密封止金属パツケ−ジ | |
| JPS63284716A (ja) | ジユメツト線 | |
| JPS601853A (ja) | 半導体用リ−ドフレ−ム | |
| JPS5837952B2 (ja) | 気密端子の製造方法 | |
| JPS60195953A (ja) | 半導体装置およびその製造方法 | |
| JPS637655A (ja) | 半導体用気密封止金属パッケージの製造方法 | |
| JPH0458127B2 (cs) | ||
| JPS6314897A (ja) | 気密ガラス端子のめつき方法 | |
| JPS60236251A (ja) | 半導体装置用パツケ−ジ | |
| JPH02116101A (ja) | サーミスタ | |
| JPS60195952A (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |