JPS6271215A - ウエハ接合装置 - Google Patents

ウエハ接合装置

Info

Publication number
JPS6271215A
JPS6271215A JP21143885A JP21143885A JPS6271215A JP S6271215 A JPS6271215 A JP S6271215A JP 21143885 A JP21143885 A JP 21143885A JP 21143885 A JP21143885 A JP 21143885A JP S6271215 A JPS6271215 A JP S6271215A
Authority
JP
Japan
Prior art keywords
wafer
wafers
bonding apparatus
vacuum
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21143885A
Other languages
English (en)
Japanese (ja)
Other versions
JPH044743B2 (en:Method
Inventor
Kiyoshi Yoshikawa
吉川　清
Tomio Minohoshi
蓑星　富夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP21143885A priority Critical patent/JPS6271215A/ja
Publication of JPS6271215A publication Critical patent/JPS6271215A/ja
Publication of JPH044743B2 publication Critical patent/JPH044743B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Recrystallisation Techniques (AREA)
JP21143885A 1985-09-25 1985-09-25 ウエハ接合装置 Granted JPS6271215A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21143885A JPS6271215A (ja) 1985-09-25 1985-09-25 ウエハ接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21143885A JPS6271215A (ja) 1985-09-25 1985-09-25 ウエハ接合装置

Publications (2)

Publication Number Publication Date
JPS6271215A true JPS6271215A (ja) 1987-04-01
JPH044743B2 JPH044743B2 (en:Method) 1992-01-29

Family

ID=16605954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21143885A Granted JPS6271215A (ja) 1985-09-25 1985-09-25 ウエハ接合装置

Country Status (1)

Country Link
JP (1) JPS6271215A (en:Method)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01169917A (ja) * 1987-12-24 1989-07-05 Fujitsu Ltd ウェーハの接着方法
US5131968A (en) * 1990-07-31 1992-07-21 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
US5273553A (en) * 1989-08-28 1993-12-28 Kabushiki Kaisha Toshiba Apparatus for bonding semiconductor substrates
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
US5314107A (en) * 1992-12-31 1994-05-24 Motorola, Inc. Automated method for joining wafers
US5478782A (en) * 1992-05-25 1995-12-26 Sony Corporation Method bonding for production of SOI transistor device
US5964978A (en) * 1997-03-31 1999-10-12 Shin-Etsu Handotai Co., Ltd. Method and apparatus for adhesion of semiconductor substrate
USRE36890E (en) * 1990-07-31 2000-10-03 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
WO2007127825A3 (en) * 2006-04-28 2008-04-10 Hewlett Packard Development Co Fabrication tool for bonding
JP2010087278A (ja) * 2008-09-30 2010-04-15 Mitsubishi Heavy Ind Ltd ウェハ接合装置およびウェハ接合方法
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US10800141B2 (en) 2016-09-23 2020-10-13 Apple Inc. Electronic device having a glass component with crack hindering internal stress regions
US11066322B2 (en) 2017-12-01 2021-07-20 Apple Inc. Selectively heat-treated glass-ceramic for an electronic device
US11419231B1 (en) 2016-09-22 2022-08-16 Apple Inc. Forming glass covers for electronic devices
US11420900B2 (en) 2018-09-26 2022-08-23 Apple Inc. Localized control of bulk material properties
US11460892B2 (en) 2020-03-28 2022-10-04 Apple Inc. Glass cover member for an electronic device enclosure
US11535551B2 (en) 2016-09-23 2022-12-27 Apple Inc. Thermoformed cover glass for an electronic device
US11565506B2 (en) 2016-09-23 2023-01-31 Apple Inc. Thermoformed cover glass for an electronic device
US11666273B2 (en) 2020-05-20 2023-06-06 Apple Inc. Electronic device enclosure including a glass ceramic region
US11680010B2 (en) 2019-07-09 2023-06-20 Apple Inc. Evaluation of transparent components for electronic devices
US11927988B2 (en) 2020-03-28 2024-03-12 Apple Inc. Glass cover member for an electronic device enclosure
US11945048B2 (en) 2020-12-23 2024-04-02 Apple Inc. Laser-based cutting of transparent components for an electronic device
US12065372B2 (en) 2020-12-17 2024-08-20 Apple Inc. Fluid forming a glass component for a portable electronic device
US12195379B2 (en) 2020-12-17 2025-01-14 Apple Inc. Forming and bonding of glass components for portable electronic devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116734A (ja) * 1981-12-29 1983-07-12 Canon Inc 露光装置
JPS61145839A (ja) * 1984-12-20 1986-07-03 Toshiba Corp 半導体ウエ−ハの接着方法および接着治具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116734A (ja) * 1981-12-29 1983-07-12 Canon Inc 露光装置
JPS61145839A (ja) * 1984-12-20 1986-07-03 Toshiba Corp 半導体ウエ−ハの接着方法および接着治具

