JPS6258148B2 - - Google Patents
Info
- Publication number
- JPS6258148B2 JPS6258148B2 JP57104349A JP10434982A JPS6258148B2 JP S6258148 B2 JPS6258148 B2 JP S6258148B2 JP 57104349 A JP57104349 A JP 57104349A JP 10434982 A JP10434982 A JP 10434982A JP S6258148 B2 JPS6258148 B2 JP S6258148B2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- die
- conveyor
- trays
- wafer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/0612—
-
- H10P72/3411—
-
- H10P72/50—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104349A JPS58220441A (ja) | 1982-06-17 | 1982-06-17 | ダイ詰め換え装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104349A JPS58220441A (ja) | 1982-06-17 | 1982-06-17 | ダイ詰め換え装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58220441A JPS58220441A (ja) | 1983-12-22 |
| JPS6258148B2 true JPS6258148B2 (show.php) | 1987-12-04 |
Family
ID=14378404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57104349A Granted JPS58220441A (ja) | 1982-06-17 | 1982-06-17 | ダイ詰め換え装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58220441A (show.php) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2589100B2 (ja) * | 1987-10-06 | 1997-03-12 | ローム 株式会社 | チップボンディング装置 |
| JP2520508Y2 (ja) * | 1989-07-28 | 1996-12-18 | ニチデン機械株式会社 | 部品整列装置 |
-
1982
- 1982-06-17 JP JP57104349A patent/JPS58220441A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58220441A (ja) | 1983-12-22 |
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