JPS626652B2 - - Google Patents

Info

Publication number
JPS626652B2
JPS626652B2 JP59227510A JP22751084A JPS626652B2 JP S626652 B2 JPS626652 B2 JP S626652B2 JP 59227510 A JP59227510 A JP 59227510A JP 22751084 A JP22751084 A JP 22751084A JP S626652 B2 JPS626652 B2 JP S626652B2
Authority
JP
Japan
Prior art keywords
adhesive
conductive
pad
semiconductor chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59227510A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60180132A (ja
Inventor
Yoshio Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP59227510A priority Critical patent/JPS60180132A/ja
Publication of JPS60180132A publication Critical patent/JPS60180132A/ja
Publication of JPS626652B2 publication Critical patent/JPS626652B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W72/07331—
    • H10W72/325—
    • H10W72/351—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP59227510A 1984-10-29 1984-10-29 半導体チツプの接続構造 Granted JPS60180132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227510A JPS60180132A (ja) 1984-10-29 1984-10-29 半導体チツプの接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227510A JPS60180132A (ja) 1984-10-29 1984-10-29 半導体チツプの接続構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP50026333A Division JPS592179B2 (ja) 1975-03-03 1975-03-03 電気的部材の製造方法

Publications (2)

Publication Number Publication Date
JPS60180132A JPS60180132A (ja) 1985-09-13
JPS626652B2 true JPS626652B2 (cg-RX-API-DMAC10.html) 1987-02-12

Family

ID=16862028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227510A Granted JPS60180132A (ja) 1984-10-29 1984-10-29 半導体チツプの接続構造

Country Status (1)

Country Link
JP (1) JPS60180132A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
TW344043B (en) * 1994-10-21 1998-11-01 Hitachi Ltd Liquid crystal display device with reduced frame portion surrounding display area
JPH11167154A (ja) 1997-12-03 1999-06-22 Olympus Optical Co Ltd フレキシブルプリント基板
JPH11167151A (ja) 1997-12-03 1999-06-22 Olympus Optical Co Ltd フレキシブルプリント基板を備えるカメラ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (ja) * 1974-08-14 1976-02-19 Seikosha Kk Dodenseisetsuchakuzai

Also Published As

Publication number Publication date
JPS60180132A (ja) 1985-09-13

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