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01169917A (ja) * 1987-12-24 1989-07-05 Fujitsu Ltd ウェーハの接着方法
US5273553A (en) * 1989-08-28 1993-12-28 Kabushiki Kaisha Toshiba Apparatus for bonding semiconductor substrates
USRE36890E (en) * 1990-07-31 2000-10-03 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
US5131968A (en) * 1990-07-31 1992-07-21 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
US5478782A (en) * 1992-05-25 1995-12-26 Sony Corporation Method bonding for production of SOI transistor device
US5523254A (en) * 1992-05-25 1996-06-04 Sony Corporation Method for production of SOI transistor device and SOI transistor
US5314107A (en) * 1992-12-31 1994-05-24 Motorola, Inc. Automated method for joining wafers
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
US5964978A (en) * 1997-03-31 1999-10-12 Shin-Etsu Handotai Co., Ltd. Method and apparatus for adhesion of semiconductor substrate
WO2007127825A3 (en) * 2006-04-28 2008-04-10 Hewlett Packard Development Co Fabrication tool for bonding
JP2009535823A (ja) * 2006-04-28 2009-10-01 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． 接合用の製造ツール
US7866364B2 (en) 2006-04-28 2011-01-11 Hewlett-Packard Development Company, L.P. Fabrication tool for bonding
JP2010087278A (ja) * 2008-09-30 2010-04-15 Mitsubishi Heavy Ind Ltd ウェハ接合装置およびウェハ接合方法
US9130000B2 (en) 2008-09-30 2015-09-08 Mitsubishi Heavy Industries Wafer bonding device and wafer bonding method
US8389385B2 (en) 2009-02-04 2013-03-05 Micron Technology, Inc. Semiconductor material manufacture
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US11419231B1 (en) 2016-09-22 2022-08-16 Apple Inc. Forming glass covers for electronic devices
US11535551B2 (en) 2016-09-23 2022-12-27 Apple Inc. Thermoformed cover glass for an electronic device
US10800141B2 (en) 2016-09-23 2020-10-13 Apple Inc. Electronic device having a glass component with crack hindering internal stress regions
US11565506B2 (en) 2016-09-23 2023-01-31 Apple Inc. Thermoformed cover glass for an electronic device
US11066322B2 (en) 2017-12-01 2021-07-20 Apple Inc. Selectively heat-treated glass-ceramic for an electronic device
US11420900B2 (en) 2018-09-26 2022-08-23 Apple Inc. Localized control of bulk material properties
US11680010B2 (en) 2019-07-09 2023-06-20 Apple Inc. Evaluation of transparent components for electronic devices
US11460892B2 (en) 2020-03-28 2022-10-04 Apple Inc. Glass cover member for an electronic device enclosure
US11927988B2 (en) 2020-03-28 2024-03-12 Apple Inc. Glass cover member for an electronic device enclosure
US11666273B2 (en) 2020-05-20 2023-06-06 Apple Inc. Electronic device enclosure including a glass ceramic region
US12065372B2 (en) 2020-12-17 2024-08-20 Apple Inc. Fluid forming a glass component for a portable electronic device
US12195379B2 (en) 2020-12-17 2025-01-14 Apple Inc. Forming and bonding of glass components for portable electronic devices
US11945048B2 (en) 2020-12-23 2024-04-02 Apple Inc. Laser-based cutting of transparent components for an electronic device

Also Published As

Publication number Publication date
JPH044743B2 (en:Method) 1992-01-29

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