JPS60180132A - 半導体チツプの接続構造 - Google Patents

半導体チツプの接続構造

Info

Publication number
JPS60180132A
JPS60180132A JP59227510A JP22751084A JPS60180132A JP S60180132 A JPS60180132 A JP S60180132A JP 59227510 A JP59227510 A JP 59227510A JP 22751084 A JP22751084 A JP 22751084A JP S60180132 A JPS60180132 A JP S60180132A
Authority
JP
Japan
Prior art keywords
conductive
chip
adhesive
pad
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59227510A
Other languages
English (en)
Japanese (ja)
Other versions
JPS626652B2 (cg-RX-API-DMAC10.html
Inventor
Yoshio Yamazaki
山崎　淑夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP59227510A priority Critical patent/JPS60180132A/ja
Publication of JPS60180132A publication Critical patent/JPS60180132A/ja
Publication of JPS626652B2 publication Critical patent/JPS626652B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W72/07331—
    • H10W72/325—
    • H10W72/351—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP59227510A 1984-10-29 1984-10-29 半導体チツプの接続構造 Granted JPS60180132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227510A JPS60180132A (ja) 1984-10-29 1984-10-29 半導体チツプの接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227510A JPS60180132A (ja) 1984-10-29 1984-10-29 半導体チツプの接続構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP50026333A Division JPS592179B2 (ja) 1975-03-03 1975-03-03 電気的部材の製造方法

Publications (2)

Publication Number Publication Date
JPS60180132A true JPS60180132A (ja) 1985-09-13
JPS626652B2 JPS626652B2 (cg-RX-API-DMAC10.html) 1987-02-12

Family

ID=16862028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227510A Granted JPS60180132A (ja) 1984-10-29 1984-10-29 半導体チツプの接続構造

Country Status (1)

Country Link
JP (1) JPS60180132A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329207A (ja) * 1988-12-05 1991-02-07 Hitachi Chem Co Ltd 回路接続用組成物及びこれを用いた接続方法並びに半導体チップの接続構造
US5739887A (en) * 1994-10-21 1998-04-14 Hitachi, Ltd. Liquid crystal display device with reduced frame portion surrounding display area
US6229223B1 (en) 1997-12-03 2001-05-08 Olympus Optical Co., Ltd. Flexible printed board
US6311023B1 (en) 1997-12-03 2001-10-30 Olympus Optical Co., Ltd. Camera having a light-shieldable member for protecting a semiconductor element flip-chip-bonded on a flexible printed board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (ja) * 1974-08-14 1976-02-19 Seikosha Kk Dodenseisetsuchakuzai

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120941A (ja) * 1974-08-14 1976-02-19 Seikosha Kk Dodenseisetsuchakuzai

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329207A (ja) * 1988-12-05 1991-02-07 Hitachi Chem Co Ltd 回路接続用組成物及びこれを用いた接続方法並びに半導体チップの接続構造
US5739887A (en) * 1994-10-21 1998-04-14 Hitachi, Ltd. Liquid crystal display device with reduced frame portion surrounding display area
US6229223B1 (en) 1997-12-03 2001-05-08 Olympus Optical Co., Ltd. Flexible printed board
US6311023B1 (en) 1997-12-03 2001-10-30 Olympus Optical Co., Ltd. Camera having a light-shieldable member for protecting a semiconductor element flip-chip-bonded on a flexible printed board

Also Published As

Publication number Publication date
JPS626652B2 (cg-RX-API-DMAC10.html) 1987-02-12

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