JPS6270540A - 半導体装置用Ｃｕ合金リ−ド素材 - Google Patents

半導体装置用Ｃｕ合金リ−ド素材

Info

Publication number
JPS6270540A
JPS6270540A JP20809585A JP20809585A JPS6270540A JP S6270540 A JPS6270540 A JP S6270540A JP 20809585 A JP20809585 A JP 20809585A JP 20809585 A JP20809585 A JP 20809585A JP S6270540 A JPS6270540 A JP S6270540A
Authority
JP
Japan
Prior art keywords
less
grain size
average grain
following
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20809585A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6338412B2 (enrdf_load_stackoverflow
Inventor
Hidetoshi Akutsu
阿久津　英俊
Takuro Iwamura
岩村　卓郎
Masao Kobayashi
正男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP20809585A priority Critical patent/JPS6270540A/ja
Priority to US06/903,514 priority patent/US4749548A/en
Priority to GB8621958A priority patent/GB2181742B/en
Priority to DE19863631119 priority patent/DE3631119A1/de
Publication of JPS6270540A publication Critical patent/JPS6270540A/ja
Priority to US07/166,217 priority patent/US4872048A/en
Publication of JPS6338412B2 publication Critical patent/JPS6338412B2/ja
Priority to GB8907058A priority patent/GB2219473B/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP20809585A 1985-09-13 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材 Granted JPS6270540A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP20809585A JPS6270540A (ja) 1985-09-20 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材
US06/903,514 US4749548A (en) 1985-09-13 1986-09-03 Copper alloy lead material for use in semiconductor device
GB8621958A GB2181742B (en) 1985-09-13 1986-09-11 Copper alloy lead material for use in semiconductor device
DE19863631119 DE3631119A1 (de) 1985-09-13 1986-09-12 Leitermaterial auf basis von kupferlegierungen zur anwendung fuer halbleitervorrichtungen
US07/166,217 US4872048A (en) 1985-09-13 1988-03-10 Semiconductor device having copper alloy leads
GB8907058A GB2219473B (en) 1985-09-13 1989-03-29 Copper alloy lead material for use in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20809585A JPS6270540A (ja) 1985-09-20 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPS6270540A true JPS6270540A (ja) 1987-04-01
JPS6338412B2 JPS6338412B2 (enrdf_load_stackoverflow) 1988-07-29

Family

ID=16550552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20809585A Granted JPS6270540A (ja) 1985-09-13 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材

Country Status (1)

Country Link
JP (1) JPS6270540A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299431A (ja) * 1985-10-24 1987-05-08 Mitsubishi Electric Corp 半導体装置用リードフレーム材
JPS62130247A (ja) * 1985-11-29 1987-06-12 Furukawa Electric Co Ltd:The 電子機器用銅合金
JPS63171841A (ja) * 1988-01-11 1988-07-15 Furukawa Electric Co Ltd:The 電子機器用銅合金
JPH01306534A (ja) * 1988-05-31 1989-12-11 Yazaki Corp 細線用銅合金導体
JPH01312047A (ja) * 1988-06-13 1989-12-15 Yazaki Corp 高力高導電性銅合金の製造方法
WO1991019320A1 (en) * 1990-05-31 1991-12-12 Kabushiki Kaisha Toshiba Lead frame and semiconductor package using it
JPH04136819U (ja) * 1991-03-29 1992-12-21 タツタ電線株式会社 耐油・耐薬品・耐摩耗・耐屈曲・可撓性ケーブル
WO2004070070A1 (ja) * 2003-02-05 2004-08-19 Sumitomo Metal Industries, Ltd. Cu合金およびその製造方法
WO2012111567A1 (ja) * 2011-02-18 2012-08-23 三菱伸銅株式会社 Ｃｕ－Ｚｒ系銅合金板及びその製造方法
CN111663062A (zh) * 2020-05-22 2020-09-15 陕西斯瑞新材料股份有限公司 一种利用热等静压近净成型制备Cu-Cr-Mg-Zr-Ce高性能端环的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319136A (en) * 1976-08-06 1978-02-22 Kabel Metallwerke Ghh Method of using copper alloy as mold material for continuous casting
JPS5620136A (en) * 1979-07-30 1981-02-25 Toshiba Corp Copper alloy member
JPS56102537A (en) * 1980-01-16 1981-08-17 Toshiba Corp Copper alloy member
JPS59193233A (ja) * 1983-04-15 1984-11-01 Toshiba Corp 銅合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319136A (en) * 1976-08-06 1978-02-22 Kabel Metallwerke Ghh Method of using copper alloy as mold material for continuous casting
JPS5620136A (en) * 1979-07-30 1981-02-25 Toshiba Corp Copper alloy member
JPS56102537A (en) * 1980-01-16 1981-08-17 Toshiba Corp Copper alloy member
JPS59193233A (ja) * 1983-04-15 1984-11-01 Toshiba Corp 銅合金

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299431A (ja) * 1985-10-24 1987-05-08 Mitsubishi Electric Corp 半導体装置用リードフレーム材
JPS62130247A (ja) * 1985-11-29 1987-06-12 Furukawa Electric Co Ltd:The 電子機器用銅合金
JPS63171841A (ja) * 1988-01-11 1988-07-15 Furukawa Electric Co Ltd:The 電子機器用銅合金
JPH01306534A (ja) * 1988-05-31 1989-12-11 Yazaki Corp 細線用銅合金導体
JPH01312047A (ja) * 1988-06-13 1989-12-15 Yazaki Corp 高力高導電性銅合金の製造方法
WO1991019320A1 (en) * 1990-05-31 1991-12-12 Kabushiki Kaisha Toshiba Lead frame and semiconductor package using it
JPH04136819U (ja) * 1991-03-29 1992-12-21 タツタ電線株式会社 耐油・耐薬品・耐摩耗・耐屈曲・可撓性ケーブル
WO2004070070A1 (ja) * 2003-02-05 2004-08-19 Sumitomo Metal Industries, Ltd. Cu合金およびその製造方法
WO2012111567A1 (ja) * 2011-02-18 2012-08-23 三菱伸銅株式会社 Ｃｕ－Ｚｒ系銅合金板及びその製造方法
JP2012172168A (ja) * 2011-02-18 2012-09-10 Mitsubishi Shindoh Co Ltd Ｃｕ−Ｚｒ系銅合金板及びその製造方法
US9644251B2 (en) 2011-02-18 2017-05-09 Mitsubishi Shindoh Co., Ltd. Cu—Zr-based copper alloy plate and process for manufacturing same
CN111663062A (zh) * 2020-05-22 2020-09-15 陕西斯瑞新材料股份有限公司 一种利用热等静压近净成型制备Cu-Cr-Mg-Zr-Ce高性能端环的方法

Also Published As

Publication number Publication date
JPS6338412B2 (enrdf_load_stackoverflow) 1988-07-29

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