JPS6259888B2 - - Google Patents

Info

Publication number
JPS6259888B2
JPS6259888B2 JP57176524A JP17652482A JPS6259888B2 JP S6259888 B2 JPS6259888 B2 JP S6259888B2 JP 57176524 A JP57176524 A JP 57176524A JP 17652482 A JP17652482 A JP 17652482A JP S6259888 B2 JPS6259888 B2 JP S6259888B2
Authority
JP
Japan
Prior art keywords
flip chip
thermal conductivity
heat dissipation
heat sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57176524A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5965457A (ja
Inventor
Masanobu Obara
Hiroshi Shibata
Shin Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57176524A priority Critical patent/JPS5965457A/ja
Priority to US06/534,840 priority patent/US4561011A/en
Publication of JPS5965457A publication Critical patent/JPS5965457A/ja
Priority to US06/783,537 priority patent/US4654966A/en
Publication of JPS6259888B2 publication Critical patent/JPS6259888B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/233—Arrangements for cooling characterised by their places of attachment or cooling paths attached to chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57176524A 1982-10-05 1982-10-05 半導体装置 Granted JPS5965457A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP57176524A JPS5965457A (ja) 1982-10-05 1982-10-05 半導体装置
US06/534,840 US4561011A (en) 1982-10-05 1983-09-22 Dimensionally stable semiconductor device
US06/783,537 US4654966A (en) 1982-10-05 1985-10-03 Method of making a dimensionally stable semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57176524A JPS5965457A (ja) 1982-10-05 1982-10-05 半導体装置

Publications (2)

Publication Number Publication Date
JPS5965457A JPS5965457A (ja) 1984-04-13
JPS6259888B2 true JPS6259888B2 (enExample) 1987-12-14

Family

ID=16015117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57176524A Granted JPS5965457A (ja) 1982-10-05 1982-10-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS5965457A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2611671B2 (ja) 1994-07-26 1997-05-21 日本電気株式会社 半導体装置
US5886408A (en) * 1994-09-08 1999-03-23 Fujitsu Limited Multi-chip semiconductor device
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US5898571A (en) * 1997-04-28 1999-04-27 Lsi Logic Corporation Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US7382620B2 (en) * 2005-10-13 2008-06-03 International Business Machines Corporation Method and apparatus for optimizing heat transfer with electronic components
US8486758B2 (en) * 2010-12-20 2013-07-16 Tessera, Inc. Simultaneous wafer bonding and interconnect joining
US10269688B2 (en) * 2013-03-14 2019-04-23 General Electric Company Power overlay structure and method of making same

Also Published As

Publication number Publication date
JPS5965457A (ja) 1984-04-13

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