JPS5965457A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5965457A
JPS5965457A JP57176524A JP17652482A JPS5965457A JP S5965457 A JPS5965457 A JP S5965457A JP 57176524 A JP57176524 A JP 57176524A JP 17652482 A JP17652482 A JP 17652482A JP S5965457 A JPS5965457 A JP S5965457A
Authority
JP
Japan
Prior art keywords
heat
flip chip
heat sink
chip
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57176524A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6259888B2 (enExample
Inventor
Masanobu Obara
小原　雅信
Hiroshi Shibata
浩 柴田
Shin Nakao
中尾　伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57176524A priority Critical patent/JPS5965457A/ja
Priority to US06/534,840 priority patent/US4561011A/en
Publication of JPS5965457A publication Critical patent/JPS5965457A/ja
Priority to US06/783,537 priority patent/US4654966A/en
Publication of JPS6259888B2 publication Critical patent/JPS6259888B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/233—Arrangements for cooling characterised by their places of attachment or cooling paths attached to chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57176524A 1982-10-05 1982-10-05 半導体装置 Granted JPS5965457A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP57176524A JPS5965457A (ja) 1982-10-05 1982-10-05 半導体装置
US06/534,840 US4561011A (en) 1982-10-05 1983-09-22 Dimensionally stable semiconductor device
US06/783,537 US4654966A (en) 1982-10-05 1985-10-03 Method of making a dimensionally stable semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57176524A JPS5965457A (ja) 1982-10-05 1982-10-05 半導体装置

Publications (2)

Publication Number Publication Date
JPS5965457A true JPS5965457A (ja) 1984-04-13
JPS6259888B2 JPS6259888B2 (enExample) 1987-12-14

Family

ID=16015117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57176524A Granted JPS5965457A (ja) 1982-10-05 1982-10-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS5965457A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0694968A2 (en) 1994-07-26 1996-01-31 Nec Corporation Multi-chip module semiconductor device
US5886408A (en) * 1994-09-08 1999-03-23 Fujitsu Limited Multi-chip semiconductor device
US5898571A (en) * 1997-04-28 1999-04-27 Lsi Logic Corporation Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
JP2007110115A (ja) * 2005-10-13 2007-04-26 Internatl Business Mach Corp <Ibm> 電子部品による熱伝達を最適化するための方法および装置
US20120153488A1 (en) * 2010-12-20 2012-06-21 Tessera Research Llc Simultaneous wafer bonding and interconnect joining
JP2018152591A (ja) * 2013-03-14 2018-09-27 ゼネラル・エレクトリック・カンパニイ パワーオーバーレイ構造およびその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0694968A2 (en) 1994-07-26 1996-01-31 Nec Corporation Multi-chip module semiconductor device
US5886408A (en) * 1994-09-08 1999-03-23 Fujitsu Limited Multi-chip semiconductor device
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US5898571A (en) * 1997-04-28 1999-04-27 Lsi Logic Corporation Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
JP2007110115A (ja) * 2005-10-13 2007-04-26 Internatl Business Mach Corp <Ibm> 電子部品による熱伝達を最適化するための方法および装置
US20120153488A1 (en) * 2010-12-20 2012-06-21 Tessera Research Llc Simultaneous wafer bonding and interconnect joining
US8486758B2 (en) * 2010-12-20 2013-07-16 Tessera, Inc. Simultaneous wafer bonding and interconnect joining
JP2018152591A (ja) * 2013-03-14 2018-09-27 ゼネラル・エレクトリック・カンパニイ パワーオーバーレイ構造およびその製造方法

Also Published As

Publication number Publication date
JPS6259888B2 (enExample) 1987-12-14

Similar Documents

Publication Publication Date Title
US4654966A (en) Method of making a dimensionally stable semiconductor device
US5430611A (en) Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5455457A (en) Package for semiconductor elements having thermal dissipation means
JP2001053205A (ja) マルチチップモジュールの封止冷却装置
GB1569453A (en) Circuit packages and methods for making circuits packages
JPH01295450A (ja) モジュール封止方法
JPH06196598A (ja) 半導体チップの実装構造
US5257162A (en) Bellows lid for c4 flip-chip package
JPS5965457A (ja) 半導体装置
GB2032188A (en) All metal flat package for microcircuits
JP2853666B2 (ja) マルチチップモジュール
US4897764A (en) Conductive cooling cup module
JPH0491458A (ja) 半導体装置
JPH11121662A (ja) 半導体装置の冷却構造
JP3653417B2 (ja) マルチチップモジュールの封止構造
JPH0487354A (ja) 半導体装置
US7236367B2 (en) Power electronics component
JPS6259887B2 (enExample)
JPH046860A (ja) 半導体装置
JPS5931046A (ja) 半導体装置
JP2531125B2 (ja) Ｉｃチップキャリアモジュ―ル
JPS59231841A (ja) 半導体装置
JP3036484B2 (ja) 半導体装置とその製造方法
JP2619155B2 (ja) 混成集積回路装置
JPS62281452A (ja) 半導体モジユ−ル